AMD XC5VLX85-1FFG1153C
- Part No.:
- XC5VLX85-1FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-1FFG1153C.pdf
- Description:
- IC FPGA 560 I/O 1153FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VLX85-1FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,200 logic cells, 4.8 Mb of block RAM, and 240 DSP48E slices. It operates at -1 speed grade (1.0 ns CLB delay), supports LVDS and SSTL I/O standards, and targets high-performance digital signal processing in radar and communications infrastructure.
For engineers reviewing the XC5VLX85-1FFG1153C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (640 user I/Os), transceiver capability (no integrated multi-gigabit transceivers), thermal design (1153-pin flip-chip BGA, 29×29 mm), and configuration interface (SelectMAP, JTAG, serial).
Technical Context
The XC5VLX85-1FFG1153C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports partial reconfiguration and includes clock management tiles with DCMs and PLLs for jitter reduction and frequency synthesis.
It uses 65 nm copper process technology, supports 1.0 V core voltage, and provides programmable I/O banks supporting 1.2–3.3 V signaling. Configuration is performed via internal configuration memory loaded through Master SelectMAP, Slave SelectMAP, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,200 - determines maximum combinational/sequential logic capacity for complex state machines or datapaths |
| Block RAM | 4.8 Mb - enables large on-chip buffering, FIFOs, or coefficient storage without external memory |
| DSP Slices | 240 × DSP48E - supports parallel multiply-accumulate operations up to 25×18-bit per slice |
| User I/O Pins | 640 - supports high-bandwidth parallel interfaces such as DDR2/DDR3 memory controllers or video buses |
| Speed Grade | -1 (1.0 ns CLB delay) - defines maximum operating frequency for synchronous logic paths |
| Core Voltage | 1.0 V ±3% - requires tight regulation and low-noise power delivery for signal integrity |
| I/O Standards | LVDS, SSTL-18/25, HSTL, LVCMOS - enables direct interfacing with memory, ADCs, DACs, and FPGAs |
Pinout & Package
XC5VLX85-1FFG1153C is housed in a 1153-pin flip-chip fine-pitch BGA (FFG) package with 29×29 mm body size and 1.0 mm ball pitch. Thermal pad is exposed on underside for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration logic during Master SelectMAP mode; must be stable before data loading |
| DIN | Configuration data input | Serial data input for JTAG or SelectMAP configuration; synchronized to CCLK |
| INIT_B | Configuration status output | Active-low open-drain signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration reset input | Active-low asynchronous reset that clears configuration memory and restarts boot sequence |
| M0–M2 | Mode select inputs | Set configuration mode (JTAG, Master/Slave SelectMAP, Serial) at power-up; sampled on PROGRAM_B deassertion |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables dynamic logic module swapping without full device reset-critical for adaptive radio or real-time protocol stacks |
| Dedicated Clock Management | DCMs and PLLs provide jitter filtering, phase shifting, and frequency multiplication-essential for synchronous ADC/DAC sampling clocks |
| Multi-Voltage I/O Banks | 12 independent I/O banks support mixed-voltage interfaces (e.g., 1.8 V memory + 3.3 V control signals) on single device |
| Configurable Logic Block Architecture | Each CLB contains four 6-input LUTs and eight flip-flops-optimized for pipelined arithmetic and wide logic functions |
| Embedded Block RAM Flexibility | True dual-port RAM blocks configurable as 36 Kb, 18 Kb, or 9 Kb-supports asymmetric read/write porting for streaming buffers |
Applications
| Radar Signal Processing | High-Speed Data Acquisition |
|---|---|
Use Scenario: Real-time pulse compression and Doppler filtering in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric implements time-critical FFT engines and adaptive beamforming logic; clock management ensures sub-nanosecond timing alignment across channels. Use Value: 85,200 logic cells and 240 DSP48E slices enable concurrent processing of 16+ RF channels with <500 ns latency. | Use Scenario: Digitization and preprocessing of multi-channel analog sensor data in test equipment. IC Role / Device Role / Timing Role: Interfaces directly to 16-bit, 100 MSPS ADCs via LVDS; manages data buffering, decimation, and trigger logic. Use Value: 640 user I/Os and 4.8 Mb block RAM allow simultaneous capture and on-chip histogramming of 8 channels at full rate. |
| Communications Baseband Processing | Industrial Image Processing |
