AMD XC5VLX50-2FFG1153C
- Part No.:
- XC5VLX50-2FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX50-2FFG1153C.pdf
- Description:
- IC FPGA 560 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:4,112
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX50-2FFG1153C from AMD is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM with 2,088 Kbits capacity. It implements high-speed signal processing in radar baseband subsystems and supports PCIe Gen1 endpoint functionality in industrial vision controllers.
For engineers reviewing the XC5VLX50-2FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include I/O voltage support (1.2 V to 3.3 V), transceiver compliance (PCIe Gen1, SATA), and configuration interface (SelectMAP, JTAG, SPI).
Technical Context
The XC5VLX50-2FFG1153C uses a 65 nm copper process and employs a hierarchical CLB architecture with dual 6-input LUTs per slice. It integrates 12 RocketIO GTP transceivers supporting 100 Mbps–2.5 Gbps operation and includes dedicated DSP48E slices for arithmetic-intensive tasks.
Configuration is performed via Master SelectMAP mode using external flash or through JTAG boundary-scan. The device supports partial reconfiguration and offers multi-boot capability using internal configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 46,080 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 2,088 Kbits - provides on-chip memory for FIFOs, buffers, and lookup tables without external DRAM |
| GTP Transceivers | 12 × 2.5 Gbps - enables native PCIe Gen1 x1/x2/x4 links and SATA 1.5 Gbps interfaces |
| DSP Slices | 64 × DSP48E - delivers 18×25-bit multiply-accumulate per slice for filtering and FFT acceleration |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - supports direct interfacing to ADCs, DDR2 SDRAM, and SERDES PHYs |
| Configuration Interface | SelectMAP, JTAG, SPI - allows flexible programming via processor, debug probe, or serial flash |
Pinout & Package
XC5VLX50-2FFG1153C is housed in a 1153-pin Fine-Pitch Flip-Chip BGA (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. Thermal and mechanical data comply with JEDEC MO-251.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during Master SelectMAP or JTAG programming |
| DIN | Configuration Data Input | Serial data input for JTAG or parallel data bus for SelectMAP mode |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration memory readiness or error |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode Selection Inputs | Set configuration mode at power-up: SelectMAP, JTAG, SPI, or Master Serial |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset, reducing system downtime in real-time control loops |
| Dedicated PCI Express Endpoint Logic | Hard IP blocks implement PCIe Gen1 physical layer and transaction layer, eliminating soft-core resource overhead |
| Multi-Boot Configuration | Stores up to four bitstreams in external flash and selects one via GPIO or internal state machine |
| Advanced Clock Management | Eight DCMs and two PLLs provide jitter reduction, phase shifting, and frequency synthesis for mixed-clock-domain systems |
| System Monitor Integration | On-die temperature and supply voltage sensors feed real-time telemetry to configuration logic or external host |
Applications
| Radar Signal Processing | Industrial Vision Controller |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in X-band phased-array radar front-ends. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; GTP transceivers interface with ADC/DAC FMC modules. Use Value: 12 GTP lanes enable simultaneous digitized RF channel streaming at 200 MSPS per channel with deterministic latency. | Use Scenario: High-throughput image acquisition and preprocessing in automated optical inspection (AOI) systems. IC Role / Device Role / Timing Role: Coordinates multi-camera synchronization, performs Sobel edge detection, and packages results for GigE Vision transmission. Use Value: 46K logic cells accommodate dual 12-bit CMOS sensor interfaces plus real-time convolution pipeline without external frame buffers. |
| Medical Imaging Backend | Test & Measurement Equipment |
Use Scenario: Digital backend for ultrasound beamformer systems requiring low-latency echo correlation and envelope detection. IC Role / Device Role / Timing Role: Configurable logic processes RF sample streams; DSP48E slices execute quadrature demodulation and log-compression. Use Value: 64 DSP48E slices deliver >12 GOPS fixed-point throughput for real-time B-mode image generation at 30 fps. | Use Scenario: Modular digital oscilloscope with 1 GS/s sampling and deep memory buffer management. IC Role / Device Role / Timing Role: Manages high-speed ADC capture, implements trigger logic, and controls DDR2 memory controller for waveform storage. Use Value: Embedded 2 Mbit Block RAM serves as acquisition buffer, enabling 16 MSamples capture depth without external memory bottleneck. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC5VLX30-2FFG676C | Fewer logic cells (30,840), no GTP transceivers, smaller 676-pin FFG package | Suitable for cost-sensitive, lower-bandwidth applications without serial connectivity requirements | Select when PCIe/SATA interface is unnecessary and board space is constrained |
| Xilinx XC5VLX110-2FFG1136C | Higher logic density (110,592 cells), same GTP count, larger 1136-pin FFG package | Required for complex multi-function systems integrating video encode, network stack, and real-time control | Choose when XC5VLX50-2FFG1153C resources are insufficient for full system integration |
Compared with XC5VLX50-2FFG1153C, the XC5VLX30-2FFG676C reduces I/O count and eliminates transceivers to lower cost and footprint, while the XC5VLX110-2FFG1136C expands logic and memory resources to support heterogeneous workloads-both retain identical configuration and clocking architecture for design portability.
