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AMD XC5VSX35T-X1FFG665C
- Part No.:
- XC5VSX35T-X1FFG665C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VSX35T-X1FFG665C.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,399
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Product details
Overview
XC5VSX35T-X1FFG665C from AMD is a Virtex-5 FPGA with 34,656 logic cells, 2.5 Gbps serial transceivers, and 1.25 V core voltage, deployed in high-speed communication line cards and radar signal processing subsystems.
For engineers reviewing the XC5VSX35T-X1FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count, I/O bank voltage flexibility, Block RAM depth, DSP48E slice throughput, and thermal performance under sustained 200 MHz system clock operation.
Technical Context
The XC5VSX35T-X1FFG665C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 64-bit wide dual-port Block RAMs, and 18×25-bit DSP48E slices supporting pipelined multiply-accumulate at 350 MHz. It integrates 12 RocketIO GTP transceivers operating up to 2.5 Gbps with embedded 8B/10B encoding and elastic buffers.
I/O banks support independent voltage settings (1.2 V to 3.3 V) across 480 user I/O pins, with programmable slew rate and drive strength per pin group. Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption enabled through AES-256 keys stored in on-chip eFUSE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 34,656 - total available LUT-based programmable resources for combinatorial and sequential logic implementation |
| Transceivers | 12 × GTP - supports 12 bidirectional serial lanes up to 2.5 Gbps each, with built-in clock data recovery |
| Block RAM | 2,008 kbits - distributed as 128 × 18-kbit dual-port RAM blocks usable for FIFOs or lookup tables |
| DSP Slices | 64 × DSP48E - delivers 128 MAC operations/cycle at 350 MHz for real-time filtering and FFT acceleration |
| I/O Pins | 480 user I/O - supports LVDS, SSTL, HSTL, and LVCMOS standards with per-bank voltage assignment |
| Core Voltage | 1.25 V ±3% - fixed supply requirement for internal logic and interconnect, demanding tight regulation |
Pinout & Package
XC5VSX35T-X1FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free (RoHS-compliant) solder balls. Thermal pad on underside enables direct PCB heat sinking.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | 1.25 V input to internal logic array and CLBs; requires low-noise, high-PSRR regulation |
| VCCAUX | Auxiliary power supply | 2.5 V input powering configuration circuitry, JTAG, and transceiver reference clocks |
| VCCO_0 | I/O bank power | Programmable voltage (1.2–3.3 V) for Bank 0 I/Os; sets signaling standard compatibility |
| MR | Master reset | Active-low asynchronous reset that clears configuration registers and halts state machines |
| CCLK | Configuration clock | Input clock for SelectMAP configuration mode; frequency ≤ 50 MHz determines bitstream load speed |
Key Features
| Feature | Design Value |
|---|---|
| Embedded GTP transceivers | 12 lanes with integrated CDR, 8B/10B encode/decode, and elastic buffer for jitter tolerance |
| DSP48E arithmetic units | 64 slices each performing 18×25-bit multiply + 48-bit accumulate in single cycle at 350 MHz |
| Secure bitstream loading | AES-256 decryption using eFUSE-stored keys prevents unauthorized configuration and cloning |
| Multi-standard I/O banks | 480 pins grouped into 12 banks, each independently configurable for LVDS/SSTL/HSTL/LVCMOS |
Applications
| Wireless Baseband Processing | Radar Signal Conditioning |
|---|---|
Use Scenario: Real-time channelization and MIMO precoding in LTE-A and 5G NR macro base stations. IC Role / Device Role / Timing Role: Primary programmable fabric handling parallel FFTs, filter banks, and beamforming matrix operations. Use Value: 64 DSP48E slices enable simultaneous 128 complex MACs per cycle, meeting sub-100 µs latency targets for TDD frame scheduling. | Use Scenario: Pulse-Doppler processing and CFAR detection in X-band active electronically scanned array (AESA) radar systems. IC Role / Device Role / Timing Role: High-throughput digital receiver front-end synchronizing ADC samples and executing range-Doppler FFTs. Use Value: 12 GTP transceivers interface directly to 12-channel ADC/DAC converters at 1.25 GSPS, eliminating external serializer/deserializer ICs. |
| High-Speed Test Equipment | Avionics Data Concentrators |
Use Scenario: Protocol-aware pattern generation and error injection in 10 GbE and CPRI compliance test platforms. IC Role / Device Role / Timing Role: Deterministic latency engine managing multi-lane packet assembly, CRC insertion, and timestamp tagging. Use Value: 480 user I/Os with per-bank voltage control allow concurrent interfacing to 10GBASE-R PHY, microcontroller debug ports, and memory-mapped test registers. | Use Scenario: ARINC 664 Part 7 (AFDX) end-system aggregation of sensor data from flight control, navigation, and health monitoring subsystems. IC Role / Device Role / Timing Role: Time-triggered switch fabric with guaranteed bandwidth allocation and deterministic jitter < 50 ns. Use Value: Built-in PCIe endpoint logic (via soft IP) and 2.5 Gbps transceivers support direct connection to AFDX network controllers without bridge chips. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Xilinx XC5VLX50T-1FFG665C | Lower logic density (49,920 LCs), no GTP transceivers - uses GTP-less architecture with external SerDes | Suitable for cost-sensitive compute-intensive tasks without native serial I/O, e.g., video encoding pipelines | Select when transceiver integration is unnecessary and logic utilization stays below 85% |
| Intel EP4SGX360HF35C3 | Stratix IV GX with 360K LEs and 24 × 6.375 Gbps transceivers; higher power draw (18 W typical vs. 12.4 W) | Better suited for multi-protocol backplanes requiring PCIe Gen2 and SATA, but larger footprint and thermal envelope | Prefer when >2.5 Gbps lane speed or PCI Express root complex functionality is mandatory |
Compared with XC5VLX50T-1FFG665C and EP4SGX360HF35C3, the XC5VSX35T-X1FFG665C offers optimal balance of transceiver count, DSP resource density, and thermal efficiency for radar and wireless infrastructure where 2.5 Gbps serial I/O and real-time MAC throughput are critical.
