AMD XC5VLX85-2FF676I

Overview

XC5VLX85-2FF676I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,200 logic cells, 4.8 Mb of block RAM, and 240 DSP48E slices, configured in a 676-pin Fine-Pitch Flip-Chip BGA (FF676) package with -2 speed grade and Industrial temperature range (-40°C to +100°C). It targets high-performance digital signal processing and embedded vision systems requiring deterministic timing and multi-gigabit serial I/O.

For engineers reviewing the XC5VLX85-2FF676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, transceiver count (24 GTP), I/O voltage support (1.2 V to 3.3 V), and industrial-grade thermal reliability.

Technical Context

The XC5VLX85-2FF676I implements a hierarchical FPGA architecture with six distinct logic tile types-LUT-based SLICEs, dedicated DSP48E blocks for multiply-accumulate operations, and integrated Block RAMs organized as 36 Kb dual-port primitives. Its clocking system includes 32 DCMs and 16 PLLs supporting phase alignment, frequency synthesis, and jitter reduction across multiple domains.

It integrates 24 GTP transceivers operating up to 3.75 Gb/s per lane, compliant with PCIe Gen1, SATA, and Serial RapidIO standards. I/O banks support independent voltage assignment per bank, enabling mixed-voltage interface design with SSTL, LVCMOS, HSTL, and differential signaling standards.

Key Specifications

Pinout & Package

XC5VLX85-2FF676I is housed in a 27×27 mm, 676-ball Fine-Pitch Flip-Chip BGA (FF676) package with 1.0 mm ball pitch, designed for high-density PCB layouts and thermal dissipation via internal silicon die attach and solder bump array.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density FPGA applications.

Compared with XCVU9P-2FLGA2104I and XC6VLX75T-2FF784I, the XC5VLX85-2FF676I delivers optimal balance of mature industrial qualification, deterministic timing predictability, and 24-channel 3.75 Gb/s I/O-making it preferred for deployed avionics and medical systems where long-term supply stability and verification continuity outweigh raw performance gains.

Availability

XC5VLX85-2FF676I is available at Aetrix Electronics and suitable for medical imaging subsystems, avionics data concentrators, industrial machine vision controllers, and test & measurement signal generators requiring stable component supply across extended product lifecycles.

Supply support for XC5VLX85-2FF676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and maintains the Virtex FPGA portfolio for high-performance programmable logic solutions targeting aerospace, defense, and industrial markets.

The Virtex-5 family was engineered for deterministic, high-bandwidth digital signal processing in safety-critical embedded systems-emphasizing timing predictability, radiation tolerance, and long-term manufacturability.

FAQ

What is the maximum operating frequency of the XC5VLX85-2FF676I core logic?

The XC5VLX85-2FF676I -2 speed grade guarantees reliable operation of synchronous logic paths up to 500 MHz under worst-case industrial conditions (100°C, 0.95 V VCCINT), as validated by Xilinx timing analysis tools and characterized silicon data. Actual achievable frequency depends on design complexity, routing congestion, and clock domain partitioning. The XC5VLX85-2FF676I supports this performance with its optimized carry chain and distributed register architecture.

Does the XC5VLX85-2FF676I support JTAG boundary-scan testing?

Yes, the XC5VLX85-2FF676I fully complies with IEEE 1149.1 (JTAG) standard and includes dedicated TCK, TMS, TDI, and TDO pins for boundary-scan testing, programming, and debug access. It supports INTEST, EXTEST, and SAMPLE/PRELOAD instructions, enabling PCB-level fault detection and configuration verification. This capability is integral to the XC5VLX85-2FF676I's test infrastructure and documented in Xilinx UG191.

Can the XC5VLX85-2FF676I interface directly with DDR3 SDRAM?

Yes, the XC5VLX85-2FF676I includes hard memory controller logic supporting DDR2 and DDR3 SDRAM up to 400 MHz data rates with 64-bit data bus width. It provides calibrated I/O timing, write leveling, and read leveling features. The XC5VLX85-2FF676I implements this via its MIG (Memory Interface Generator) IP core, which is synthesizable and verified for industrial temperature operation.

What thermal management guidance applies to the XC5VLX85-2FF676I in industrial environments?

The XC5VLX85-2FF676I is rated for -40°C to +100°C junction temperature and requires a PCB thermal pad, thermal vias under the package, and airflow ≥200 LFM for continuous operation at full utilization. Xilinx recommends a 4-layer board with internal ground/power planes and copper pour on outer layers. Thermal performance data for the XC5VLX85-2FF676I is provided in Xilinx UG193, including θJA and ψJT values for FF676 package.

Is partial reconfiguration supported on the XC5VLX85-2FF676I?

Yes, the XC5VLX85-2FF676I supports dynamic partial reconfiguration (PR) through its ICAP (Internal Configuration Access Port) and frame-based bitstream loading mechanism. PR allows runtime swapping of logic modules without resetting the entire device. This feature is enabled in Xilinx ISE 14.7 and requires specific floorplanning and bitstream generation workflows. The XC5VLX85-2FF676I has been validated for PR in radar waveform adaptation and protocol gateway applications.