AMD XC5VLX50-1FFG324I

Overview

XC5VLX50-1FFG324I from AMD (formerly Xilinx) is a Virtex-5 FPGA with 46,080 logic cells, 2.5 Gbps serial transceivers, and 256 KB block RAM. It features 324-pin Fine-Pitch Flip-Chip BGA (FFG) packaging, -1 speed grade, and industrial temperature range (-40°C to +100°C). Used in high-speed protocol bridging and reconfigurable signal processing.

For engineers reviewing the XC5VLX50-1FFG324I datasheet, pinout, applications, or equivalent options, key selection factors include transceiver line rate, logic density, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V/3.3 V), and thermal performance in compact PCB layouts.

Technical Context

The XC5VLX50-1FFG324I implements a hierarchical FPGA architecture with six distinct logic tile types, including configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive tasks, and integrated PCI Express® Endpoint blocks. It supports multi-gigabit transceivers compliant with SATA, SAS, and 1G/10G Ethernet protocols.

Configuration is performed via Master SelectMAP or JTAG, with bitstream encryption using AES-256 and HMAC-SHA-256 authentication. The device supports partial reconfiguration and dynamic power management through multiple I/O bank voltage domains and per-bank termination control.

Key Specifications

Pinout & Package

XC5VLX50-1FFG324I uses a 324-pin Fine-Pitch Flip-Chip BGA (FFG) package with 1.0 mm ball pitch, 19×19 array, and thermal pad center. Package dimensions are 19 mm × 19 mm × 1.57 mm (height).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.

Compared with XC5VLX50-1FFG324I, the XC5VLX30-1FFG324I reduces logic and DSP resources while maintaining pin compatibility, whereas the XC6VLX240T-1FFG1156I expands both capacity and speed but requires PCB redesign due to different package and I/O mapping.

Availability

XC5VLX50-1FFG324I is available at Aetrix Electronics and suitable for industrial automation, test equipment, and wireless infrastructure applications requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX50-1FFG324I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family. AMD is a global semiconductor leader focused on adaptive computing, AI acceleration, and high-performance programmable logic.

The Virtex-5 family was designed for high-bandwidth, compute-intensive applications including protocol processing, signal intelligence, and real-time video analytics-prioritizing transceiver performance, logic density, and power efficiency in industrial and telecom environments.

FAQ

What is the maximum supported transceiver line rate for XC5VLX50-1FFG324I?

The XC5VLX50-1FFG324I supports a maximum transceiver line rate of 2.5 Gbps per channel. This enables compliance with PCIe Gen1, SATA II, and 1G Ethernet physical layers. All 12 GTP transceivers on the XC5VLX50-1FFG324I operate within this specification under industrial temperature conditions and -1 speed grade timing constraints.

Does XC5VLX50-1FFG324I support partial reconfiguration?

Yes, XC5VLX50-1FFG324I supports hardware-accelerated partial reconfiguration. This capability allows dynamic replacement of logic modules during operation without resetting the entire device. The feature is implemented via dedicated configuration access ports and frame-based bitstream addressing, enabling runtime adaptation in protocol gateways and software-defined radios using XC5VLX50-1FFG324I.

What I/O standards are supported by XC5VLX50-1FFG324I?

XC5VLX50-1FFG324I supports LVCMOS, LVTTL, SSTL, HSTL, and differential LVDS across its 240 user I/O pins. Each of the 12 I/O banks can be independently configured for 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V VCCO, enabling mixed-voltage system interfacing. These standards are verified in the XC5VLX50-1FFG324I datasheet and supported in Vivado-compatible toolchains.

Is XC5VLX50-1FFG324I qualified for industrial temperature operation?

Yes, XC5VLX50-1FFG324I is rated for industrial temperature operation from -40°C to +100°C. This qualification is defined by the "I" suffix in the part number and confirmed in AMD's Virtex-5 DC and Switching Characteristics documentation. Thermal design must account for 1.0 V core voltage regulation and package thermal resistance (θJA = 22.5°C/W) when deployed in sealed enclosures.

How many DSP48E slices does XC5VLX50-1FFG324I contain?

XC5VLX50-1FFG324I contains 64 DSP48E slices. Each slice performs 25×18-bit signed multiplication with optional pre-adder, accumulator, and pipeline registers. These resources are distributed across the FPGA fabric and are accessible via HDL synthesis or CORE Generator tools targeting the XC5VLX50-1FFG324I device.