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AMD XC5VLX85-2FFG676C
- Part No.:
- XC5VLX85-2FFG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-2FFG676C.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,587
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Product details
Overview
XC5VLX85-2FFG676C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,200 logic cells, 4.25 Mb of block RAM, 240 DSP48E slices, and operates at -2 speed grade with 1.0 V core voltage. It is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG) package and used in high-performance digital signal processing and reconfigurable computing systems.
For engineers reviewing the XC5VLX85-2FFG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (448 user I/Os), differential signaling support (LVDS, RSDS), embedded memory depth, DSP slice precision (18×25-bit multiply-accumulate), and thermal performance in compact high-density PCB layouts.
Technical Context
The XC5VLX85-2FFG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated routing, and hardened IP blocks including PCI Express® Endpoint v1.1, tri-mode Ethernet MAC, and RocketIO™ GTP transceivers supporting up to 3.75 Gb/s. It supports SelectIO™ standards including LVCMOS, SSTL, HSTL, and differential protocols.
Configuration is performed via Master Serial, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device includes internal configuration monitoring, CRC error checking, and dual-boot capability for field-upgradable designs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,200 - determines maximum combinational/sequential logic capacity for complex state machines or pipeline stages |
| Block RAM | 4.25 Mb - supports large on-chip data buffers, FIFOs, or lookup tables without external memory |
| DSP Slices | 240 × DSP48E - enables parallel fixed-point arithmetic for real-time filtering or FFT computation |
| User I/O Pins | 448 - provides high interconnect density for multi-protocol interface bridging or sensor aggregation |
| Transceiver Speed | Up to 3.75 Gb/s - enables serial connectivity to ADCs, DACs, or FMC mezzanine modules |
| Core Voltage | 1.0 V ±3% - requires tight-regulation DC-DC supply with low-noise layout for timing closure |
| Speed Grade | -2 - guarantees timing performance at worst-case junction temperature (85°C) and voltage |
Pinout & Package
XC5VLX85-2FFG676C is packaged in a 676-ball Flip-Chip Fine-Pitch BGA (FFG) with 1.0 mm ball pitch, designed for high thermal dissipation and signal integrity in dense HDI PCBs. The package supports edge-aligned and center-aligned mounting per IPC-7351B.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V supply for CLBs, DSP slices, and internal routing; requires local decoupling |
| VCCAUX | Auxiliary power supply | 2.5 V supply for configuration logic, clock management, and SelectIO banks |
| VCCO | I/O bank power | Configurable per-bank (1.2–3.3 V); sets output swing and input threshold for connected peripherals |
| CONFIG_IO | Configuration I/O | Multi-function pins used during startup for mode selection, INIT_B, PROGRAM_B, and CCLK |
| MRCC/DRCC | Multi-Region Clock Input | Dedicated differential clock inputs feeding regional clock networks with low skew |
| GTP_CLK | Transceiver reference clock | LVDS/LVPECL input for GTP transceiver PLL; must meet jitter and phase noise specs |
Key Features
| Feature | Design Value |
|---|---|
| PCI Express Endpoint v1.1 | Hardened root port/endpoint logic enabling plug-and-play host communication without soft-core overhead |
| RocketIO GTP Transceivers | Eight 3.75 Gb/s serial lanes with built-in 8B/10B encoding and elastic buffers for jitter tolerance |
| Tri-Mode Ethernet MAC | Integrated 10/100/1000 Mbps MAC with GMII/RGMII/MII interface support and flow control |
| ChipSync Source-Synchronous I/O | Enables deterministic timing capture of high-speed parallel interfaces like DDR2 SDRAM or video streams |
| Dual-Boot Configuration | Allows safe field updates by storing primary and backup bitstreams in external flash |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: Reconfigurable compute engine performing parallel FFTs, CFAR detection, and SAR image reconstruction. Use Value: 240 DSP48E slices enable simultaneous 1024-point FFTs at 100+ MHz system clock; embedded block RAM stores intermediate coefficients without off-chip latency. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Data coalescer and accelerator interfacing with multiple ADC channels and GPU-based rendering subsystems. Use Value: 448 user I/Os support concurrent LVDS links to >16 ADCs; RocketIO transceivers stream raw voxel data to external memory at 3.2 Gb/s per lane. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429, MIL-STD-1553, and discrete I/O consolidation in flight control computers. IC Role / Device Role / Timing Role: Protocol bridge and deterministic scheduler managing time-triggered communication across heterogeneous avionics buses. Use Value: Hardened PCI Express endpoint allows direct connection to safety-certified host processors; -2 speed grade ensures operation at extended temperature range (-40°C to +100°C). | Use Scenario: Bit-error-rate testing and protocol validation for 3 Gbps serial interfaces. IC Role / Device Role / Timing Role: Programmable pattern generator and error detector with precise clock domain crossing and jitter injection. Use Value: GTP transceivers support PRBS-7/15/23/31 generation and BER measurement down to 1e-12; ChipSync I/O captures eye diagrams with sub-100 ps resolution. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-2FFG1136C | Higher logic capacity (110,592 LUTs), larger package (1136-ball FFG), +1.25 Mb additional block RAM | Suitable for larger algorithm partitioning or multi-channel systems requiring more parallel resources | Select when design exceeds XC5VLX85-2FFG676C resource utilization by >15% or requires >512 user I/Os |
| XCVU9P-2FFVA2104I | UltraScale architecture, 258,600 logic cells, 48.5 Mb block RAM, 28 Gb/s GTY transceivers, 0.85 V core | Targets next-generation 100G+ systems with higher bandwidth, lower power, and advanced memory interfaces (DDR4, PCIe Gen4) | Choose for new designs requiring long-term roadmap alignment, not drop-in replacement for XC5VLX85-2FFG676C |
Compared with XC5VLX85-2FFG676C, XC5VLX110-2FFG1136C offers scalable capacity within the same Virtex-5 family and toolflow, while XCVU9P-2FFVA2104I represents a generational shift-higher performance but incompatible toolchain, pinout, and power delivery requirements.
