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AMD XC5VSX35T-1FFG665CES

Part No.:
XC5VSX35T-1FFG665CES
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VSX35T-1FFG665CES.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,723

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Product details

Overview

XC5VSX35T-1FFG665CES from AMD is a Virtex-5 FPGA featuring 34,656 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM (2,880 kbits). It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.

For engineers reviewing the XC5VSX35T-1FFG665CES datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (Xilinx Aurora, PCIe Gen1), DSP slice count (176), and thermal performance under sustained 1.0V core voltage operation.

Technical Context

The XC5VSX35T-1FFG665CES integrates 176 dedicated DSP48E slices for fixed/floating-point arithmetic and supports PCI Express x4 endpoint configuration via integrated RocketIO GTP transceivers. It uses 65 nm copper process technology and operates at -40°C to +100°C junction temperature.

This device belongs to the Virtex-5 SX family optimized for serial connectivity and digital signal processing. Its configuration interface supports Master SelectMAP mode at up to 100 MHz and JTAG boundary-scan per IEEE 1149.1.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells34,656 - determines maximum combinational/sequential logic capacity for RTL implementation
DSP Slices176 - enables parallel multiply-accumulate operations for FIR filters or FFT engines
Block RAM2,880 kbits - supports dual-port buffering of video frames or protocol packet queues
Transceiver Speed2.5 Gbps - meets minimum line rate for CPRI v4.1 and Serial RapidIO 1.2
I/O Pins448 - provides scalable interface count for ADC/DAC aggregation and backplane routing
Core Voltage1.0 V ±3% - defines power delivery tolerance and impacts dynamic power dissipation
Operating Temp-40°C to +100°C - qualifies for industrial and avionics environmental stress screening

Pinout & Package

XC5VSX35T-1FFG665CES is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 1.0 mm ball pitch and thermal lid. The package supports controlled impedance routing and meets IPC-7351B standard footprint.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockDrives internal configuration state machine during Master SelectMAP startup
DINConfiguration Data InSerial input for bitstream loading from external PROM or processor
INIT_BConfiguration StatusOpen-drain output indicating configuration memory readiness or error
PROGRAM_BConfiguration ResetActive-low signal that clears configuration memory and restarts boot sequence
M0–M2Mode SelectionDefines configuration interface mode (e.g., Master SPI, Slave SelectMAP)

Key Features

FeatureDesign Value
Embedded RocketIO GTP TransceiversSupports 2.5 Gbps serial links with built-in 8B/10B encoding and elastic buffers
DSP48E Slice ArchitectureDelivers 18×25-bit multiply-accumulate per slice with pipeline register control
SelectIO TechnologyEnables single-ended (LVCMOS, LVTTL) and differential (LVDS, RSDS) I/O standards on same bank
Partial Reconfiguration SupportAllows dynamic module swapping without full device reset or system interruption
System MonitorOn-die analog-to-digital converter for real-time die temperature and supply voltage monitoring

Applications

Radar Signal ProcessingMedical Imaging Backend

Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems.

IC Role / Device Role / Timing Role: FPGA fabric executes time-critical FFT and CFAR algorithms; transceivers interface with ADC front-end at 125 MSPS.

Use Value: Deterministic latency (<500 ns) and 176 DSP slices enable sub-microsecond response to target motion events.

Use Scenario: Digital backend for ultrasound beam synthesis and image reconstruction pipelines.

IC Role / Device Role / Timing Role: Configurable logic processes echo data streams from 64-channel ADCs; Block RAM buffers raw RF samples.

Use Value: 2,880 kbits of true dual-port RAM allows concurrent read/write access for pipelined scan conversion.

Avionics Data ConcentratorTest Equipment Pattern Generator

Use Scenario: ARINC 429/664 (AFDX) gateway aggregating sensor telemetry across multiple LRUs.

IC Role / Device Role / Timing Role: Implements deterministic time-triggered Ethernet switching and protocol translation logic.

Use Value: 448 I/O pins support mixed-voltage interfaces (3.3V/2.5V/1.8V) required by legacy and modern avionics buses.

Use Scenario: High-speed digital pattern generator for IC validation and ATE stimulus generation.

IC Role / Device Role / Timing Role: Generates synchronized multi-channel waveforms using programmable delay and phase control.

