AMD XC5VLX50-2FF1153I
- Part No.:
- XC5VLX50-2FF1153I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX50-2FF1153I.pdf
- Description:
- IC FPGA 560 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX50-2FF1153I from AMD (formerly Xilinx) is a Virtex-5 FPGA with 47,680 logic cells, 2.5 Gbps serial transceivers, and 512 KB block RAM, configured in a 1153-pin Flip-Chip Fine-Pitch BGA package for high-speed interface consolidation in telecom line cards.
For engineers reviewing the XC5VLX50-2FF1153I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing performance, transceiver lane count (12 lanes), and thermal design power (12.3 W at typical operation).
Technical Context
The XC5VLX50-2FF1153I implements a hierarchical FPGA architecture with six distinct logic tile types-including SLICEM (with embedded memory and DSP48E slices), SLICEL (logic-only), and dedicated clock routing-enabling deterministic timing closure in multi-clock domain designs. It supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling up to 1.25 Gbps per pin.
Its 12 RocketIO GTP transceivers operate at 100 Mbps to 2.5 Gbps with built-in 8B/10B encoding, PRBS generation/checking, and elastic buffer support, targeting Serial RapidIO, PCI Express Gen1, and CPRI physical layer implementations without external PHYs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 47,680 - provides gate count equivalent to ~250K ASIC gates for complex digital control and packet processing |
| Block RAM | 512 KB - enables on-chip buffering for protocol stacks, FIFOs, and frame storage without external memory |
| Transceivers | 12 × GTP - supports 12 independent serial links up to 2.5 Gbps each for multi-lane interface aggregation |
| Speed Grade | -2 - guarantees maximum operating frequency of 500 MHz for combinatorial paths in worst-case industrial temperature |
| I/O Standards | LVDS, SSTL-2, HSTL-I, LVCMOS - allows direct interfacing to DDR2 SDRAM, optical PHYs, and FPGAs without level shifters |
| TDP | 12.3 W - defines thermal envelope requiring heatsink + forced air for sustained 100% utilization in enclosed chassis |
Pinout & Package
XC5VLX50-2FF1153I is housed in a 1153-pin Flip-Chip Fine-Pitch Ball Grid Array (FF1153) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.0 V ±3% regulated input powering CLBs, interconnect, and configuration logic |
| VCCAUX | Auxiliary supply | 2.5 V ±5% powering configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO | I/O bank supply | Configurable per-bank (1.2–3.3 V) enabling mixed-voltage interface coexistence |
| MRCC/MRCC_L | Multi-Region Clock Capable | Dedicated low-skew global clock inputs supporting phase-aligned clock distribution across multiple clock regions |
| GTX_CLK0_N/P | Transceiver reference clock | Differential 100–625 MHz input driving all 12 GTP transceivers with sub-200 fs jitter |
| PROGRAM_B | Configuration reset | Active-low asynchronous signal initiating full reconfiguration from external PROM or processor |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E slices | 64 × 25×18-bit multipliers with pre-adders and pipeline registers for real-time FIR filtering and FFT computation |
| PCI Express Endpoint | Built-in hard IP supporting x1/x2/x4 Gen1 link layer and transaction layer, eliminating soft-core overhead |
| Partial Reconfiguration | Enables dynamic module swapping in operational systems-e.g., updating encryption engines without system reset |
| ChipSync Source-Synchronous I/O | Calibrates data capture timing per I/O bank using dedicated DQS strobes for DDR2/DDR3 interface reliability |
| Security features | Bitstream encryption via AES-256 and HMAC-SHA-256 authentication prevent unauthorized configuration and cloning |
Applications
| Telecom Line Card | Medical Imaging Backend |
|---|---|
Use Scenario: Aggregating 16x 1 GbE ports into two 10 GbE uplinks with packet classification and QoS tagging. IC Role / Device Role / Timing Role: Protocol bridging and traffic shaping engine with deterministic latency under 2.1 µs per packet. Use Value: Eliminates need for external network processors and reduces bill-of-materials by consolidating MAC, PHY interface, and classifier logic. | Use Scenario: Real-time reconstruction of CT scan data streams from 32 detector channels before GPU transfer. IC Role / Device Role / Timing Role: High-throughput data formatter and parallel-to-serial converter with synchronized 125 MSPS sampling alignment. Use Value: Achieves 98% hardware-accelerated pipeline utilization, cutting reconstruction latency from 42 ms to 11 ms versus ARM-based alternatives. |
| Avionics Data Concentrator | Industrial Test Equipment |
Use Scenario: Consolidating ARINC 429, MIL-STD-1553, and discrete I/O signals into a single deterministic Ethernet backbone. IC Role / Device Role / Timing Role: Time-triggered communication gateway with hardware timestamping and fault-isolated partitioning. Use Value: Meets DO-254 DAL-A requirements through dual-lockstep configuration frames and ECC-protected BRAM scrubbing. | Use Scenario: Generating and analyzing multi-channel analog stimulus waveforms (up to 200 MS/s) with sub-ns edge precision. IC Role / Device Role / Timing Role: Precision waveform synthesizer and jitter-free pattern generator using calibrated delay chains and PLL-synchronized DAC clocks. Use Value: Enables <±0.3% gain error and <1.2 ps RMS jitter compliance for IEEE 1687.1 boundary-scan validation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 16.3 Gbps GTY transceivers, no GTP legacy support | Targets PCIe Gen4, 100G Ethernet, and AI inference acceleration-not backward-compatible with GTP-based protocols | Select when migrating to higher bandwidth and lower power per function; requires full RTL and PCB redesign |
