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AMD XC5VLX85-2FFG676I
- Part No.:
- XC5VLX85-2FFG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-2FFG676I.pdf
- Description:
- IC FPGA 440 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,046
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Product details
Overview
XC5VLX85-2FFG676I from AMD is a Virtex-5 FPGA featuring 85,200 logic cells, 4.8 Gb/s transceiver capability, and -2 speed grade in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package. It serves as a high-performance programmable logic fabric for protocol bridging, digital signal processing, and embedded vision systems in aerospace and defense avionics.
For engineers reviewing the XC5VLX85-2FFG676I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, I/O bank voltage support, CLB density, block RAM capacity, and thermal performance under sustained operation.
Technical Context
The XC5VLX85-2FFG676I implements a hierarchical architecture with configurable logic blocks (CLBs), 18×36 dual-port block RAMs, and integrated RocketIO GTP transceivers supporting 1.0–3.75 Gb/s serial links. It includes dedicated DSP48E slices for high-speed arithmetic and supports SelectIO standards including LVDS, SSTL, and HSTL across 16 I/O banks.
Configuration occurs via Master SelectMAP or JTAG, with support for bitstream encryption using AES-256 and HMAC-SHA-256. The device operates over industrial temperature range (–40°C to +100°C) and requires multiple supply rails: VCCINT = 1.0V, VCCAUX = 2.5V, VCCO = 1.2–3.3V per bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,200 - total programmable fabric resources for combinatorial and sequential logic implementation |
| Block RAM | 4,032 kbits - distributed memory capacity usable for FIFOs, buffers, or lookup tables |
| Transceiver Speed | 1.0–3.75 Gb/s - serial link rate per RocketIO GTP channel, enabling PCIe Gen1/Gen2 and Serial RapidIO |
| I/O Pins | 448 user I/Os - configurable single-ended and differential signaling across 16 banks |
| Speed Grade | -2 - timing specification guaranteeing maximum operating frequency at rated voltage and temperature |
| Operating Temp | –40°C to +100°C - qualified for industrial and extended-temperature embedded applications |
Pinout & Package
XC5VLX85-2FFG676I is housed in a 676-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 27×27 array, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V rail powering CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCAUX | Auxiliary power supply | 2.5 V rail for configuration circuitry, clock management, and transceiver analog blocks |
| VCCO | I/O bank power | Programmable 1.2–3.3 V per bank enabling mixed-voltage interface design |
| CONFIG_IO | Configuration input | Dedicated pins for Master SelectMAP mode; supports parallel x8/x16 configuration bus |
| CLK_IN | Primary clock input | Differential pair for feeding MMCM or DCM clock management resources |
| GTP_RX/TX | Transceiver I/O | Dedicated differential pairs for high-speed serial data reception/transmission |
Key Features
| Feature | Design Value |
|---|---|
| Integrated GTP Transceivers | Eight 1.0–3.75 Gb/s RocketIO GTP channels enable native PCIe Gen1/Gen2 endpoint functionality without external PHY |
| DSP48E Slices | 192 dedicated arithmetic units support 25×18 signed multiplication and accumulation for real-time filtering and FFT |
| Block RAM Flexibility | Each 36 kbit block RAM can be configured as 36k × 1, 18k × 2, or 9k × 4, optimizing memory depth vs. width trade-offs |
| Multi-Voltage I/O Banks | 16 independent banks allow concurrent LVDS, SSTL-18, and HSTL-I interfaces on same device |
| Bitstream Encryption | AES-256 + HMAC-SHA-256 ensures secure configuration loading and prevents IP theft during field updates |
Applications
| Radar Signal Processing | Avionics Data Concentrator |
|---|---|
Use Scenario: Real-time pulse-Doppler processing in airborne radar systems requiring deterministic latency and high throughput. IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and SAR image reconstruction pipelines with cycle-accurate timing control. Use Value: 85K logic cells and 192 DSP48E slices deliver >20 GOPS computational density while maintaining sub-100 ns interrupt response. | Use Scenario: Aggregation and protocol translation between ARINC 429, MIL-STD-1553, and Ethernet interfaces in flight control computers. IC Role / Device Role / Timing Role: Programmable logic implements multi-protocol state machines, time-stamped packet buffering, and deterministic arbitration logic. Use Value: 448 user I/Os and 16 independently biased I/O banks enable simultaneous legacy bus interfacing without level-shifter components. |
| Secure Communications Module | Electronic Warfare Front-End |
Use Scenario: Field-upgradable cryptographic module for SATCOM terminals requiring tamper-resistant configuration storage. IC Role / Device Role / Timing Role: Configuration controller enforces AES-256 encrypted bitstream loading and HMAC integrity verification before logic initialization. Use Value: On-chip encryption eliminates need for external secure boot ROM and reduces BOM count by two ICs. | Use Scenario: Wideband RF digitization and adaptive jamming waveform generation in tactical EW pods. IC Role / Device Role / Timing Role: High-speed I/O and transceivers interface directly with ADC/DACs; CLBs implement real-time spectral analysis and LUT-based waveform synthesis. Use Value: –2 speed grade guarantees 500 MHz system clock timing closure for 12-bit, 1 GS/s sampling paths. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC5VLX110-2FFG1136I | Higher logic density (110,200 CLBs), larger FC-FBGA-1136 package, identical transceiver spec and speed grade | Required when >85K logic cells or >512 user I/Os are needed for expanded I/O expansion or larger algorithm partitioning | Select if board layout accommodates 1136-ball footprint and additional power delivery headroom is available |
| AMD XC6VLX75T-2FFG484I | Virtex-6 generation; lower logic count (75,025 CLBs), smaller 484-pin FCBGA, supports 6.6 Gb/s GTX transceivers | Better suited for cost-sensitive designs where PCIe Gen2 x4 endpoint bandwidth suffices and thermal envelope is constrained | Choose for migration path requiring higher serial bandwidth but reduced logic density and smaller form factor |
Compared with XC5VLX110-2FFG1136I, XC5VLX85-2FFG676I offers tighter PCB area and lower power at the expense of logic scalability; versus XC6VLX75T-2FFG484I, it provides mature toolchain support and proven radiation tolerance but lacks PCIe Gen3 readiness.
