AMD XC5VSX50T-2FF665I
- Part No.:
- XC5VSX50T-2FF665I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VSX50T-2FF665I.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:2,981
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC5VSX50T-2FF665I from AMD (formerly Xilinx) is a Virtex-5 SXT family FPGA featuring 49,600 logic cells, 2.5 Gbps RocketIO GTP transceivers, and integrated PowerPC 440 processor cores. It supports high-speed serial connectivity in embedded vision and radar signal processing systems.
For engineers reviewing the XC5VSX50T-2FF665I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, logic cell count, I/O voltage support, and thermal performance in convection-cooled enclosures.
Technical Context
The XC5VSX50T-2FF665I implements dual-core PowerPC 440 processors with 32 kB instruction and 32 kB data L1 cache per core, and integrates 24 RocketIO GTP transceivers operating at 1.0–2.5 Gbps. It uses 65 nm copper/SiO₂ process technology and supports DDR2 SDRAM interfaces up to 533 MHz.
Configurable logic blocks include 6-input LUTs with dual flip-flops, and DSP48E slices deliver 550 MHz multiply-accumulate operation. The device supports SelectIO standards including LVDS, SSTL, HSTL, and differential signaling with programmable input delay.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - determines maximum combinational/sequential logic capacity for algorithm partitioning |
| GTP Transceivers | 24 × 1.0–2.5 Gbps - enables multi-channel serial links without external PHYs |
| Block RAM | 3.8 Mbits - supports large on-chip buffering for video frame storage or FFT coefficient tables |
| Max I/O Count | 440 - provides high pin density for parallel sensor interfaces or memory buses |
| Operating Temp | –40°C to +100°C - qualified for industrial and avionics environments with no derating |
| Core Voltage | 1.0 V ±3% - requires tight-tolerance VRM with <10 mV ripple for stable timing closure |
Pinout & Package
XC5VSX50T-2FF665I is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG665) package with 35×35 mm body size and 1.0 mm ball pitch. Thermal pad on underside enables direct heatsink attachment.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core power supply | Must be filtered within 10 mm of package with ≥100 µF bulk + 10×0.1 µF ceramic capacitors |
| VCCAUX | Auxiliary power supply | Supplies configuration logic, JTAG, and transceiver reference circuits at 2.5 V |
| MGTREFCLK | Transceiver reference clock input | Accepts differential LVDS or LVPECL; jitter < 1 ps RMS required for 2.5 Gbps lock |
| PROGRAM_B | Configuration reset control | Active-low asynchronous reset; must be held high during power ramp and configuration |
| DONE | Configuration completion indicator | Open-drain output pulled high externally; signals bitstream load success and I/O enable |
Key Features
| Feature | Design Value |
|---|---|
| Dual PowerPC 440 cores | Enables asymmetric multiprocessing: one core for real-time control, the other for packet processing |
| 24 RocketIO GTP transceivers | Reduces board area by eliminating discrete SerDes chips in multi-lane JESD204B or CPRI designs |
| Integrated PCIe Endpoint v1.1 | Supports x1/x2/x4 lane configurations without external switch logic or glue logic |
| DDR2 memory controller | Provides 533 MHz interface with 64-bit data bus and hardware ECC for mission-critical buffer memory |
| Multi-boot capability | Allows field-upgradable firmware images stored in external SPI flash with fail-safe fallback |
Applications
| Radar Signal Processing | Medical Imaging Backend |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes FFTs and CFAR algorithms; GTP transceivers interface with ADC/DAC FMC modules at 2.0 Gbps. Use Value: On-chip PowerPC cores manage system scheduling while logic fabric handles deterministic latency-critical compute. | Use Scenario: High-throughput image reconstruction pipeline in CT and MRI scanners. IC Role / Device Role / Timing Role: Configurable logic implements back-projection kernels; DDR2 controller buffers projection data before GPU transfer. Use Value: Integrated PCIe endpoint enables direct DMA to host memory, reducing host CPU overhead by >40% vs. discrete bridge solutions. |
| Avionics Data Concentrator | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 (AFDX) gateway aggregating sensor and actuator data across multiple LRUs. IC Role / Device Role / Timing Role: FPGA implements time-triggered AFDX scheduler and CRC offload; PowerPC runs DO-178C-certifiable middleware. Use Value: Dual-core isolation allows safety-critical scheduling on one core and non-critical comms on the other. | Use Scenario: Bit-error-rate tester (BERT) with programmable pattern generation and error detection. IC Role / Device Role / Timing Role: Logic fabric generates PRBS-31 sequences; GTP transceivers loopback at 2.5 Gbps with adjustable jitter injection. Use Value: On-die delay calibration eliminates external phase interpolators, improving test repeatability by ±0.1 UI. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance embedded FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110T-2FF1136I | Higher logic density (110K LC), no PowerPC cores, 48 GTP transceivers | Better suited for pure logic-intensive tasks like protocol bridging; lacks embedded processor for control-plane offload | Select when system requires maximum fabric resources and no on-chip processor is needed |
| XC6VSX315T-2FF1156I | Newer 40 nm node, 315K LC, 32 GTX transceivers (up to 6.6 Gbps), dual PowerPC 440 | Supports higher-speed serial protocols (e.g., SRIO Gen2, 10GbE MAC); larger memory footprint for complex algorithms | Choose for new designs requiring extended lifecycle, higher bandwidth, or lower static power |
Compared with XC5VLX110T-2FF1136I, the XC5VSX50T-2FF665I trades logic capacity for integrated processing and optimized transceiver count; versus XC6VSX315T-2FF1156I, it offers proven qualification in legacy aerospace platforms but lacks 6.6 Gbps transceivers and 40 nm power efficiency.
