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AMD XC5VLX85-1FFG676C
- Part No.:
- XC5VLX85-1FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-1FFG676C.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,850
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Product details
Overview
XC5VLX85-1FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,200 logic cells, 4.8 Mb of block RAM, 240 DSP48E slices, and a -1 speed grade with guaranteed 650 MHz I/O performance. It is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package and targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC5VLX85-1FFG676C datasheet, pinout, applications, or equivalent options, key selection considerations include I/O voltage support (1.2 V to 3.3 V), differential signaling compliance (LVDS, RSDS, BLVDS), embedded memory depth, and transceiver lane count for serial interface integration.
Technical Context
The XC5VLX85-1FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive operations, and SelectIO technology supporting multi-standard I/O. It integrates 12 RocketIO GTP transceivers operating up to 3.75 Gb/s for serial connectivity.
Configuration is performed via Master SelectMAP or JTAG, with bitstream security enabled through AES encryption. The device supports partial reconfiguration and operates across commercial temperature range (0°C to 85°C) with core voltage of 1.0 V ±3%.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,200 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Block RAM | 4.8 Mb - enables large on-chip data buffering for FFT, filtering, or frame storage without external memory |
| DSP Slices | 240 × DSP48E - provides fixed-point multiply-accumulate capability at up to 550 MHz for real-time signal processing |
| GTP Transceivers | 12 × 3.75 Gb/s - supports multi-lane serial interfaces such as CPRI, Serial RapidIO, or custom high-speed links |
| I/O Standards | LVDS, RSDS, BLVDS, SSTL, HSTL - allows direct interfacing to ADCs, DACs, and FPGAs without level-shifting circuitry |
| Speed Grade | -1 - guarantees timing closure at 650 MHz I/O toggle rate and defines maximum internal clock frequency limits |
| Operating Temp | 0°C to +85°C - validated for use in commercial-grade communications infrastructure equipment |
Pinout & Package
XC5VLX85-1FFG676C is packaged in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) with 27 × 27 array, 1.0 mm ball pitch, and thermal lid. Package dimensions are 27 mm × 27 mm, with exposed thermal pad for enhanced heat dissipation in high-clock-rate operation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration logic during Master SelectMAP mode; requires stable 50 MHz source |
| DIN | Configuration Data Input | Serial bitstream input for FPGA programming; synchronous to CCLK edge |
| INIT_B | Configuration Status Output | Active-low open-drain signal indicating configuration status and error detection |
| PROGRAM_B | Configuration Reset Input | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| M0–M2 | Mode Selection Inputs | Define configuration mode (JTAG, Slave SelectMAP, Master SelectMAP, etc.) at power-up |
| VRN/VRP | Differential Reference Pins | Set termination voltage for differential I/O standards like LVDS when used with internal termination |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm copper process | Enables higher logic density and lower dynamic power vs. previous 90 nm Virtex-4 generation |
| Integrated PCI Express Endpoint | Reduces external logic count for PCIe Gen1 x1/x2/x4 endpoint designs in host-facing applications |
| AES Bitstream Encryption | Prevents IP theft by securing configuration data stored in external PROM or flash memory |
| Partial Reconfiguration Support | Allows runtime modification of functional blocks without resetting entire system or halting operation |
| SelectIO Technology | Supports 20+ I/O standards with programmable drive strength, slew rate, and on-die termination |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical signal conditioning, matched filtering, and CFAR detection algorithms. Use Value: 240 DSP48E slices enable parallel FIR filter banks with sub-microsecond latency per channel. | Use Scenario: High-throughput image reconstruction pipeline in MRI and CT scanner backends. IC Role / Device Role / Timing Role: XC5VLX85-1FFG676C serves as the central data aggregator and preprocessing engine between ADC arrays and host CPU. Use Value: 4.8 Mb block RAM buffers full-frame k-space data while enabling on-the-fly Fourier transform acceleration. |
| Wireless Base Station Radio Unit | High-Speed Test Equipment |
Use Scenario: Digital front-end (DFE) for LTE and 5G NR radio units requiring adaptive pre-distortion and crest factor reduction. IC Role / Device Role / Timing Role: XC5VLX85-1FFG676C implements real-time DPD coefficient update engines and wideband IQ modulation paths. Use Value: 12 GTP transceivers interface directly to dual-channel RFICs at 3.75 Gb/s, eliminating SerDes bridging ICs. | Use Scenario: Pattern generator and response analyzer in automated test equipment for ASIC validation. IC Role / Device Role / Timing Role: Configurable I/O bank structure and deterministic timing control enable precise stimulus/response capture at >650 MHz toggle rates. Use Value: -1 speed grade ensures setup/hold margins for 1.2 ns clock-to-out and 0.8 ns input setup in boundary-scan test modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-1FFG1136C | Higher logic density (110,592 CLBs), larger FFG1136 package, +20% more block RAM | Suitable for designs requiring additional parallel processing lanes or larger on-chip FIFOs | Select when XC5VLX85-1FFG676C resource utilization exceeds 90% and board layout allows larger footprint |
| XCKU060-2FFVA1156I | Kintex UltraScale architecture, 20 nm process, 420K logic cells, no native GTP (uses GTY) | Better suited for new designs targeting higher bandwidth, lower power, and PCIe Gen3/Gen4 | XC5VLX85-1FFG676C remains appropriate for legacy radar or medical systems where pin compatibility and long-term availability are critical |
Compared with XC5VLX110-1FFG1136C and XCKU060-2FFVA1156I, the XC5VLX85-1FFG676C offers optimal balance of mature toolchain support, proven reliability in harsh environments, and sufficient resources for mid-scale signal processing without over-provisioning.
