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AMD XC5VLX85-3FFG1153C
- Part No.:
- XC5VLX85-3FFG1153C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1153-BBGA, FCBGA
- Datasheet:
-
XC5VLX85-3FFG1153C.pdf
- Description:
- IC FPGA 560 I/O 1153FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,589
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Product details
Overview
XC5VLX85-3FFG1153C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,440 logic cells, 4.8 Mb of block RAM, and 240 DSP48E slices. It operates at -3 speed grade (1.33 GHz internal clock), uses 1.0 V core voltage, and is packaged in a 1153-pin FCBGA with 0.8 mm pitch. It targets high-performance digital signal processing in radar baseband subsystems.
For engineers reviewing the XC5VLX85-3FFG1153C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, DSP slice count, I/O voltage support (1.2/1.5/1.8/2.5/3.3 V), transceiver line rate (up to 3.75 Gbps), and thermal performance in convection-cooled enclosures.
Technical Context
The XC5VLX85-3FFG1153C implements a hierarchical FPGA architecture with six distinct logic tile types, including Configurable Logic Blocks (CLBs), Block RAMs, and DSP48E slices arranged in columnar arrays. It supports SelectIO technology with programmable I/O standards and on-die termination.
It integrates 24 RocketIO GTP transceivers capable of 1.0–3.75 Gbps operation, each with dedicated clocking, encoding/decoding, and elastic buffers. The device uses a 65 nm copper process and requires separate 1.0 V (VCCINT), 1.2/1.5/1.8/2.5/3.3 V (VCCO), and 2.5 V (VCCAUX) supply rails.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 85,440 - determines maximum combinational/sequential logic capacity for complex state machines or protocol stacks |
| Block RAM | 4.8 Mb - supports large FIFOs, frame buffers, or coefficient storage without external memory |
| DSP Slices | 240 × DSP48E - enables parallel multiply-accumulate operations for FIR filters or FFT engines |
| Transceivers | 24 × RocketIO GTP - provides SerDes lanes for PCIe Gen1, SATA, or custom high-speed serial links |
| I/O Standards | LVCMOS, LVTTL, SSTL, HSTL, LVDS, Differential SSTL - ensures interoperability with diverse memory and interface ICs |
| Speed Grade | -3 - guarantees timing closure up to 1.33 GHz internal clock frequency under worst-case conditions |
| Package | 1153-pin FCBGA, 35×35 mm, 0.8 mm pitch - defines PCB footprint, thermal dissipation path, and routing density constraints |
Pinout & Package
The XC5VLX85-3FFG1153C is housed in a 1153-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size, 0.8 mm ball pitch, and standard JEDEC MO-271AC mechanical outline. Thermal pad on underside aids heat transfer to PCB ground plane.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.0 V rail powering CLBs, interconnect, and configuration logic; requires low-noise regulation |
| VCCO | I/O bank power | Configurable per-bank voltage (1.2–3.3 V) enabling mixed-voltage interface design |
| VCCAUX | Auxiliary power | 2.5 V supply for JTAG, clock management, and transceiver reference circuits |
| MR | Master reset | Active-low asynchronous reset that clears configuration memory and halts startup sequence |
| CCLK | Configuration clock | Input clock for slave-serial or boundary-scan configuration modes; not used in master-mode |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness or error during bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Advanced Clock Management | Four DCMs and two PLLs per device enable precise clock synthesis, phase alignment, and jitter reduction across multiple domains |
| SelectIO Technology | Programmable drive strength, slew rate, and on-die termination eliminate external resistors and reduce board area |
| Partial Reconfiguration | Allows dynamic replacement of logic modules without disrupting active system functions-critical for adaptive radio or real-time protocol updates |
| PCI Express Endpoint | Built-in hard IP supports x1/x2/x4 Gen1 PCIe endpoints with integrated DMA and TLP handling-reduces soft-core overhead |
| Power-Optimized Architecture | Multiple power-gating domains and dynamic power scaling reduce active power by up to 35% versus Virtex-4 at equivalent performance |
Applications
| Radar Baseband Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time pulse-Doppler processing and beamforming in ground-based surveillance radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical filtering, correlation, and CFAR algorithms with deterministic latency. Use Value: 240 DSP48E slices enable simultaneous 128-channel FFTs at 100 MHz sample rate, meeting STANAG 4676 latency requirements. | Use Scenario: High-throughput image reconstruction pipeline in CT scanner backends. IC Role / Device Role / Timing Role: XC5VLX85-3FFG1153C serves as the central data aggregator and preprocessing engine between detector ASICs and host CPU. Use Value: 4.8 Mb block RAM buffers full sinogram frames while 24 GTP transceivers stream 16-bit pixel data at 2.5 Gbps per link. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) and MIL-STD-1553B protocol bridging in flight control computers. IC Role / Device Role / Timing Role: XC5VLX85-3FFG1153C implements deterministic time-triggered communication stacks with hardware timestamping. Use Value: Dual-clock domain support and 1.33 GHz internal timing allow sub-microsecond jitter on AFDX transmit scheduling. | Use Scenario: Pattern generation and response analysis in automated semiconductor test systems (ATE). IC Role / Device Role / Timing Role: XC5VLX85-3FFG1153C acts as the high-speed vector sequencer and comparator engine. Use Value: 85,440 logic cells implement parallel 128-bit pattern generators with cycle-accurate stimulus injection and pass/fail evaluation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-density FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110-3FFG1153C | Higher logic count (110,592 cells), same package and speed grade; 20% more DSP slices and block RAM | Preferred for larger FFT sizes or multi-standard wireless baseband where resource headroom is critical | Select when XC5VLX85-3FFG1153C fails timing closure or exceeds utilization thresholds in final place-and-route |