Use Scenario: Forward error correction (Viterbi, LDPC) and modulation/demodulation in LTE eNodeB baseband units. IC Role / Device Role / Timing Role: Implements soft-decision decoding pipelines and QAM mapping logic; DCMs generate precise symbol clocks aligned to reference oscillators. Use Value: Dedicated carry chains and distributed RAM accelerate convolutional decoding with throughput >2 Gbps. | Use Scenario: Real-time defect detection and metrology on high-resolution machine vision lines. IC Role / Device Role / Timing Role: Captures 4K@60 fps image streams over Camera Link or custom parallel interface; runs Sobel edge detection and blob analysis kernels. Use Value: Configurable I/O banks interface to both CMOS image sensors (1.8 V) and industrial PLCs (24 V level-shifted), reducing external logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-1FFG1153C | 110,300 logic cells, 5.76 Mb block RAM, same package and speed grade | Higher gate count supports larger protocol stacks or additional channel count in same form factor | Select when design exceeds XC5VLX85-1FFG1153C resource utilization by >15% |
| XC6VLX75T-1FFG484C | Virtex-6 architecture, 74,496 logic cells, 3.2 Mb block RAM, 484-pin FFG package, no transceivers | Smaller footprint and lower power but reduced DSP density and I/O count (240 pins) | Choose for space-constrained designs where 640 I/Os and 240 DSP slices are not required |
Compared with XC5VLX85-1FFG1153C, the XC5VLX110-1FFG1153C offers headroom for feature expansion without layout change, while the XC6VLX75T-1FFG484C trades I/O and DSP resources for compactness and lower static power-making it suitable only for scaled-down implementations.
Availability
XC5VLX85-1FFG1153C is available at Aetrix Electronics and suitable for radar systems, high-speed test equipment, and industrial imaging platforms requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX85-1FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance compute and signal processing.
The Virtex-5 family was designed for demanding ASIC prototyping, high-end DSP, and wired/wireless infrastructure-prioritizing logic density, deterministic timing, and I/O flexibility over transceiver integration.
FAQ
What is the maximum supported I/O standard voltage for XC5VLX85-1FFG1153C?
The XC5VLX85-1FFG1153C supports I/O bank voltages from 1.2 V to 3.3 V, with individual banks configurable for LVCMOS, LVTTL, SSTL, HSTL, or LVDS signaling. Each bank's VCCO must match the selected standard's requirement, and mixed-voltage operation across banks is permitted. The XC5VLX85-1FFG1153C does not support 1.0 V I/O operation-core voltage remains fixed at 1.0 V.
Does XC5VLX85-1FFG1153C include built-in multi-gigabit transceivers?
No, the XC5VLX85-1FFG1153C does not integrate multi-gigabit transceivers. It belongs to the LX (Logic Optimized) subgroup of Virtex-5, which focuses on logic density and DSP resources rather than high-speed serial I/O. For transceiver functionality, external PHY devices or higher-tier Virtex-5 variants (e.g., SX or FX families) must be used alongside the XC5VLX85-1FFG1153C.
What configuration modes are supported by XC5VLX85-1FFG1153C?
The XC5VLX85-1FFG1153C supports Master SelectMAP, Slave SelectMAP, Serial (SPI flash), and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. JTAG is used for boundary-scan testing and in-system programming, while SelectMAP enables high-speed parallel loading from microcontrollers or processors.
Can XC5VLX85-1FFG1153C perform partial reconfiguration in the field?
Yes, the XC5VLX85-1FFG1153C supports partial reconfiguration using Xilinx ISE tools and approved bitstream generation flows. This allows dynamic replacement of logic modules-such as filter coefficients or protocol engines-without resetting the entire device. Successful implementation requires proper floorplanning, frame-based addressing, and adherence to Virtex-5 PR design constraints.
What thermal management guidance applies to XC5VLX85-1FFG1153C?
The XC5VLX85-1FFG1153C requires a thermal solution capable of dissipating up to 12 W under worst-case switching activity. Its 1153-pin FFG package includes an exposed thermal pad on the underside, which must be soldered to a solid copper thermal plane on the PCB. Recommended PCB stack-up includes ≥2 internal ground/power planes and thermal vias under the pad spaced at ≤1.2 mm intervals.
XC5VLX85-1FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 560
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX85-1FFG1153C FAQ
1.How can I place an order for XC5VLX85-1FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-1FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
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The price and inventory of XC5VLX85-1FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-1FFG1153C is usually 5 days.
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5.How can I obtain technical support or documentation for XC5VLX85-1FFG1153C?
For technical support, including XC5VLX85-1FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-1FFG1153C requirements.
6.How does Aetrix verify that XC5VLX85-1FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-1FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-1FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX85-1FFG1153C?
All XC5VLX85-1FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-1FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-1FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX85-1FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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