AMD XC5VLX50T-2FFG1136C
- Part No.:
- XC5VLX50T-2FFG1136C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VLX50T-2FFG1136C.pdf
- Description:
- IC FPGA 480 I/O 1136FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,007
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VLX50T-2FFG1136C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 46,080 logic cells, 2.5 Gb/s serial transceivers, and embedded Block RAM totaling 2,002 kbits. It implements high-speed signal processing in telecom line cards and supports PCIe Gen1 x8 endpoint functionality with integrated RocketIO GTP transceivers.
For engineers reviewing the XC5VLX50T-2FFG1136C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, I/O bank voltage support (1.2 V to 3.3 V), total available DSP48E slices (64), and thermal performance in FFG1136 package.
Technical Context
The XC5VLX50T-2FFG1136C belongs to the Virtex-5 LXT family and integrates 64 DSP48E slices for arithmetic-intensive tasks, along with 24 RocketIO GTP transceivers operating up to 3.75 Gb/s. Its SelectIO technology supports differential standards including LVDS, RSDS, and BLVDS across 16 I/O banks.
Configuration is performed via Master SelectMAP or JTAG, with support for dual-boot from two external SPI flash devices. The device uses 65 nm copper CMOS process and includes built-in clock management with DCM and PLL blocks for jitter reduction and frequency synthesis.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 46,080 - provides gate count equivalent to ~250K ASIC gates for complex digital logic implementation |
| Block RAM | 2,002 kbits - enables on-chip buffering for video frame stores or packet memory in networking applications |
| DSP48E Slices | 64 - delivers 18×25-bit multiply-accumulate capability per slice for real-time filtering and FFTs |
| RocketIO GTP Transceivers | 24 × 2.5–3.75 Gb/s - supports multi-protocol serial links including PCIe, SATA, and Serial RapidIO |
| I/O Banks | 16 - allows independent voltage assignment per bank for mixed-voltage system interfacing |
| Max I/O Pins | 640 - supports high-pin-count parallel interfaces such as DDR2/DDR3 memory controllers |
| DCM/PLL Blocks | 8 - enables precise clock phase alignment and frequency multiplication for synchronous design timing closure |
Pinout & Package
The XC5VLX50T-2FFG1136C is housed in a 1136-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal characteristics include 1.9°C/W junction-to-case thermal resistance.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during master mode programming; must be stable before INIT_B deassertion |
| INIT_B | Configuration Initialization Output | Active-low open-drain signal indicating readiness to accept configuration data or reporting CRC error |
| PROGRAM_B | Configuration Reset Input | Asynchronous active-low input that clears configuration memory and restarts boot sequence |
| DONE | Configuration Completion Output | Open-drain status signal pulled high when configuration completes successfully and device enters user mode |
| M0–M2 | Mode Selection Inputs | Set configuration interface mode (e.g., Master SelectMAP, Slave Parallel, JTAG) at power-up |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm Process | Enables lower static power and higher density versus Virtex-4, with reduced leakage current at 1.0 V core voltage |
| Integrated GTP Transceivers | Eliminates need for external SerDes chips in PCIe Gen1 and Serial RapidIO endpoints, reducing BOM count |
| SelectIO Technology | Supports single-ended and differential signaling standards simultaneously across independent I/O banks |
| Dual-Boot Configuration | Allows field-upgradable firmware images stored in two separate SPI flash devices for fail-safe reconfiguration |
| Embedded Memory Controllers | Hardened logic for DDR2 SDRAM interfaces up to 400 MHz data rate, simplifying memory subsystem design |
Applications
| Telecom Line Cards | Medical Imaging Systems |
|---|---|
Use Scenario: High-bandwidth packet processing and protocol translation in 10G Ethernet and OTN transport equipment. IC Role / Device Role / Timing Role: Configurable fabric handles MAC-layer framing, FEC decoding, and traffic shaping with deterministic latency. Use Value: 24 GTP transceivers enable direct connection to multiple SFP+ modules without retiming ICs, reducing signal path complexity. | Use Scenario: Real-time image reconstruction pipeline in MRI and CT scanners requiring low-latency pixel data routing. IC Role / Device Role / Timing Role: FPGA acts as a high-throughput data concentrator between ADC arrays and GPU-based reconstruction engines. Use Value: 64 DSP48E slices accelerate back-projection algorithms while Block RAM buffers raw k-space data streams. |
| Industrial Machine Vision | Aerospace Data Recorders |
Use Scenario: Multi-camera synchronization and feature extraction in automated optical inspection systems. IC Role / Device Role / Timing Role: Implements precise timestamping, ROI cropping, and edge detection using programmable logic and embedded memory. Use Value: 16 I/O banks allow concurrent interfacing to Camera Link, LVDS, and CMOS sensors with independent voltage control. | Use Scenario: Radiation-tolerant flight data acquisition and encrypted storage in UAV telemetry systems. IC Role / Device Role / Timing Role: Performs real-time encryption, error correction, and NAND flash wear-leveling under DO-254 compliance constraints. Use Value: Built-in DCM/PLL blocks maintain clock integrity across wide temperature ranges (-40°C to +100°C operation). |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based system integration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110T-2FFG1136C | Higher logic capacity (110,592 LC), same package and transceiver count; larger die area and higher static power | Preferred for designs requiring >46K LC but retaining identical board layout and thermal envelope | Select when additional logic resources are needed without changing PCB or cooling solution |
| XCKU040-2FFVA1156I | Kintex UltraScale architecture; 154K logic cells, 24 GTY transceivers up to 12.5 Gb/s, different pinout and voltage requirements | Suitable for next-generation upgrades requiring higher bandwidth and lower power per function, but requires full redesign | Choose for new designs targeting PCIe Gen3/Gen4 or 10G+ Ethernet where migration path matters |
Compared with XC5VLX50T-2FFG1136C, the XC5VLX110T-2FFG1136C offers scalable logic density within identical mechanical and thermal constraints, while the XCKU040-2FFVA1156I delivers significantly higher serial bandwidth and architectural efficiency at the cost of full hardware redesign.
