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AMD XC5VSX35T-2FFG665C

Part No.:
XC5VSX35T-2FFG665C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VSX35T-2FFG665C.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,993

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Product details

Overview

XC5VSX35T-2FFG665C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 34,656 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM. It implements high-speed signal processing in radar baseband units and supports PCIe Gen1 endpoint functionality with integrated RocketIO transceivers.

For engineers reviewing the XC5VSX35T-2FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, I/O bank voltage support, configuration interface type, and thermal performance under sustained DSP load.

Technical Context

The XC5VSX35T-2FFG665C belongs to the Virtex-5 SXT family and integrates 24 RocketIO GTP transceivers operating at 1.0–2.5 Gbps, with dedicated clock management tiles supporting multi-phase PLLs and DCMs. It uses 65 nm copper process technology and includes 2,088 Kbits of total Block RAM.

Configuration is performed via Master SelectMAP mode using a parallel 32-bit bus or through JTAG, with support for fallback and dual-boot from external SPI flash. The device supports LVDS, SSTL, HSTL, and differential signaling standards across its 448 user I/O pins.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells34,656 - provides gate count equivalent to ~170K ASIC gates for complex RTL implementation
Transceiver Speed2.5 Gbps - enables PCIe Gen1 x1/x2/x4 links and Serial RapidIO physical layer
Block RAM2,088 Kbits - supports dual-port FIFOs, coefficient storage, and frame buffering
User I/O Pins448 - configurable across 12 I/O banks with independent VCCO per bank
Configuration InterfaceMaster SelectMAP (32-bit) or JTAG - allows in-system programming and field updates
Operating Temperature0°C to 85°C - qualified for commercial temperature grade operation

Pinout & Package

XC5VSX35T-2FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside requires solder paste stencil design per Xilinx UG192.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration Clock InputDrives internal configuration shift register during Master SelectMAP mode
DINConfiguration Data InputSerial data input for JTAG or parallel data lane 0 in SelectMAP mode
INIT_BConfiguration Status OutputOpen-drain active-low signal indicating configuration memory readiness
PROGRAM_BConfiguration Reset InputActive-low asynchronous reset that clears configuration memory and restarts loading
M0–M2Mode Selection InputsSet configuration mode (JTAG/Slave Serial/SelectMAP) at power-up

Key Features

FeatureDesign Value
Embedded RocketIO GTP Transceivers24 transceivers with built-in 8B/10B encoder/decoder and elastic buffers for jitter tolerance
Dedicated DSP48E Slices64 slices each with 25×18 multiplier, accumulator, and pipeline registers for real-time filtering
SelectIO TechnologySupports 21 I/O standards including LVDS DCI termination and programmable slew rate control
Multi-Channel Clock ManagementEach CMT contains two DCMs and one PLL for independent clock domain generation and phase alignment

Applications

Radar Baseband ProcessingPCIe Gen1 Endpoint Acceleration

Use Scenario: Real-time pulse-Doppler processing in airborne SAR systems with streaming ADC data at 125 MSPS.

IC Role / Device Role / Timing Role: FPGA fabric executes beamforming, CFAR detection, and FFT pipelines; RocketIO transceivers export processed data over serial link.

Use Value: XC5VSX35T-2FFG665C delivers deterministic latency and parallel processing throughput required for sub-millisecond response in tracking loops.

Use Scenario: Offloading packet assembly and DMA management from host CPU in industrial vision acquisition cards.

IC Role / Device Role / Timing Role: Acts as PCIe endpoint with BAR-mapped memory and MSI interrupt generation; handles scatter-gather DMA to local DDR2.

Use Value: XC5VSX35T-2FFG665C reduces host CPU utilization by >40% while sustaining 2.0 GT/s line rate with <50 ns transaction latency.

High-Speed Test EquipmentAvionics Data Concentrator

Use Scenario: Multi-channel digital pattern generator with synchronized 200 MHz vector clocks and per-pin parametric measurement.

IC Role / Device Role / Timing Role: Configurable I/O banks drive precision timing waveforms; DSP48E slices compute real-time pass/fail thresholds.

Use Value: XC5VSX35T-2FFG665C enables simultaneous 32-channel stimulus generation with <100 ps skew across all outputs.

Use Scenario: ARINC 429 and MIL-STD-1553B protocol bridging in flight control computers with deterministic latency budget.

IC Role / Device Role / Timing Role: Implements dual-protocol state machines and time-stamped message buffering using Block RAM and clock-domain crossing FIFOs.

