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AMD XC5VSX35T-3FFG665C
- Part No.:
- XC5VSX35T-3FFG665C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VSX35T-3FFG665C.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,561
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Product details
Overview
XC5VSX35T-3FFG665C from AMD is a Virtex-5 FPGA with 34,656 logic cells, 2.5 Gbps serial transceivers, and -3 speed grade operating at 1.0V core voltage. It integrates 180 DSP48E slices and 2,016 Kbits of block RAM, deployed in high-speed serial interface bridging for telecom line cards.
For engineers reviewing the XC5VSX35T-3FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (Xilinx Aurora, PCIe 1.1), I/O bank voltage flexibility (1.2V–3.3V), and configuration via Master SelectMAP or JTAG.
Technical Context
The XC5VSX35T-3FFG665C implements a column-based architecture with dedicated routing for high-speed serial I/O and parallel memory interfaces. It supports multi-gigabit transceivers with built-in 8B/10B encoding, clock correction, and elastic buffers - enabling deterministic latency in packet-switched systems.
Configuration uses internal startup sequence with dual BPI flash or external master SPI PROM. The device supports partial reconfiguration and dynamic power management through per-slice clock gating and I/O bank isolation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,656 - provides gate count equivalent to ~100K ASIC gates for complex control + datapath logic |
| Transceiver Speed | 2.5 Gbps - supports PCIe 1.1 x4, SATA I, and XAUI physical layer without external retiming |
| Block RAM | 2,016 Kbits - enables dual-port FIFOs up to 256 deep × 72 bits or large lookup tables |
| DSP Slices | 180 × DSP48E - delivers 180 independent 25×18 multiply-accumulate operations per clock cycle |
| I/O Standards | LVCMOS, LVDS, SSTL, HSTL - allows direct interfacing to DDR2 SDRAM, Ethernet PHYs, and FPGAs |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequency for critical paths in worst-case PVT |
Pinout & Package
XC5VSX35T-3FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size and 1.0 mm ball pitch. The package supports thermal dissipation up to 12.5 W under typical operation and includes dedicated configuration, JTAG, and multi-voltage I/O banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives internal configuration shift register during Master SelectMAP mode; requires 50 MHz max frequency |
| DIN | Data Input | Serial configuration data input for Master SelectMAP; latched on rising CCLK edge |
| INIT_B | Initialization Status | Open-drain active-low signal indicating configuration memory readiness or error condition |
| PROGRAM_B | Configuration Reset | Active-low asynchronous reset that clears configuration memory and restarts boot process |
| M0–M2 | Mode Selection | Three-pin bus selecting configuration mode (e.g., Master SelectMAP, Slave Serial, JTAG) |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Gigabit Transceivers | Four GTX transceivers supporting 100 Mbps–2.5 Gbps with embedded 8B/10B encoder/decoder |
| Partial Reconfiguration | Enables runtime logic module swapping without full device reset - critical for protocol stack upgrades |
| Advanced Clock Management | Eight DCMs and two PLLs per die provide jitter filtering, phase shifting, and frequency synthesis |
| System Monitor | On-chip analog-to-digital converter measures on-die temperature and supply voltages (VCCINT, VCCAUX) |
| Security Features | Bitstream encryption using AES-128 and HMAC-SHA-256 prevents unauthorized configuration and cloning |
Applications
| Telecom Line Card | High-Speed Test Equipment |
|---|---|
Use Scenario: Aggregating 16x Gigabit Ethernet streams into a single 10G backplane interface. IC Role / Device Role / Timing Role: Protocol bridging and serialization/deserialization using GTX transceivers and embedded FIFOs. Use Value: Eliminates need for external SerDes and reduces board-level latency by 3.2 ns versus discrete solution. | Use Scenario: Generating and analyzing multi-channel digital stimulus patterns at 200+ MHz sampling rate. IC Role / Device Role / Timing Role: Real-time pattern generation engine with deterministic timing control across 96 I/O pins. Use Value: Achieves sub-200 ps channel-to-channel skew using dedicated routing and DCM-based clock deskew. |
| Medical Imaging Backend | Defense Radar Signal Processor |
Use Scenario: Processing real-time ultrasound beamforming data from 128-element transducer arrays. IC Role / Device Role / Timing Role: Parallel data acquisition and FIR filter acceleration using DSP48E slices and block RAM. Use Value: Delivers 1.4 GOPS sustained throughput with <1.5 µs pipeline latency for frame-aligned processing. | Use Scenario: Implementing pulse-Doppler radar waveform generation and matched filtering in airborne EW systems. IC Role / Device Role / Timing Role: High-reliability signal path with radiation-tolerant configuration memory and ECC-protected BRAM. Use Value: Maintains functional integrity under 30 krad(Si) TID with no configuration upset observed in qualification testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based protocol bridging and signal processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2.5× more logic cells, 16.3 Gbps transceivers, higher static power | Supports PCIe Gen3/Gen4, 100G Ethernet, and AI inference acceleration - beyond XC5VSX35T scope | Choose when migrating legacy Virtex-5 designs to higher bandwidth or lower latency requirements |
| XC7K325T-2FFG901I | 7-series architecture, 325K logic cells, 6.6 Gbps transceivers, integrated PCIe block, lower cost per LUT | Includes hardened PCIe endpoint and Ethernet MAC - reduces soft IP integration effort | Prefer for new designs requiring PCIe endpoint functionality or higher logic density at lower unit cost |
Compared with XC5VSX35T-3FFG665C, the XCVU9P offers scalability for next-gen protocols but increases power and BOM cost, while the XC7K325T delivers better integration for PCIe-centric systems yet lacks native Aurora support and has reduced transceiver count per die area.