Availability
XC5VLX50T-2FFG1136C is available at Aetrix Electronics and suitable for telecom infrastructure, medical imaging, and industrial automation applications requiring stable component supply over extended production lifecycles.
Supply support for XC5VLX50T-2FFG1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-5 family was originally designed by Xilinx for high-performance, serial I/O–intensive applications such as wired communications, defense signal processing, and scientific computing.
FAQ
What is the maximum supported data rate for RocketIO GTP transceivers in XC5VLX50T-2FFG1136C?
The XC5VLX50T-2FFG1136C supports RocketIO GTP transceivers operating from 100 Mb/s up to 3.75 Gb/s. This range accommodates protocols including PCIe Gen1 (2.5 Gb/s), SATA I/II (1.5/3.0 Gb/s), and Serial RapidIO (1.25–3.125 Gb/s). The actual achievable rate depends on board layout, reference clock stability, and signal integrity margins.
Does XC5VLX50T-2FFG1136C support JTAG boundary-scan testing?
Yes, XC5VLX50T-2FFG1136C fully supports IEEE 1149.1 JTAG boundary-scan for interconnect testing and in-system programming. The TAP controller is accessible via dedicated TDI, TDO, TMS, and TCK pins, and supports IDCODE, SAMPLE/PRELOAD, EXTEST, and INTEST instructions as defined in the Virtex-5 configuration user guide.
What is the core voltage requirement for XC5VLX50T-2FFG1136C?
The XC5VLX50T-2FFG1136C requires a nominal 1.0 V ±3% core supply (VCCINT) delivered through dedicated power planes. This voltage powers the FPGA fabric, CLBs, and internal routing. Deviation beyond tolerance risks timing violations or configuration loss, especially under high utilization or elevated temperature conditions.
Can XC5VLX50T-2FFG1136C interface directly with DDR3 SDRAM?
No, XC5VLX50T-2FFG1136C does not include native DDR3 memory controller hard IP. It supports DDR2 SDRAM up to 400 MHz data rate via its hardened memory interface logic. For DDR3, external PHY or soft-controller implementation using logic resources and I/O timing calibration is required, with careful attention to ZQ calibration and Vref management.
Is XC5VLX50T-2FFG1136C qualified for automotive applications?
No, XC5VLX50T-2FFG1136C is not AEC-Q100 qualified and is specified only for commercial and industrial temperature ranges (0°C to +85°C for C-grade, –40°C to +100°C for I-grade). It lacks automotive-specific reliability testing, failure mode analysis, and qualification documentation required for automotive ECUs or ADAS subsystems.
XC5VLX50T-2FFG1136C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 3600
- Number of Logic Elements/Cells:
- 46080
- Total RAM Bits:
- 2211840
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VLX50T-2FFG1136C FAQ
1.How can I place an order for XC5VLX50T-2FFG1136C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX50T-2FFG1136C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX50T-2FFG1136C reliable?
The price and inventory of XC5VLX50T-2FFG1136C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX50T-2FFG1136C is usually 5 days.
3.What payment methods are accepted for XC5VLX50T-2FFG1136C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX50T-2FFG1136C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX50T-2FFG1136C?
XC5VLX50T-2FFG1136C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX50T-2FFG1136C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX50T-2FFG1136C?
For technical support, including XC5VLX50T-2FFG1136C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX50T-2FFG1136C requirements.
6.How does Aetrix verify that XC5VLX50T-2FFG1136C is sourced from the original manufacturer or authorized distributors?
All XC5VLX50T-2FFG1136C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX50T-2FFG1136C meets industry standards.
7.What is the process for return or replacement of XC5VLX50T-2FFG1136C?
All XC5VLX50T-2FFG1136C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX50T-2FFG1136C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX50T-2FFG1136C part is unused and in its original packaging.
Return procedure for XC5VLX50T-2FFG1136C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VLX50T-2FFG1136C Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