Use Value: 2.5 Gbps transceivers provide precise edge placement (±25 ps jitter) for timing-critical test vectors.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XCVU9P-2FLGA2104IUltraScale architecture; higher logic density (2,586K LC); 16.3 Gbps transceiversTargets next-gen 5G massive MIMO and AI inference accelerationChoose for new designs requiring >10 Gbps serial bandwidth and PCIe Gen4 support
XC7K325T-2FFG901I7-series architecture; lower transceiver speed (6.6 Gbps); 326,080 logic cellsSuitable for cost-sensitive industrial control and video processingChoose when migrating legacy Virtex-5 designs with minimal PCB change and lower power budget

Compared with XC5VSX35T-1FFG665CES, XCVU9P-2FLGA2104I offers higher bandwidth but requires new PCB layout and toolchain migration, while XC7K325T-2FFG901I provides pin-compatible migration path within same I/O voltage constraints and thermal envelope.

Availability

XC5VSX35T-1FFG665CES is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, avionics data concentrators, and test equipment pattern generation requiring stable component supply across extended product lifecycles.

Supply support for XC5VSX35T-1FFG665CES includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions for data centers, AI, embedded, and aerospace applications.

The Virtex-5 family was engineered for high-bandwidth digital signal processing and serial connectivity in mission-critical systems where deterministic timing and radiation-tolerant configuration are essential.

FAQ

What is the maximum supported transceiver data rate for XC5VSX35T-1FFG665CES?

The XC5VSX35T-1FFG665CES supports a maximum transceiver data rate of 2.5 Gbps per channel using its integrated RocketIO GTP transceivers. This rate is validated for protocols including CPRI v4.1 and Serial RapidIO 1.2. Operation above this rate is not supported, and sustained 2.5 Gbps operation requires proper reference clock jitter filtering and PCB impedance control per UG192.

Does XC5VSX35T-1FFG665CES support partial reconfiguration?

Yes, XC5VSX35T-1FFG665CES supports partial reconfiguration through its FPGA fabric and configuration logic. This capability enables dynamic module swapping without resetting the entire device or halting system operation. Implementation requires use of Xilinx ISE 14.7 tools and adherence to area-group partitioning rules defined in UG192.

What is the operating temperature range specified for XC5VSX35T-1FFG665CES?

XC5VSX35T-1FFG665CES is rated for industrial temperature operation from -40°C to +100°C junction temperature. This range is verified per JEDEC JESD22-A104 thermal cycling tests and applies to all I/O banks and core logic. Thermal derating is required above 85°C ambient when operating at maximum static power.

How many DSP48E slices does XC5VSX35T-1FFG665CES contain?

XC5VSX35T-1FFG665CES contains 176 DSP48E slices. Each slice delivers 18×25-bit multiplication with pre-adder, accumulator, and pipeline registers. These slices are distributed across the device fabric to support parallel execution of filter taps, matrix operations, or FFT butterfly stages without inter-slice routing bottlenecks.

What configuration modes are supported by XC5VSX35T-1FFG665CES?

XC5VSX35T-1FFG665CES supports Master SelectMAP, Slave SelectMAP, Master SPI, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SelectMAP enables direct loading from external parallel PROM at up to 100 MHz, while JTAG supports boundary-scan testing and in-system programming per IEEE 1149.1.

XC5VSX35T-1FFG665CES Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 SXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Obsolete
Programmable:
Not Verified
Number of LABs/CLBs:
2720
Number of Logic Elements/Cells:
34816
Total RAM Bits:
3096576
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VSX35T-1FFG665CES FAQ

1.How can I place an order for XC5VSX35T-1FFG665CES through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VSX35T-1FFG665CES on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VSX35T-1FFG665CES reliable?

The price and inventory of XC5VSX35T-1FFG665CES are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX35T-1FFG665CES is usually 5 days.

3.What payment methods are accepted for XC5VSX35T-1FFG665CES?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX35T-1FFG665CES transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VSX35T-1FFG665CES?

XC5VSX35T-1FFG665CES orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VSX35T-1FFG665CES order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VSX35T-1FFG665CES?

For technical support, including XC5VSX35T-1FFG665CES datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX35T-1FFG665CES requirements.

6.How does Aetrix verify that XC5VSX35T-1FFG665CES is sourced from the original manufacturer or authorized distributors?

All XC5VSX35T-1FFG665CES products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX35T-1FFG665CES meets industry standards.

7.What is the process for return or replacement of XC5VSX35T-1FFG665CES?

All XC5VSX35T-1FFG665CES units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX35T-1FFG665CES, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VSX35T-1FFG665CES part is unused and in its original packaging.

Return procedure for XC5VSX35T-1FFG665CES:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VSX35T-1FFG665CES Tags

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