Availability
XC5VSX35T-X1FFG665C is available at Aetrix Electronics and suitable for wireless infrastructure, aerospace avionics, and high-speed test equipment requiring stable component supply over extended production lifecycles.
Supply support for XC5VSX35T-X1FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, embedded, and aerospace applications, with heritage in high-performance programmable logic dating to the Xilinx acquisition.
The Virtex-5 family was engineered for high-bandwidth, low-latency signal processing in mission-critical systems, emphasizing transceiver integration, DSP efficiency, and configuration security.
FAQ
What is the maximum supported transceiver data rate for XC5VSX35T-X1FFG665C?
The XC5VSX35T-X1FFG665C supports a maximum transceiver data rate of 2.5 Gbps per GTP lane. This is specified under recommended operating conditions with proper board-level signal integrity design, including controlled impedance routing and appropriate termination. The XC5VSX35T-X1FFG665C does not support rates beyond 2.5 Gbps, even with margin testing or vendor-specific firmware tuning.
Does XC5VSX35T-X1FFG665C support JTAG boundary-scan testing?
Yes, XC5VSX35T-X1FFG665C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TDI, TDO, TMS, and TCK pins. The boundary-scan chain covers all user I/Os and internal configuration logic, enabling manufacturing test and in-system verification. The XC5VSX35T-X1FFG665C implements TAP controller logic compliant with Xilinx's documented JTAG instruction set.
What configuration modes are supported by XC5VSX35T-X1FFG665C?
XC5VSX35T-X1FFG665C supports Master SelectMAP, Slave SelectMAP, Serial, and JTAG configuration modes. Master SelectMAP uses an external PROM or processor to drive the configuration bus at up to 50 MHz. The XC5VSX35T-X1FFG665C does not support passive parallel or system-level boot modes outside these four defined methods.
Is XC5VSX35T-X1FFG665C qualified for aerospace or automotive applications?
No, XC5VSX35T-X1FFG665C is rated for commercial and industrial temperature ranges (0°C to 85°C ambient), not extended or military-grade qualification. It lacks QML-Q or AEC-Q100 certification. For aerospace use, designers must perform full radiation tolerance analysis and derating per DO-254. The XC5VSX35T-X1FFG665C is not approved for safety-critical automotive ECUs.
How many Block RAM columns are available in XC5VSX35T-X1FFG665C?
XC5VSX35T-X1FFG665C contains 128 Block RAM columns, each implementing a 18-kbit dual-port RAM block. These are arranged in 16 columns per CLB column across 8 CLB columns, totaling 2,008 kbits. The XC5VSX35T-X1FFG665C does not support asymmetric RAM partitioning beyond the documented 18-kbit granularity.
XC5VSX35T-X1FFG665C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 2720
- Number of Logic Elements/Cells:
- 34816
- Total RAM Bits:
- 3096576
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VSX35T-X1FFG665C FAQ
1.How can I place an order for XC5VSX35T-X1FFG665C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX35T-X1FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX35T-X1FFG665C reliable?
The price and inventory of XC5VSX35T-X1FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX35T-X1FFG665C is usually 5 days.
3.What payment methods are accepted for XC5VSX35T-X1FFG665C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX35T-X1FFG665C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX35T-X1FFG665C?
XC5VSX35T-X1FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX35T-X1FFG665C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX35T-X1FFG665C?
For technical support, including XC5VSX35T-X1FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX35T-X1FFG665C requirements.
6.How does Aetrix verify that XC5VSX35T-X1FFG665C is sourced from the original manufacturer or authorized distributors?
All XC5VSX35T-X1FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX35T-X1FFG665C meets industry standards.
7.What is the process for return or replacement of XC5VSX35T-X1FFG665C?
All XC5VSX35T-X1FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX35T-X1FFG665C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX35T-X1FFG665C part is unused and in its original packaging.
Return procedure for XC5VSX35T-X1FFG665C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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