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AMD XC5VLX85-1FF676I
- Part No.:
- XC5VLX85-1FF676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-1FF676I.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,933
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Product details
Overview
XC5VLX85-1FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,200 logic cells, 480 DSP48E slices, 4.2 MB of total block RAM, and operates at -1 speed grade (1.0 ns CLB delay). It is used in high-performance digital signal processing and reconfigurable computing systems requiring deterministic timing and multi-gigabit serial I/O.
For engineers reviewing the XC5VLX85-1FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), transceiver capability (24 GTP transceivers up to 3.75 Gbps), voltage supply requirements (1.0V core, 2.5V/3.3V I/O), and thermal design for the 676-pin Flip-Chip Fine-Pitch BGA package.
Technical Context
The XC5VLX85-1FF676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It integrates 24 GTP serial transceivers supporting protocols including PCI Express Gen1, SATA, and Serial RapidIO.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling (LVDS, RSDS, BLVDS). Configuration is performed via Master SelectMAP, Slave SelectMAP, or JTAG, with bitstream security enabled through AES encryption.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,200 - determines maximum combinational and sequential logic capacity for complex state machines and datapaths |
| DSP Slices | 480 × DSP48E - enables parallel multiply-accumulate operations at up to 550 MHz for FIR filters and FFT engines |
| Block RAM | 4.2 MB - supports large on-chip buffering, FIFOs, and coefficient storage without external memory |
| GTP Transceivers | 24 × 3.75 Gbps - provides native support for PCIe x4, dual-channel SATA, or four-lane SRIO links |
| User I/O Pins | 480 - allows high-density interface consolidation across multiple buses and protocols |
| Core Voltage | 1.0 V ±3% - requires tight-regulation DC-DC converter with low-noise output and fast transient response |
| Speed Grade | -1 - guarantees timing closure at 1.0 ns CLB propagation delay under worst-case industrial temperature (-40°C to +100°C) |
Pinout & Package
XC5VLX85-1FF676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FF676) package with 35×35 array, 1.0 mm pitch, and thermal lid. Package dimensions are 27 mm × 27 mm, with exposed thermal pad for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered with ≥10 µF ceramic + 100 nF local decoupling per power rail group |
| VCCAUX | Auxiliary power (configuration, clocking, transceivers) | Supplies configuration logic, PLLs, and GTP reference clocks; requires separate regulation from VCCINT |
| VCCO | I/O bank power | Configurable per bank (1.2V–3.3V); each bank must have dedicated supply and termination matching |
| PROGRAM_B | Active-Low configuration initiator | Pulling low resets configuration logic and clears internal state prior to new bitstream loading |
| CCLK | Configuration clock input/output | In Master SelectMAP mode, drives external PROM clock; in JTAG mode, driven by debugger |
| INIT_B | Configuration status indicator | Open-drain active-low signal indicating bitstream CRC pass/fail during startup |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm copper process | Enables higher density and lower dynamic power versus 90 nm Virtex-4, with reduced leakage at industrial temperature |
| Dedicated PCI Express Endpoint logic | Hard IP block eliminates need for soft-core implementation, reducing resource usage and verification effort |
| Integrated Digital Clock Managers (DCMs) and PLLs | Supports jitter reduction, frequency synthesis, and phase alignment across multiple clock domains |
| AES bitstream encryption | Prevents reverse engineering and unauthorized cloning via authenticated, encrypted configuration memory |
| Multi-standard SelectIO technology | Allows mixed-voltage I/O banks on single device, enabling direct interfacing with legacy and modern peripherals |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable datapath orchestrating ADC sampling, FFT computation, and CFAR detection with sub-microsecond latency. Use Value: 480 DSP48E slices enable concurrent 1024-point FFTs at 125 MSPS; GTP transceivers stream raw RF data to host processors at 3.125 Gbps. | Use Scenario: High-throughput image reconstruction in CT and MRI scanners using iterative algorithms. IC Role / Device Role / Timing Role: Hardware-accelerated backprojection and denoising engine tightly coupled with DDR2 memory controllers. Use Value: 4.2 MB block RAM buffers projection datasets locally; 480 user I/Os interface directly with 16-bit ADCs and DACs without glue logic. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O aggregation in flight control computers. IC Role / Device Role / Timing Role: Deterministic protocol bridge with time-stamped packet routing and built-in error correction. Use Value: -1 speed grade ensures worst-case timing closure across -40°C to +100°C; dual-voltage I/O banks interface with 5V legacy avionics and 3.3V sensors. | Use Scenario: Bit-error-rate testing and protocol validation for 3G/4G baseband ICs and optical transceivers. IC Role / Device Role / Timing Role: Programmable pattern generator and analyzer with precise edge placement and jitter injection. Use Value: GTP transceivers operate at 3.75 Gbps with <1 ps RMS jitter; CLB delay spec enables <100 ps timing resolution in capture logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-end reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-1FF1136I | Higher logic density (110,592 CLBs), more DSP slices (576), larger package (1136-pin FBGA) | Required when >85K logic cells or >480 DSP slices are needed; demands larger PCB area and higher power delivery | Select only if design exceeds XC5VLX85-1FF676I resource utilization by >15% and board layout accommodates FF1136 |