Availability
XC5VLX50-2FFG1153C is available at Aetrix Electronics and suitable for radar signal processing, industrial vision control, and medical imaging backend systems requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX50-2FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace/defense applications.
The Virtex-5 family was engineered for high-performance, serial-connectivity-rich systems including defense radar, broadcast infrastructure, and scientific instrumentation.
FAQ
What is the maximum supported transceiver data rate for XC5VLX50-2FFG1153C?
The XC5VLX50-2FFG1153C supports RocketIO GTP transceivers operating up to 2.5 Gbps per lane. This enables compliance with PCIe Gen1 (2.5 GT/s), SATA I (1.5 Gbps), and other serial protocols. The XC5VLX50-2FFG1153C does not support higher-rate standards such as PCIe Gen2 or 3G-SDI without external retiming.
Does XC5VLX50-2FFG1153C support partial reconfiguration?
Yes, XC5VLX50-2FFG1153C supports partial reconfiguration through its configuration logic and frame-based bitstream architecture. This allows dynamic replacement of functional modules while maintaining operation of the rest of the design. The XC5VLX50-2FFG1153C requires proper floorplanning and use of Xilinx PlanAhead or Vivado tools to implement validated partial bitstreams.
What configuration modes are supported by XC5VLX50-2FFG1153C?
XC5VLX50-2FFG1153C supports Master SelectMAP, Slave SelectMAP, JTAG, and Master Serial configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC5VLX50-2FFG1153C also supports fallback and multi-boot configurations using external flash memory and internal configuration registers.
What is the operating temperature range for XC5VLX50-2FFG1153C?
The XC5VLX50-2FFG1153C is rated for commercial temperature operation from 0 °C to +85 °C ambient. It is not qualified for industrial (−40 °C to +100 °C) or extended temperature ranges. Thermal management must ensure junction temperature remains within limits under sustained logic and transceiver activity.
How many Block RAM columns does XC5VLX50-2FFG1153C contain?
The XC5VLX50-2FFG1153C contains 64 Block RAM columns, each providing 18 Kbits of dual-port memory. This yields a total of 2,088 Kbits of embedded RAM. The XC5VLX50-2FFG1153C allocates these columns across the die to balance routing congestion and memory access latency in large designs.
XC5VLX50-2FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 1769472
- Number of I/O:
- 560
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX50-2FFG1153C FAQ
1.How can I place an order for XC5VLX50-2FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50-2FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50-2FFG1153C reliable?
The price and inventory of XC5VLX50-2FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-2FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX50-2FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-2FFG1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50-2FFG1153C?
XC5VLX50-2FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50-2FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50-2FFG1153C?
For technical support, including XC5VLX50-2FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-2FFG1153C requirements.
6.How does Aetrix verify that XC5VLX50-2FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX50-2FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-2FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX50-2FFG1153C?
All XC5VLX50-2FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-2FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50-2FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX50-2FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX50-2FFG1153C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