Use Value: XC5VSX35T-2FFG665C guarantees worst-case 12 µs end-to-end latency from input capture to output transmission.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based high-speed interface and signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX30T-2FFG665CFewer logic cells (29,184), no RocketIO GTP transceivers, same package and I/O countLacks serial transceivers; suitable only for parallel-bus or low-speed interface designsSelect when transceiver capability is unnecessary and cost reduction is prioritized
XC6SLX45-2CSG324CLower density Spartan-6 device (43,661 logic cells), no GTP transceivers, 324-pin CSBGA packageTargeted at cost-sensitive embedded control; lacks high-speed serial PHY and advanced clockingChoose for non-transceiver applications where footprint and BOM cost are critical

Compared with XC5VLX30T-2FFG665C and XC6SLX45-2CSG324C, the XC5VSX35T-2FFG665C uniquely combines transceiver bandwidth, DSP slice density, and I/O flexibility for mixed-signal system-on-module designs requiring both high-speed serial connectivity and real-time computation.

Availability

XC5VSX35T-2FFG665C is available at Aetrix Electronics and suitable for radar baseband processing, PCIe Gen1 endpoint acceleration, and avionics data concentrator applications requiring stable component supply and long-term obsolescence planning.

Supply support for XC5VSX35T-2FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Virtex FPGA portfolio for high-performance computing and adaptive hardware platforms.

The Virtex-5 SXT family was designed specifically for applications demanding high-speed serial connectivity, embedded DSP, and flexible I/O - targeting defense electronics, test instrumentation, and high-end communications infrastructure.

FAQ

What is the maximum data rate supported by the transceivers in XC5VSX35T-2FFG665C?

The XC5VSX35T-2FFG665C integrates RocketIO GTP transceivers rated for 1.0–2.5 Gbps operation. This supports PCIe Gen1 (2.5 GT/s), Serial RapidIO, and other protocols requiring sub-3 Gbps serial links. Each transceiver includes built-in 8B/10B encoding and elastic buffers to manage channel jitter.

Does XC5VSX35T-2FFG665C support configuration via SPI flash memory?

No, XC5VSX35T-2FFG665C does not natively support direct SPI flash configuration. It requires external microcontroller or PROM controller to implement Master SelectMAP or JTAG configuration. Xilinx recommends using Platform Flash XL or third-party controllers for SPI-based boot solutions.

What is the purpose of the M0–M2 pins on XC5VSX35T-2FFG665C?

The M0–M2 pins on XC5VSX35T-2FFG665C are mode selection inputs sampled at power-up to determine the configuration method. Valid combinations select JTAG, Slave Serial, or Master SelectMAP modes. These pins must be pulled high or low with appropriate resistors before configuration begins.

Can XC5VSX35T-2FFG665C operate in industrial temperature range?

No, XC5VSX35T-2FFG665C is specified only for commercial temperature range (0°C to +85°C). For extended temperature operation, engineers should consider the -1 speed grade variant with industrial qualification or evaluate newer AMD Versal devices with broader thermal ratings.

How many DSP48E slices are available in XC5VSX35T-2FFG665C?

The XC5VSX35T-2FFG665C contains 64 DSP48E slices. Each slice provides a 25×18 signed multiplier, wide accumulator, pipeline registers, and optional pre-adder functionality - enabling efficient FIR filter implementation, FFT butterfly operations, and real-time arithmetic-intensive algorithms.

XC5VSX35T-2FFG665C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 SXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
2720
Number of Logic Elements/Cells:
34816
Total RAM Bits:
3096576
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VSX35T-2FFG665C FAQ

1.How can I place an order for XC5VSX35T-2FFG665C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VSX35T-2FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VSX35T-2FFG665C reliable?

The price and inventory of XC5VSX35T-2FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX35T-2FFG665C is usually 5 days.

3.What payment methods are accepted for XC5VSX35T-2FFG665C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX35T-2FFG665C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VSX35T-2FFG665C?

XC5VSX35T-2FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VSX35T-2FFG665C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VSX35T-2FFG665C?

For technical support, including XC5VSX35T-2FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX35T-2FFG665C requirements.

6.How does Aetrix verify that XC5VSX35T-2FFG665C is sourced from the original manufacturer or authorized distributors?

All XC5VSX35T-2FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX35T-2FFG665C meets industry standards.

7.What is the process for return or replacement of XC5VSX35T-2FFG665C?

All XC5VSX35T-2FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX35T-2FFG665C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VSX35T-2FFG665C part is unused and in its original packaging.

Return procedure for XC5VSX35T-2FFG665C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VSX35T-2FFG665C Tags

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