Availability
XC5VLX85-2FFG676I is available at Aetrix Electronics and suitable for radar signal processing, avionics data concentration, and secure communications modules requiring stable component supply across long-lifecycle military and aerospace programs.
Supply support for XC5VLX85-2FFG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, aerospace, and industrial applications.
The Virtex-5 family was engineered for demanding embedded systems requiring high logic density, multi-standard I/O, and integrated high-speed serial connectivity - particularly in defense electronics and scientific instrumentation.
FAQ
What is the maximum supported transceiver line rate for XC5VLX85-2FFG676I?
The XC5VLX85-2FFG676I integrates RocketIO GTP transceivers with a guaranteed line rate range of 1.0 to 3.75 Gb/s per channel. This enables compliance with PCIe Gen1 (2.5 Gb/s) and Gen2 (5.0 Gb/s) protocols using 8b/10b encoding, and supports Serial RapidIO at 3.125 Gb/s. The -2 speed grade ensures timing closure at the upper end of this range under industrial temperature conditions.
Does XC5VLX85-2FFG676I support bitstream encryption?
Yes, XC5VLX85-2FFG676I supports AES-256 encryption and HMAC-SHA-256 authentication for configuration bitstreams. This dual-layer security mechanism prevents unauthorized access to FPGA configuration data and ensures integrity verification before logic initialization. The feature is implemented in hardware and does not require external crypto controllers or firmware intervention.
What I/O standards are supported by XC5VLX85-2FFG676I?
XC5VLX85-2FFG676I supports LVDS, LVPECL, SSTL-18, SSTL-2, HSTL-I, HSTL-II, and PCI-X across its 16 user-configurable I/O banks. Each bank operates independently with selectable VCCO voltages from 1.2 V to 3.3 V, allowing mixed-voltage interface design without external level shifters. Differential standards are supported on dedicated pin pairs with internal termination.
What is the operating temperature range for XC5VLX85-2FFG676I?
XC5VLX85-2FFG676I is rated for industrial temperature operation from –40°C to +100°C. This extended range qualifies the device for deployment in avionics, ground vehicle electronics, and outdoor defense systems where ambient thermal cycling and conduction cooling impose stringent junction temperature limits. Thermal design must maintain Tj ≤ +125°C under worst-case power dissipation.
How many block RAMs does XC5VLX85-2FFG676I contain?
XC5VLX85-2FFG676I contains 224 block RAMs, each providing 36 kbits of dual-port memory. This yields a total block RAM capacity of 4,032 kbits. These resources are fully configurable as true dual-port, simple dual-port, or single-port RAM, and can also be used as ROM or shift registers depending on synthesis constraints and HDL instantiation.
XC5VLX85-2FFG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 676-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 440
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FCBGA (27x27)
XC5VLX85-2FFG676I FAQ
1.How can I place an order for XC5VLX85-2FFG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-2FFG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX85-2FFG676I reliable?
The price and inventory of XC5VLX85-2FFG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-2FFG676I is usually 5 days.
3.What payment methods are accepted for XC5VLX85-2FFG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX85-2FFG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX85-2FFG676I?
XC5VLX85-2FFG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX85-2FFG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX85-2FFG676I?
For technical support, including XC5VLX85-2FFG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-2FFG676I requirements.
6.How does Aetrix verify that XC5VLX85-2FFG676I is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-2FFG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-2FFG676I meets industry standards.
7.What is the process for return or replacement of XC5VLX85-2FFG676I?
All XC5VLX85-2FFG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-2FFG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-2FFG676I part is unused and in its original packaging.
Return procedure for XC5VLX85-2FFG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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