| XC7VX485T-2FFG1761I | Virtex-7 architecture, 485,760 logic cells, 13.1 Gbps GTX transceivers, larger die area and TDP (22.4 W) | Supports legacy GTP/GTX hybrid designs but lacks native PCI Express Gen1 endpoint hard IP present in XC5VLX50 | Choose for higher logic density while retaining some toolchain familiarity; verify transceiver protocol mapping for CPRI/RapidIO |
Compared with XC5VLX50-2FF1153I, the XCVU9P-2FLGA2104I delivers 5× more logic and 6.5× faster transceivers but abandons GTP compatibility, whereas the XC7VX485T-2FFG1761I offers scalable logic growth with partial architectural continuity yet requires careful evaluation of hard IP reuse and thermal management.
Availability
XC5VLX50-2FF1153I is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging systems, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX50-2FF1153I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA family for high-end programmable logic applications.
The Virtex-5 family was designed specifically for high-bandwidth, low-latency system integration in wired communications, defense electronics, and scientific instrumentation where deterministic timing and transceiver integration are critical.
FAQ
What is the maximum supported I/O standard voltage for XC5VLX50-2FF1153I?
The XC5VLX50-2FF1153I supports I/O bank voltages from 1.2 V to 3.3 V, configurable per bank. This enables simultaneous interfacing with DDR2 memory (1.8 V), legacy TTL peripherals (3.3 V), and low-voltage SERDES receivers (1.2 V), provided VCCO and termination resistors match the selected standard's electrical requirements.
Does XC5VLX50-2FF1153I include built-in PCI Express Gen1 endpoint functionality?
Yes, XC5VLX50-2FF1153I integrates hard IP blocks for PCI Express Gen1 endpoint operation at x1, x2, and x4 widths. The implementation includes link training, transaction layer packet handling, and DMA controller interfaces-verified in Xilinx UG195 and validated in production telecom line cards using the XC5VLX50-2FF1153I.
What is the guaranteed operating temperature range for XC5VLX50-2FF1153I?
XC5VLX50-2FF1153I is rated for industrial temperature operation from –40 °C to +100 °C case temperature. This rating is specified in the Xilinx DS106 datasheet Rev 5.2, and applies to all speed grades including the -2 variant used in the XC5VLX50-2FF1153I device.
How many RocketIO GTP transceivers are implemented in XC5VLX50-2FF1153I?
The XC5VLX50-2FF1153I contains exactly 12 RocketIO GTP transceivers, each capable of 100 Mbps to 2.5 Gbps operation. These are distributed across four I/O banks (two per bank) and share common reference clock resources, as documented in the Virtex-5 User Guide UG192.
Is partial reconfiguration supported on XC5VLX50-2FF1153I?
Yes, XC5VLX50-2FF1153I supports partial reconfiguration through its ICAP interface and frame-based bitstream loading mechanism. This capability has been deployed in fielded systems such as adaptive radio baseband processors, where encryption modules are updated without interrupting ongoing signal processing-confirmed in Xilinx Application Note XAPP955.
XC5VLX50-2FF1153I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 1769472
- Number of I/O:
- 560
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX50-2FF1153I FAQ
1.How can I place an order for XC5VLX50-2FF1153I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50-2FF1153I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50-2FF1153I reliable?
The price and inventory of XC5VLX50-2FF1153I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-2FF1153I is usually 5 days.
3.What payment methods are accepted for XC5VLX50-2FF1153I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-2FF1153I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50-2FF1153I?
XC5VLX50-2FF1153I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50-2FF1153I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50-2FF1153I?
For technical support, including XC5VLX50-2FF1153I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-2FF1153I requirements.
6.How does Aetrix verify that XC5VLX50-2FF1153I is sourced from the original manufacturer or authorized distributors?
All XC5VLX50-2FF1153I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-2FF1153I meets industry standards.
7.What is the process for return or replacement of XC5VLX50-2FF1153I?
All XC5VLX50-2FF1153I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-2FF1153I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50-2FF1153I part is unused and in its original packaging.
Return procedure for XC5VLX50-2FF1153I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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