| XCVU9P-2FFVB2104I | UltraScale architecture, 258,600 logic cells, 2,592 UltraScale+ DSP units, 48.5 GB/s memory bandwidth | Targets next-generation 5G, AI inference, and 400G Ethernet where legacy Virtex-5 lacks throughput or efficiency | Choose for new designs requiring >2× logic density or PCIe Gen3/Gen4; not drop-in compatible due to architecture and pinout differences |
Compared with XC5VLX85-1FF676I, XC5VLX110-1FF1136I offers scalable resources within the same Virtex-5 family but increases board complexity, while XCVU9P-2FFVB2104I delivers generational performance gains at the cost of full redesign-neither is pin-compatible, and both require distinct toolchain and timing closure strategies.
Availability
XC5VLX85-1FF676I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC5VLX85-1FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, aerospace, and industrial applications.
The Virtex-5 family was originally designed by Xilinx to deliver high-performance reconfigurable logic with integrated serial transceivers and DSP resources for compute-intensive embedded systems.
FAQ
What is the operating temperature range for XC5VLX85-1FF676I?
The XC5VLX85-1FF676I is rated for industrial temperature operation from –40°C to +100°C ambient. This rating applies to the junction temperature under specified airflow and PCB thermal design conditions. The -1 speed grade guarantees timing performance across this full range, making XC5VLX85-1FF676I suitable for harsh-environment deployments such as avionics and downhole oilfield equipment.
Does XC5VLX85-1FF676I support JTAG boundary-scan testing?
Yes, XC5VLX85-1FF676I fully complies with IEEE 1149.1 (JTAG) standard. It includes dedicated TDI, TDO, TMS, TCK, and TRTST pins for boundary-scan testing, programming, and debug. The JTAG interface supports configuration, readback, and real-time debugging via Xilinx ChipScope or third-party tools, and is electrically isolated from user I/O banks.
Can XC5VLX85-1FF676I be configured using SPI flash memory?
No, XC5VLX85-1FF676I does not support native SPI flash configuration. It requires Master SelectMAP or Slave SelectMAP mode using parallel NOR flash (x8 or x16 data bus), or JTAG. While external SPI-to-parallel bridge chips can be used, the XC5VLX85-1FF676I itself lacks internal SPI controller logic for direct boot from SPI flash.
What is the maximum supported I/O standard voltage for XC5VLX85-1FF676I?
The XC5VLX85-1FF676I supports I/O voltages up to 3.3 V across its SelectIO banks. Each bank is independently configurable for LVCMOS, LVTTL, SSTL, or HSTL standards at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V. Banks must be powered at the selected VCCO voltage, and no I/O standard exceeds 3.3 V tolerance.
Is bitstream encryption available on XC5VLX85-1FF676I?
Yes, XC5VLX85-1FF676I supports AES-128 bitstream encryption using a 128-bit key stored in on-chip battery-backed RAM or external eFUSE. Encryption is enabled during bitstream generation in Vivado or ISE tools and verified during configuration. The XC5VLX85-1FF676I also supports HMAC authentication to prevent tampering.
XC5VLX85-1FF676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX85-1FF676I FAQ
1.How can I place an order for XC5VLX85-1FF676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-1FF676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX85-1FF676I reliable?
The price and inventory of XC5VLX85-1FF676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-1FF676I is usually 5 days.
3.What payment methods are accepted for XC5VLX85-1FF676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX85-1FF676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX85-1FF676I?
XC5VLX85-1FF676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX85-1FF676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX85-1FF676I?
For technical support, including XC5VLX85-1FF676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-1FF676I requirements.
6.How does Aetrix verify that XC5VLX85-1FF676I is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-1FF676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-1FF676I meets industry standards.
7.What is the process for return or replacement of XC5VLX85-1FF676I?
All XC5VLX85-1FF676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-1FF676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-1FF676I part is unused and in its original packaging.
Return procedure for XC5VLX85-1FF676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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