Availability
XC5VSX50T-2FF665I is available at Aetrix Electronics and suitable for radar signal processing, medical imaging backend, and avionics data concentrator applications requiring stable component supply over extended production lifecycles.
Supply support for XC5VSX50T-2FF665I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Virtex family for high-end programmable logic applications in defense, aerospace, and industrial markets.
The Virtex-5 SXT product line was engineered for embedded systems requiring tightly coupled processing and high-speed serial I/O, targeting radar, imaging, and deterministic networking.
FAQ
What is the maximum supported data rate for RocketIO GTP transceivers in XC5VSX50T-2FF665I?
The XC5VSX50T-2FF665I supports RocketIO GTP transceivers operating at 1.0–2.5 Gbps per lane. This range enables compliance with JESD204A/B, CPRI, and Serial RapidIO Gen1 standards. The 2.5 Gbps limit is specified under full commercial temperature range with proper reference clock jitter and PCB interconnect design. XC5VSX50T-2FF665I does not support rates above 2.5 Gbps even with reduced temperature or voltage margin.
Does XC5VSX50T-2FF665I include an integrated PCI Express endpoint?
Yes, XC5VSX50T-2FF665I integrates a PCI Express Endpoint v1.1 compliant block supporting x1, x2, and x4 lane configurations. It handles link training, transaction layer packet routing, and MSI interrupt generation without external logic. XC5VSX50T-2FF665I requires external configuration space mapping and root complex interaction but eliminates need for discrete PCIe bridge ICs.
What is the operating temperature grade of XC5VSX50T-2FF665I?
XC5VSX50T-2FF665I is rated for industrial temperature range: –40°C to +100°C case temperature. This grade is verified per Xilinx DS106 specification and qualifies the device for use in sealed avionics enclosures and outdoor radar cabinets without active cooling. XC5VSX50T-2FF665I does not require derating up to its maximum junction temperature of 125°C.
Can XC5VSX50T-2FF665I configure from SPI flash memory?
Yes, XC5VSX50T-2FF665I supports master SPI configuration mode using standard quad-SPI flash devices. It boots directly from up to 128 Mbit external SPI flash via dedicated CCLK, D0–D3 pins. XC5VSX50T-2FF665I also supports multi-boot with fallback image selection using GPIO-controlled address lines, enabling robust field updates.
What I/O standards are supported by XC5VSX50T-2FF665I bank voltage rails?
XC5VSX50T-2FF665I supports LVCMOS, LVTTL, SSTL-18/2, HSTL-I/II, and differential standards including LVDS, BLVDS, RSDS, and Differential SSTL across its 16 I/O banks. Each bank operates at 1.2 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, with independent VCCO assignment. XC5VSX50T-2FF665I does not support 1.0 V I/O or MIPI D-PHY signaling.
XC5VSX50T-2FF665I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4080
- Number of Logic Elements/Cells:
- 52224
- Total RAM Bits:
- 4866048
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VSX50T-2FF665I FAQ
1.How can I place an order for XC5VSX50T-2FF665I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX50T-2FF665I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX50T-2FF665I reliable?
The price and inventory of XC5VSX50T-2FF665I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX50T-2FF665I is usually 5 days.
3.What payment methods are accepted for XC5VSX50T-2FF665I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX50T-2FF665I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX50T-2FF665I?
XC5VSX50T-2FF665I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX50T-2FF665I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX50T-2FF665I?
For technical support, including XC5VSX50T-2FF665I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX50T-2FF665I requirements.
6.How does Aetrix verify that XC5VSX50T-2FF665I is sourced from the original manufacturer or authorized distributors?
All XC5VSX50T-2FF665I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX50T-2FF665I meets industry standards.
7.What is the process for return or replacement of XC5VSX50T-2FF665I?
All XC5VSX50T-2FF665I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX50T-2FF665I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX50T-2FF665I part is unused and in its original packaging.
Return procedure for XC5VSX50T-2FF665I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC5VSX50T-2FF665I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

