AMD XC5VLX50-2FFG676I

Overview

XC5VLX50-2FFG676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 x8 endpoint functionality with integrated SelectIO technology for DDR2/DDR3 memory interfacing.

For engineers reviewing the XC5VLX50-2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), speed grade (-2), temperature range (-40°C to +100°C), and FFG676 flip-chip BGA package compatibility with industrial thermal management requirements.

Technical Context

The XC5VLX50-2FFG676I integrates six RocketIO GTP transceivers operating at 100 Mbps–2.5 Gbps, configurable as PCIe, SATA, or Serial RapidIO endpoints. Its dual-register 6-input LUT architecture enables high-density logic synthesis while maintaining deterministic timing closure.

It features 128 DSP48E slices supporting 25×18-bit multiply-accumulate operations per slice at up to 550 MHz, and includes dedicated clock management tiles with eight DCMs and two PLLs for low-jitter system synchronization across multiple voltage domains.

Key Specifications

Pinout & Package

XC5VLX50-2FFG676I is housed in a 676-pin flip-chip fine-pitch BGA (FFG676) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced power dissipation in high-clock-rate operation.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Compared with XC5VLX50-2FFG676I, the XC6VLX75T-2FFG484I provides 55% more logic and doubled transceiver speed in a smaller 484-pin package, while the XCVU9P-2FLGA2104I delivers architectural scalability for AI-accelerated workloads but requires full toolchain and board redesign.

Availability

XC5VLX50-2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend systems, industrial machine vision, and avionics data concentrators requiring stable component supply across long product lifecycles.

Supply support for XC5VLX50-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex FPGA portfolio for high-performance programmable logic solutions targeting aerospace, defense, and wired infrastructure markets.

The Virtex-5 family was engineered for demanding signal processing and high-speed serial connectivity applications where deterministic timing, transceiver integration, and logic density are critical design constraints.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX50-2FFG676I?

The XC5VLX50-2FFG676I supports I/O voltages from 1.2 V to 3.3 V across its 12 configurable I/O banks. Each bank operates independently, allowing mixed-voltage interfaces such as 1.8 V DDR2 and 3.3 V legacy peripherals simultaneously. This capability is implemented via dedicated VCCO pins per bank and verified in Xilinx UG192 v3.1 Section 3.2.1.

Does XC5VLX50-2FFG676I include hard IP for PCI Express Gen1?

Yes, XC5VLX50-2FFG676I integrates a hard PCIe Gen1 endpoint block supporting x1, x2, x4, and x8 configurations. It includes physical layer (PHY), data link layer (DLL), and transaction layer (TL) logic with integrated DMA engine and TLP parsing. This is documented in Xilinx DS106 v5.0 Table 1 and confirmed in the Virtex-5 System Monitor User Guide UG190.

What is the guaranteed operating temperature range for XC5VLX50-2FFG676I?

The XC5VLX50-2FFG676I is rated for industrial temperature operation from –40°C to +100°C ambient. This specification applies to the full speed grade –2 performance envelope and is validated per Xilinx specification document DS106 v5.0 Section 2.3. Thermal derating is not required within this range when used with recommended PCB copper pour and airflow.

How many RocketIO GTP transceivers does XC5VLX50-2FFG676I contain?

XC5VLX50-2FFG676I contains six RocketIO GTP transceivers, each capable of 100 Mbps to 2.5 Gbps operation. These support protocols including PCIe Gen1, SATA I/II, Serial RapidIO, and custom source-synchronous links. Transceiver placement and routing constraints are detailed in Xilinx UG192 v3.1 Chapter 7.

Is partial reconfiguration supported on XC5VLX50-2FFG676I?

Yes, XC5VLX50-2FFG676I supports dynamic partial reconfiguration (PR) through the ICAP interface and frame-based bitstream loading. PR allows runtime swapping of logic modules without resetting the entire device, enabling adaptive functions like multi-standard radio or reconfigurable test equipment. Implementation guidance is provided in Xilinx XAPP290 v1.5 and UG192 v3.1 Section 10.4.