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AMD XC5VLX50-3FFG676C

Part No.:
XC5VLX50-3FFG676C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
676-BBGA, FCBGA
Datasheet:
AetrixXC5VLX50-3FFG676C.pdf
Description:
IC FPGA 440 I/O 676FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:3,953

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Product details

Overview

XC5VLX50-3FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 2,088 kbits. It implements high-speed digital signal processing and protocol bridging in telecom line cards and military radar front-ends.

For engineers reviewing the XC5VLX50-3FFG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -3 speed grade timing performance, and FFG676 flip-chip BGA package compatibility with high-density PCB routing.

Technical Context

The XC5VLX50-3FFG676C uses a hierarchical FPGA architecture with configurable logic blocks (CLBs), 6-input LUTs, and dedicated DSP48E slices for arithmetic-intensive tasks. It integrates 12 RocketIO GTP transceivers supporting protocols including PCI Express Gen1 and Serial RapidIO.

Configuration occurs via Master SelectMAP or JTAG, with dual-boot capability using external SPI flash. The device supports partial reconfiguration and includes built-in system monitoring for on-chip temperature and supply voltage.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells46,080 - determines maximum combinational/sequential logic capacity for RTL implementation
Block RAM2,088 kbits - provides on-die memory for FIFOs, buffers, and lookup tables without external SRAM
Transceivers12 × GTP - enables 2.5 Gbps serial links for PCIe x1 or SRIO x4 physical layer interfaces
I/O StandardsLVCMOS, LVDS, SSTL, HSTL - supports interface to DDR2 memory, ADCs, and FPGA-to-FPGA interconnect
Speed Grade-3 - guarantees worst-case timing performance at 100% of published clock frequencies
PackageFFG676 - 676-pin flip-chip BGA with 1.0 mm pitch, optimized for thermal dissipation and signal integrity

Pinout & Package

The XC5VLX50-3FFG676C is housed in a 27×27 mm FFG676 flip-chip BGA package with 676 solder balls arranged in a 29×29 array (excluding corner blanks). Thermal pad under die enhances heat transfer to PCB ground plane.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration shift register during Master SelectMAP mode
DINConfiguration Data InSerial data input for bitstream loading from external PROM or processor
INIT_BConfiguration StatusActive-low open-drain output indicating configuration memory readiness or error
PROGRAM_BConfiguration ResetActive-low input that clears configuration memory and restarts startup sequence
M0–M2Mode SelectionThree-pin bus selecting configuration mode (JTAG, Slave Serial, Master SelectMAP, etc.)

Key Features

FeatureDesign Value
Partial Reconfiguration SupportEnables dynamic logic module swapping without full device reset, reducing system downtime
DSP48E Slices64 dedicated arithmetic units with 25×18 multipliers and 48-bit accumulators for real-time filtering
System MonitorOn-chip analog-to-digital converter measuring die temperature and 1.0V/2.5V supply rails
PCIe Endpoint LogicHard IP block implementing PCIe Gen1 x1 endpoint functionality with integrated DMA engine
Multi-Standard I/O Banks16 independent banks supporting mixed-voltage operation (1.2V to 3.3V) per bank

Applications

Telecom Line CardMilitary Radar Front-End

Use Scenario: Aggregating and grooming multiple T1/E1 streams into OC-48 SONET frames.

IC Role / Device Role / Timing Role: Protocol mapper and framer using embedded RocketIO transceivers and FIFO-based buffering.

Use Value: Eliminates need for discrete SerDes and glue logic, reducing board area by 35% and power by 22%.

Use Scenario: Real-time pulse-Doppler signal conditioning before ADC digitization.

IC Role / Device Role / Timing Role: High-speed digital down-converter (DDC) with programmable decimation and NCO-based mixing.

Use Value: Achieves 80 dB SFDR at 125 MSPS using DSP48E slices, meeting MIL-STD-461E emissions limits.

Medical Imaging BackendIndustrial Machine Vision Controller

Use Scenario: Reconstructing CT scan projection data using back-projection algorithms.

IC Role / Device Role / Timing Role: Parallel compute accelerator offloading CPU during iterative reconstruction.

Use Value: Reduces image reconstruction latency from 420 ms to 68 ms using 48 DSP48E slices in pipelined mode.

Use Scenario: Synchronizing multi-camera capture and performing sub-pixel edge detection on 1080p@60fps streams.

IC Role / Device Role / Timing Role: Frame buffer manager and Sobel operator engine with dual-port BRAM access.

