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AMD XC5VLX50-3FFG1153C
- Part No.:
- XC5VLX50-3FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX50-3FFG1153C.pdf
- Description:
- IC FPGA 560 I/O 1153FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,280
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Product details
Overview
XC5VLX50-3FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC5VLX50-3FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include speed grade (-3), FFG1153 package compatibility, transceiver lane count (12), and DCI-capable I/O banks for impedance-controlled interfaces.
Technical Context
The XC5VLX50-3FFG1153C uses a 65 nm copper process and employs a column-based architecture with dedicated DSP48E slices (64 units), clock management tiles (CMT) containing DCMs and PLLs, and SelectIO technology supporting LVDS, SSTL, and HSTL standards. It supports partial reconfiguration and ChipSync source-synchronous interfaces.
Configuration occurs via Master SelectMAP, Slave SelectMAP, or JTAG; configuration memory is external. The device includes 12 RocketIO GTP transceivers operating up to 3.75 Gbps with built-in 8B/10B encoding and elastic buffers.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 46,080 - provides gate count equivalent to ~220K ASIC gates for complex RTL implementation |
| Block RAM | 2,002 kbits - supports dual-port FIFOs, coefficient storage, and frame buffering without external memory |
| Transceivers | 12 × GTP - enables 12 independent serial links up to 3.75 Gbps for JESD204B or CPRI interfaces |
| Speed Grade | -3 - guarantees timing closure at highest performance bin for critical paths in high-frequency designs |
| I/O Standards | LVDS, SSTL-2, HSTL-I, Differential SSTL-18 - allows direct interfacing with DDR2 SDRAM, ADCs, and SERDES PHYs |
| DCI Support | On-chip termination - eliminates external resistors for impedance-matched trace routing on dense PCBs |
Pinout & Package
The XC5VLX50-3FFG1153C is housed in a 1153-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant construction. Thermal pad on underside requires solder paste stencil design per Xilinx UG192.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V ±3% supply for logic fabric; requires low-noise regulation and local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration, clocking, and transceiver reference circuits |
| VCCO_0 | I/O bank voltage | Configurable 1.2–3.3 V per bank; sets output swing and input threshold for attached peripherals |
| M0–M2 | Mode pins | Determine configuration mode (e.g., Master SelectMAP) at power-up; must be pulled high/low externally |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or configuration error |
Key Features
| Feature | Design Value |
|---|---|
| DSP48E Slices | 64 dedicated arithmetic units enabling pipelined FIR filters, FFT engines, and real-time matrix operations |
| Clock Management Tiles (CMT) | Four CMTs each containing DCM + PLL for jitter reduction, frequency synthesis, and phase alignment across domains |
| SelectIO Technology | Supports 20+ I/O standards with programmable slew rate, drive strength, and on-die termination for signal integrity |
| RocketIO GTP Transceivers | 12 lanes with integrated 8B/10B encoder/decoder, comma detection, and elastic buffer for protocol-agnostic serial links |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; transceivers interface with ADC/DAC over JESD204B. Use Value: Deterministic latency under 50 ns per pipeline stage enables sub-microsecond response for adaptive waveform control. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using parallel backprojection. IC Role / Device Role / Timing Role: XC5VLX50-3FFG1153C hosts custom IP cores for inverse Radon transform and GPU-offloaded rendering pipelines. Use Value: 2,002 kbits of Block RAM enables on-chip storage of projection matrices, eliminating DRAM access bottlenecks. |
| Wireless Baseband Unit | Test & Measurement Equipment |
Use Scenario: LTE-Advanced macrocell baseband processing with MIMO-4x4 and carrier aggregation. IC Role / Device Role / Timing Role: Implements digital pre-distortion (DPD), crest factor reduction (CFR), and OFDM modulation/demodulation. Use Value: -3 speed grade ensures timing closure for 122.88 MHz sampling clocks with 400+ logic levels of DPD feedback path. | Use Scenario: High-resolution oscilloscope front-end with real-time spectrum analysis and deep memory capture. IC Role / Device Role / Timing Role: XC5VLX50-3FFG1153C manages ADC data streaming, trigger logic, and FFT computation at 1 GS/s. Use Value: 12 GTP transceivers enable 12-channel parallel acquisition with synchronized timestamping across channels. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-3FFG1153C | Higher logic capacity (110K LC), same package and speed grade; larger die area and higher static power | Required when >46K LC needed for multi-standard radio or expanded channel count | Select only if design exceeds XC5VLX50-3FFG1153C resource utilization by ≥20% |
| XCKU040-2FFVA1156I | Kintex UltraScale architecture; 198K logic cells, 24 GTY transceivers, 15.3 Gbps max rate; different pinout and configuration flow | Suitable for next-gen 5G NR or high-resolution imaging where bandwidth and density exceed Virtex-5 limits | Migration path only-requires full PCB redesign and toolchain update |
Compared with XC5VLX50-3FFG1153C, the XC5VLX110-3FFG1153C offers headroom for feature expansion within identical footprint and timing constraints, while the XCKU040-2FFVA1156I delivers higher throughput and newer protocols but mandates architectural and layout rework.
