AMD XC5VLX85T-3FF1136C

Overview

XC5VLX85T-3FF1136C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 85,440 logic cells, 480 DSP48E slices, 4.2 MB of total block RAM, and a -3 speed grade with guaranteed 500 MHz system clock performance. It is housed in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1136) package and used in high-performance digital signal processing and reconfigurable computing systems.

For engineers reviewing the XC5VLX85T-3FF1136C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (640 user I/Os), transceiver capability (24 GTP serial transceivers up to 3.75 Gbps), and embedded memory bandwidth for real-time data buffering in radar and communications infrastructure.

Technical Context

The XC5VLX85T-3FF1136C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for arithmetic-intensive operations, and integrated SelectIO technology supporting LVDS, SSTL, HSTL, and differential signaling standards. It includes built-in clock management tiles (CMTs) with dual DCMs and PLLs for precise clock synthesis and phase alignment.

This device belongs to the Virtex-5 LX family optimized for logic density and balanced I/O-to-logic ratio. Its transceiver-rich T-platform variant integrates 24 GTP transceivers with programmable pre-emphasis and receiver equalization, enabling compliance with PCIe Gen1, Serial RapidIO, and CPRI protocols without external retimers.

Key Specifications

Pinout & Package

The XC5VLX85T-3FF1136C is packaged in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG1136) with 35×35 mm body size, 1.0 mm ball pitch, and thermal-enhanced construction for high-power FPGA operation. Pin functions are organized into I/O banks, configuration banks, dedicated clock inputs, and transceiver banks with differential pair routing constraints.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-density logic and transceiver applications.

Compared with XC5VLX85T-3FF1136C, the XC5VLX110T-3FF1136C offers headroom within identical footprint and toolchain, while the XCVU9P-2FFVB2104I delivers generational improvements in serial bandwidth and logic density at the cost of migration effort and higher BOM cost.

Availability

XC5VLX85T-3FF1136C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, wireless baseband processing, and industrial machine vision requiring stable component supply across long-life industrial programs.

Supply support for XC5VLX85T-3FF1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, formed through the acquisition of Xilinx in 2022.

The Virtex-5 family was originally developed by Xilinx for demanding high-speed logic, DSP, and serial connectivity applications in aerospace, defense, and wired/wireless infrastructure.

FAQ

What is the maximum operating junction temperature for XC5VLX85T-3FF1136C?

The XC5VLX85T-3FF1136C has a maximum allowable junction temperature of 100°C under industrial temperature grade (-40°C to +100°C ambient). Thermal design must ensure adequate heatsinking and airflow to maintain die temperature below this limit during sustained 500 MHz operation, especially when all 480 DSP48E slices and 24 GTP transceivers are active. The device's System Monitor reports real-time temperature for closed-loop thermal management.

Does XC5VLX85T-3FF1136C support JTAG boundary-scan testing?

Yes, XC5VLX85T-3FF1136C fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. The internal BSCAN_VIRTEX5 primitive enables comprehensive interconnect testing, I/O pin verification, and in-system programming of configuration PROMs. This capability is enabled by default after power-up and does not require user logic implementation.

Can XC5VLX85T-3FF1136C be configured via SPI flash memory?

Yes, XC5VLX85T-3FF1136C supports master SPI configuration mode using standard quad-SPI or standard SPI flash devices. Configuration occurs automatically on power-up when M0–M2 pins are set to 001, and the FPGA drives the SPI clock to read the bitstream from address 0x000000. Supported flash densities range from 16 Mb to 128 Mb, with fast-read and dual-output modes improving boot time.

What I/O standards are supported by XC5VLX85T-3FF1136C banks?

XC5VLX85T-3FF1136C supports LVCMOS, LVTTL, PCI, GTL, HSTL, SSTL, and differential standards including LVDS, RSDS, BLVDS, and TMDS across its 16 I/O banks. Each bank operates independently with selectable VCCO (1.2 V to 3.3 V) and optional VREF, enabling mixed-voltage interfaces on a single device-critical for bridging legacy and modern peripherals in industrial control systems.

Is there hardware support for partial reconfiguration in XC5VLX85T-3FF1136C?

Yes, XC5VLX85T-3FF1136C supports dynamic partial reconfiguration (PR) through its ICAP (Internal Configuration Access Port) and FRAME_ECC primitives. PR allows runtime swapping of logic modules-such as filter coefficients or protocol stacks-without disrupting active functions like transceiver links or memory controllers. Implementation requires PlanAhead or Vivado tools with appropriate license and careful floorplanning to define reconfigurable regions.