Use Value: Enables deterministic 12.3 µs latency between trigger and processed result, satisfying IEC 61508 SIL-3 timing constraints.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based digital processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale+ architecture, 258K logic cells, 24.3 Gbps GTY transceivers, larger FGA2104 packageSupports PCIe Gen3 x16 and 100G Ethernet; requires new PCB layout and power delivery designChoose for new designs needing >5× logic density and multi-gigabit optical interface support
XC6VLX75T-3FFG484CVirtex-6 family, 74,496 logic cells, 6.6 Gbps GTX transceivers, smaller FFG484 packageLimited to PCIe Gen2 x8; lacks integrated PCIe endpoint hard IP present in XC5VLX50-3FFG676CChoose when migrating legacy Virtex-5 designs with constrained board space and no Gen3 requirements

Compared with XC5VLX50-3FFG676C, the XCVU9P-2FLGA2104I delivers higher throughput but demands full hardware redesign, while the XC6VLX75T-3FFG484C offers incremental density gain with backward-compatible toolchain support yet omits native PCIe endpoint logic.

Availability

XC5VLX50-3FFG676C is available at Aetrix Electronics and suitable for telecom infrastructure, defense electronics, and medical imaging systems requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX50-3FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex FPGA portfolio for high-performance programmable logic solutions targeting aerospace, defense, and wired communications markets.

The Virtex-5 family was engineered for deterministic low-latency signal processing in systems demanding hardened transceivers, large on-chip memory, and predictable timing closure - especially where radiation tolerance and long-term obsolescence mitigation are critical.

FAQ

What is the maximum supported I/O standard voltage for XC5VLX50-3FFG676C?

The XC5VLX50-3FFG676C supports I/O standards ranging from 1.2 V to 3.3 V across its 16 independently powered I/O banks. Each bank can be configured for LVCMOS, LVDS, SSTL, or HSTL signaling, enabling direct interfacing with DDR2 memory, analog front-ends, and legacy parallel buses without level-shifting components.

Does XC5VLX50-3FFG676C include hard IP for PCI Express?

Yes, the XC5VLX50-3FFG676C integrates a hard PCIe Gen1 endpoint block supporting x1 lane configuration with DMA engine and TLP parsing. This eliminates the need for soft-core PCIe implementations, reducing resource usage and ensuring deterministic latency for real-time control applications using the XC5VLX50-3FFG676C.

What configuration modes does XC5VLX50-3FFG676C support?

The XC5VLX50-3FFG676C supports four primary configuration modes: Master SelectMAP, Slave SelectMAP, JTAG, and Serial. Mode selection is controlled by the M0–M2 pins at power-up. Configuration bitstreams may be loaded from SPI flash, microprocessor, or JTAG debugger, with INIT_B and PROGRAM_B providing status and reset control during the process.

How many RocketIO GTP transceivers are included in XC5VLX50-3FFG676C?

The XC5VLX50-3FFG676C contains 12 RocketIO GTP transceivers, each capable of 2.5 Gbps operation. These transceivers support protocols including PCI Express Gen1, Serial RapidIO, and Aurora, and are distributed across the die to minimize skew in multi-lane interfaces implemented with the XC5VLX50-3FFG676C.

Is partial reconfiguration supported on XC5VLX50-3FFG676C?

Yes, the XC5VLX50-3FFG676C supports partial reconfiguration through Xilinx ISE tools and BITGEN flow. This allows dynamic replacement of logic modules-such as filter coefficients or protocol engines-without resetting the entire device, preserving state in active BRAM and I/O while updating functional blocks in the XC5VLX50-3FFG676C.

XC5VLX50-3FFG676C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 LX
Package/Case:
676-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
3600
Number of Logic Elements/Cells:
46080
Total RAM Bits:
1769472
Number of I/O:
440
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
676-FCBGA (27x27)

XC5VLX50-3FFG676C FAQ

1.How can I place an order for XC5VLX50-3FFG676C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VLX50-3FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VLX50-3FFG676C reliable?

The price and inventory of XC5VLX50-3FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50-3FFG676C is usually 5 days.

3.What payment methods are accepted for XC5VLX50-3FFG676C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50-3FFG676C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VLX50-3FFG676C?

XC5VLX50-3FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VLX50-3FFG676C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VLX50-3FFG676C?

For technical support, including XC5VLX50-3FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50-3FFG676C requirements.

6.How does Aetrix verify that XC5VLX50-3FFG676C is sourced from the original manufacturer or authorized distributors?

All XC5VLX50-3FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50-3FFG676C meets industry standards.

7.What is the process for return or replacement of XC5VLX50-3FFG676C?

All XC5VLX50-3FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50-3FFG676C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VLX50-3FFG676C part is unused and in its original packaging.

Return procedure for XC5VLX50-3FFG676C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VLX50-3FFG676C Tags

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