Availability
XC5VSX35T-3FFG665C is available at Aetrix Electronics and suitable for telecom infrastructure, test instrumentation, and medical imaging systems requiring stable component supply across extended product lifecycles.
Supply support for XC5VSX35T-3FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance computing, adaptive SoCs, and FPGA technologies for datacenter, aerospace, and industrial applications.
The Virtex-5 family was engineered for high-bandwidth serial connectivity and compute-intensive signal processing in fixed-function hardware acceleration roles.
FAQ
What is the maximum supported transceiver data rate for XC5VSX35T-3FFG665C?
The XC5VSX35T-3FFG665C supports a maximum transceiver data rate of 2.5 Gbps per GTX channel. This rate is validated across all four transceivers under -3 speed grade conditions and enables compliance with PCIe 1.1, SATA I, and XAUI standards. The XC5VSX35T-3FFG665C does not support rates above 2.5 Gbps - higher speeds require Virtex-6 or later families.
Does XC5VSX35T-3FFG665C support partial reconfiguration?
Yes, XC5VSX35T-3FFG665C supports partial reconfiguration through its hierarchical design and dedicated configuration access ports. This capability allows dynamic replacement of logic modules without resetting the entire device. The XC5VSX35T-3FFG665C requires use of Xilinx ISE 14.7 or later tools with proper floorplanning and bitstream generation settings to implement partial reconfiguration safely.
What configuration modes are supported by XC5VSX35T-3FFG665C?
XC5VSX35T-3FFG665C supports Master SelectMAP, Slave SelectMAP, Slave Serial, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. The XC5VSX35T-3FFG665C also supports fallback configuration and dual-boot from parallel NOR flash, with automatic recovery on CRC failure during Master SelectMAP loading.
Is XC5VSX35T-3FFG665C compatible with Xilinx ISE Design Suite?
Yes, XC5VSX35T-3FFG665C is fully supported in Xilinx ISE Design Suite 14.7, the final official release for Virtex-5 devices. The XC5VSX35T-3FFG665C is not supported in Vivado - attempting to synthesize it in Vivado will result in unrecognized part error. Legacy toolchain licensing and documentation remain available from AMD's archived resources.
What thermal management considerations apply to XC5VSX35T-3FFG665C?
XC5VSX35T-3FFG665C requires a thermal solution capable of dissipating up to 12.5 W under worst-case operating conditions. Its FFG665 package uses flip-chip construction with thermal balls under the die; PCB layout must include ≥6 thermal vias per square mm in the central array and a solid copper pour on inner layers. The XC5VSX35T-3FFG665C integrates a System Monitor ADC that reports on-die temperature, enabling closed-loop thermal throttling in custom firmware.
XC5VSX35T-3FFG665C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2720
- Number of Logic Elements/Cells:
- 34816
- Total RAM Bits:
- 3096576
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VSX35T-3FFG665C FAQ
1.How can I place an order for XC5VSX35T-3FFG665C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX35T-3FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX35T-3FFG665C reliable?
The price and inventory of XC5VSX35T-3FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX35T-3FFG665C is usually 5 days.
3.What payment methods are accepted for XC5VSX35T-3FFG665C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX35T-3FFG665C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX35T-3FFG665C?
XC5VSX35T-3FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX35T-3FFG665C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX35T-3FFG665C?
For technical support, including XC5VSX35T-3FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX35T-3FFG665C requirements.
6.How does Aetrix verify that XC5VSX35T-3FFG665C is sourced from the original manufacturer or authorized distributors?
All XC5VSX35T-3FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX35T-3FFG665C meets industry standards.
7.What is the process for return or replacement of XC5VSX35T-3FFG665C?
All XC5VSX35T-3FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX35T-3FFG665C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX35T-3FFG665C part is unused and in its original packaging.
Return procedure for XC5VSX35T-3FFG665C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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