Availability
XC5VLX85-2FFG676C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentration, and high-speed test equipment requiring stable component supply over extended product lifecycles.
Supply support for XC5VLX85-2FFG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for hardware-accelerated workloads.
The Virtex-5 family was originally designed by Xilinx for high-end reconfigurable logic applications demanding high DSP density, serial connectivity, and predictable timing-targeting defense, aerospace, and medical imaging systems.
FAQ
What is the maximum operating junction temperature for XC5VLX85-2FFG676C?
The XC5VLX85-2FFG676C has a maximum allowable junction temperature of +100°C under continuous operation, validated per Xilinx DS106 specification. Thermal design must ensure that the silicon die remains below this limit using appropriate heatsinking, airflow, and PCB copper pour. The device includes on-die temperature sensors accessible via JTAG for runtime monitoring in deployed XC5VLX85-2FFG676C systems.
Does XC5VLX85-2FFG676C support JTAG boundary-scan testing?
Yes, XC5VLX85-2FFG676C fully complies with IEEE 1149.1 (JTAG) standard and supports boundary-scan testing of all user I/Os and internal logic. The TAP controller enables INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. This capability is used during board-level manufacturing test and field diagnostics for XC5VLX85-2FFG676C-based assemblies.
Can XC5VLX85-2FFG676C be configured using SPI flash memory?
No, XC5VLX85-2FFG676C does not support native SPI flash configuration. It requires x8 or x16 parallel NOR flash (e.g., Spansion S29GLxxx) or serial PROMs with x1/x2 serial interface (e.g., Xilinx XCFxxP series). Configuration occurs via Master SelectMAP or Slave SelectMAP mode, not SPI protocol-using SPI flash would require an external microcontroller to translate commands for XC5VLX85-2FFG676C.
What clock management resources are integrated into XC5VLX85-2FFG676C?
XC5VLX85-2FFG676C integrates four Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs), each supporting frequency synthesis, phase shifting, duty-cycle correction, and jitter filtering. These resources drive internal logic, I/O timing, and transceiver reference clocks. All DCMs and PLLs are independently configurable and can lock to input frequencies ranging from 12 MHz to 500 MHz for XC5VLX85-2FFG676C operation.
Is XC5VLX85-2FFG676C RoHS compliant and lead-free?
Yes, XC5VLX85-2FFG676C is RoHS-compliant and manufactured with lead-free (Pb-free) solder finish per J-STD-609. The FFG676 package uses matte tin plating over copper pillars. Full compliance documentation-including substance declarations and test reports-is available through AMD's Product Change Notification (PCN) archive for XC5VLX85-2FFG676C.
XC5VLX85-2FFG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX85-2FFG676C FAQ
1.How can I place an order for XC5VLX85-2FFG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-2FFG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX85-2FFG676C reliable?
The price and inventory of XC5VLX85-2FFG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-2FFG676C is usually 5 days.
3.What payment methods are accepted for XC5VLX85-2FFG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX85-2FFG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX85-2FFG676C?
XC5VLX85-2FFG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX85-2FFG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX85-2FFG676C?
For technical support, including XC5VLX85-2FFG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-2FFG676C requirements.
6.How does Aetrix verify that XC5VLX85-2FFG676C is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-2FFG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-2FFG676C meets industry standards.
7.What is the process for return or replacement of XC5VLX85-2FFG676C?
All XC5VLX85-2FFG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-2FFG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-2FFG676C part is unused and in its original packaging.
Return procedure for XC5VLX85-2FFG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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