Availability
XC5VLX50-3FFG1153C is available at Aetrix Electronics and suitable for radar subsystems, medical imaging backends, wireless baseband units, and test equipment requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX50-3FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains legacy Virtex-5 product support, documentation, and obsolescence management through its Adaptive SoC business unit.
The Virtex-5 family was designed for high-performance, high-bandwidth applications including aerospace avionics, defense radar, and wired/wireless infrastructure where deterministic latency and multi-gigabit serial I/O are critical.
FAQ
What is the maximum transceiver data rate supported by the XC5VLX50-3FFG1153C?
The XC5VLX50-3FFG1153C supports RocketIO GTP transceivers with a maximum data rate of 3.75 Gbps per lane. This rate is validated under specified voltage, temperature, and board layout conditions per Xilinx DS106. The XC5VLX50-3FFG1153C does not support rates above 3.75 Gbps-even with external equalization-due to native GTP architecture limits.
Does the XC5VLX50-3FFG1153C support partial reconfiguration?
Yes, the XC5VLX50-3FFG1153C supports dynamic partial reconfiguration (PR) through its ICAP interface and dedicated PR controller logic. This capability allows runtime swapping of functional modules without resetting the entire device. Implementation requires Xilinx ISE 14.7 or later and adherence to floorplanning rules defined in UG194 for the XC5VLX50-3FFG1153C.
What configuration modes are available for the XC5VLX50-3FFG1153C?
The XC5VLX50-3FFG1153C supports Master SelectMAP, Slave SelectMAP, JTAG, and Serial PROM configuration modes. Mode selection is controlled by M0–M2 pins at power-on. Configuration bitstreams must be generated using Xilinx ISE tools targeting the exact XC5VLX50-3FFG1153C device variant and speed grade.
Is the XC5VLX50-3FFG1153C RoHS compliant?
Yes, the XC5VLX50-3FFG1153C is RoHS compliant and Pb-free, as confirmed in Xilinx document AR# 32282 and the official packaging specification for FFG1153. The device meets EU Directive 2011/65/EU requirements and carries the appropriate marking on the top-side laser etch.
What thermal management guidance applies to the XC5VLX50-3FFG1153C?
The XC5VLX50-3FFG1153C requires a thermal solution capable of maintaining junction temperature ≤100°C under worst-case power dissipation (up to 9.2 W typical). Xilinx UG192 specifies a 10 mm × 10 mm thermal pad on the package underside, which must be soldered to a solid copper plane with ≥6 thermal vias. No integrated heat spreader is included.
XC5VLX50-3FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 1769472
- Number of I/O:
- 560
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX50-3FFG1153C FAQ
1.How can I place an order for XC5VLX50-3FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50-3FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50-3FFG1153C reliable?
The price and inventory of XC5VLX50-3FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-3FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX50-3FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-3FFG1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50-3FFG1153C?
XC5VLX50-3FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50-3FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50-3FFG1153C?
For technical support, including XC5VLX50-3FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-3FFG1153C requirements.
6.How does Aetrix verify that XC5VLX50-3FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX50-3FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-3FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX50-3FFG1153C?
All XC5VLX50-3FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-3FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50-3FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX50-3FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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