Availability
XC5VLX85-1FFG676C is available at Aetrix Electronics and suitable for radar subsystems, medical imaging platforms, and wireless infrastructure requiring stable component supply across extended production lifecycles.
Supply support for XC5VLX85-1FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Virtex product family for high-performance programmable logic solutions targeting aerospace, defense, and industrial markets.
The Virtex-5 family was engineered for compute-intensive digital signal processing applications demanding deterministic timing, high I/O bandwidth, and embedded hard IP integration - especially in radar, imaging, and wired/wireless communications.
FAQ
What is the maximum supported I/O standard voltage for XC5VLX85-1FFG676C?
The XC5VLX85-1FFG676C supports I/O bank voltages from 1.2 V to 3.3 V, with each of its 12 I/O banks independently configurable. This enables mixed-voltage interfacing-for example, connecting 1.8 V ADCs and 3.3 V microcontrollers on the same device-without external level shifters. The XC5VLX85-1FFG676C datasheet specifies VCCO tolerance of ±3% per bank.
Does XC5VLX85-1FFG676C support partial reconfiguration in production systems?
Yes, XC5VLX85-1FFG676C supports verified partial reconfiguration through Xilinx ISE Design Suite 14.7 tools. It allows dynamic swapping of functional modules-such as changing filter coefficients or communication protocols-without disrupting active logic elsewhere. The XC5VLX85-1FFG676C implementation requires dedicated configuration controller logic and careful floorplanning to isolate reconfigurable regions.
How many RocketIO GTP transceivers does XC5VLX85-1FFG676C include?
The XC5VLX85-1FFG676C integrates 12 RocketIO GTP transceivers, each capable of serial data rates up to 3.75 Gb/s. These transceivers support protocols including CPRI, Serial RapidIO, Aurora, and custom 8B/10B encoded links. The XC5VLX85-1FFG676C places all 12 GTPs in the top and bottom I/O banks for optimized PCB routing in high-speed backplane applications.
Is XC5VLX85-1FFG676C qualified for extended temperature operation?
No, XC5VLX85-1FFG676C is rated only for commercial temperature range (0°C to +85°C). For extended industrial (-40°C to +100°C) or military-grade operation, designers must select the XC5VLX85-1FFG676I variant, which undergoes additional screening and qualification testing. The XC5VLX85-1FFG676C part number explicitly denotes the commercial-grade version.
Can XC5VLX85-1FFG676C be configured via JTAG in-system?
Yes, XC5VLX85-1FFG676C supports IEEE 1149.1 JTAG boundary-scan configuration for both programming and debugging. It uses the TCK/TMS/TDI/TDO pins and supports multiple daisy-chained devices. JTAG configuration is commonly used for initial prototyping and field firmware updates, and the XC5VLX85-1FFG676C complies fully with Xilinx's Impact and Vivado hardware server protocols.
XC5VLX85-1FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX85-1FFG676C FAQ
1.How can I place an order for XC5VLX85-1FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-1FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX85-1FFG676C reliable?
The price and inventory of XC5VLX85-1FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-1FFG676C is usually 5 days.
3.What payment methods are accepted for XC5VLX85-1FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX85-1FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX85-1FFG676C?
XC5VLX85-1FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX85-1FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX85-1FFG676C?
For technical support, including XC5VLX85-1FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-1FFG676C requirements.
6.How does Aetrix verify that XC5VLX85-1FFG676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-1FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-1FFG676C meets industry standards.
7.What is the process for return or replacement of XC5VLX85-1FFG676C?
All XC5VLX85-1FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-1FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-1FFG676C part is unused and in its original packaging.
Return procedure for XC5VLX85-1FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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