| XCVU3P-2FFVD1760I | Virtex UltraScale+ device with 345K logic cells, 12.2 Mb BRAM, and 120 DSP slices; 16 nm process, higher transceiver count (40 × GTY) | Suitable for next-gen 5G NR or AI-accelerated edge inference where bandwidth and compute density exceed Virtex-5 limits | Choose for new designs requiring >3.75 Gbps serial links, PCIe Gen3, or DDR4 memory interfaces not supported by XC5VLX85-3FFG1153C |
Compared with XC5VLX85-3FFG1153C, the XC5VLX110-3FFG1153C offers direct scalability within the same footprint and toolchain, while the XCVU3P-2FFVD1760I enables architectural upgrades to higher bandwidth, lower power, and advanced memory protocols-but requires full RTL migration and new PCB layout.
Availability
XC5VLX85-3FFG1153C is available at Aetrix Electronics and suitable for radar baseband processing, medical imaging backend systems, avionics data concentrators, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC5VLX85-3FFG1153C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-5 family was originally designed by Xilinx for high-performance, high-bandwidth applications in aerospace, defense, and wired communications infrastructure.
FAQ
What is the maximum operating junction temperature for XC5VLX85-3FFG1153C?
The XC5VLX85-3FFG1153C has a maximum operating junction temperature of 100°C, validated under industrial temperature grade (-40°C to +100°C ambient). This rating assumes proper PCB thermal vias beneath the thermal pad and ≥200 LFM airflow. Exceeding this limit risks configuration loss or accelerated electromigration in the 65 nm copper interconnect.
Does XC5VLX85-3FFG1153C support JTAG boundary-scan testing?
Yes, XC5VLX85-3FFG1153C fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, TDO, and TROUT pins. The device implements BSDL version 2.0 and supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions for PCB-level interconnect verification and in-system programming.
Can XC5VLX85-3FFG1153C be configured using SPI flash memory?
Yes, XC5VLX85-3FFG1153C supports master SPI configuration mode using industry-standard quad-SPI or standard SPI flash devices. Configuration occurs automatically on power-up when MODE pins are set to 001, and the device drives SCLK and reads bitstream from flash address 0x000000.
What are the supported I/O standards for XC5VLX85-3FFG1153C banks?
XC5VLX85-3FFG1153C supports LVCMOS (1.2/1.5/1.8/2.5/3.3 V), LVTTL, SSTL (Class I/II), HSTL (Class I/III), and differential standards including LVDS, BLVDS, RSDS, and Differential SSTL. Each I/O bank is independently configurable for voltage and standard, but all pins in a bank must share the same VCCO.
Is partial reconfiguration supported on XC5VLX85-3FFG1153C?
Yes, XC5VLX85-3FFG1153C supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and dedicated PR boundary logic. This capability allows runtime swapping of functional modules-such as changing modulation schemes in SDR radios-without resetting the entire device or interrupting active I/O channels.
XC5VLX85-3FFG1153C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 LX
- Package/Case:
- 1153-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 6480
- Number of Logic Elements/Cells:
- 82944
- Total RAM Bits:
- 3538944
- Number of I/O:
- 560
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1153-FCBGA (35x35)
XC5VLX85-3FFG1153C FAQ
1.How can I place an order for XC5VLX85-3FFG1153C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VLX85-3FFG1153C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VLX85-3FFG1153C reliable?
The price and inventory of XC5VLX85-3FFG1153C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VLX85-3FFG1153C is usually 5 days.
3.What payment methods are accepted for XC5VLX85-3FFG1153C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VLX85-3FFG1153C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VLX85-3FFG1153C?
XC5VLX85-3FFG1153C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VLX85-3FFG1153C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VLX85-3FFG1153C?
For technical support, including XC5VLX85-3FFG1153C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VLX85-3FFG1153C requirements.
6.How does Aetrix verify that XC5VLX85-3FFG1153C is sourced from the original manufacturer or authorized distributors?
All XC5VLX85-3FFG1153C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VLX85-3FFG1153C meets industry standards.
7.What is the process for return or replacement of XC5VLX85-3FFG1153C?
All XC5VLX85-3FFG1153C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VLX85-3FFG1153C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VLX85-3FFG1153C part is unused and in its original packaging.
Return procedure for XC5VLX85-3FFG1153C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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