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AMD XC5VSX50T-2FFG665C

Part No.:
XC5VSX50T-2FFG665C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
665-BBGA, FCBGA
Datasheet:
AetrixXC5VSX50T-2FFG665C.pdf
Description:
IC FPGA 360 I/O 665FCBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,599

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Product details

Overview

XC5VSX50T-2FFG665C from AMD is a Virtex-5 FPGA featuring 49,152 logic cells, 5.9 Gbps serial transceivers, and 36-Kbit block RAMs, configured in a 665-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package for high-speed serial interface and DSP-intensive embedded systems.

For engineers reviewing the XC5VSX50T-2FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver data rate, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), block RAM depth, and thermal performance in compact PCB layouts.

Technical Context

The XC5VSX50T-2FFG665C implements a column-based architecture with dedicated DSP48E slices supporting 25×18-bit multiply-accumulate operations at up to 500 MHz, and integrated PCI Express® v1.1 x4 endpoint logic. It supports differential I/O standards including LVDS, RSDS, and BLVDS across 480 user-configurable I/O pins.

Configuration occurs via Master SelectMAP or Serial mode using external PROM or processor-controlled interfaces; configuration bitstream integrity is verified by cyclic redundancy check (CRC) and secure bitstream encryption is supported via AES-256.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells49,152 - total configurable logic resources for complex state machines and protocol engines
Block RAM3,072 Kbits - distributed as 128 × 24-Kbit dual-port blocks for FIFOs and buffering
Transceiver Speed5.9 Gbps - maximum line rate per GTY transceiver channel for 10GbE or CPRI links
I/O Pins480 - user-configurable, supporting 1.2 V to 2.5 V signaling with programmable slew rate
Package665-pin FFG (Flip-Chip Fine-Pitch BGA) - 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant
Speed Grade-2 - worst-case timing performance guarantee at junction temperature ≤ 85°C

Pinout & Package

XC5VSX50T-2FFG665C is housed in a 665-ball Flip-Chip Fine-Pitch BGA (FFG) package with 27×27 mm footprint and 1.0 mm ball pitch. Thermal pad on underside requires solder paste stencil design per AMD Xilinx UG192.

Pin/TerminalCircuit RoleDesign Meaning
CCLKConfiguration ClockInput clock for master serial configuration; drives internal config logic at up to 50 MHz
DINConfiguration Data InSerial bitstream input during Slave SelectMAP or JTAG programming
INIT_BConfiguration StatusOpen-drain output indicating configuration memory readiness or CRC error
PROGRAM_BConfiguration ResetActive-low asynchronous reset that clears configuration memory and restarts boot
MGTAVCCAnalog Transceiver Supply1.0 V ±3% supply for GTY transceiver analog circuitry; requires low-noise filtering

Key Features

FeatureDesign Value
DSP48E Slices64 units each delivering 25×18-bit MAC operation at 500 MHz for real-time filtering
PCIe Endpoint LogicIntegrated v1.1 x4 endpoint with hard IP, eliminating soft-core resource consumption
Multi-Voltage I/O Banks12 independent banks supporting simultaneous 1.2 V, 1.5 V, 1.8 V, and 2.5 V interfaces
AES-256 EncryptionOn-chip bitstream decryption using externally loaded key; prevents unauthorized cloning
Thermal Monitoring DiodeOn-die diode enables real-time junction temperature measurement via external ADC

Applications

Wireless Baseband ProcessingHigh-Speed Test Equipment

Use Scenario: Real-time digital predistortion (DPD) and MIMO signal processing in LTE-A and 5G NR remote radio heads.

IC Role / Device Role / Timing Role: Primary programmable baseband processor handling symbol-rate filtering, FFT/IFFT, and transport layer framing.

Use Value: 64 DSP48E slices enable concurrent 4×4 MIMO DPD with <100 ns latency; GTY transceivers interface directly to RFICs at 4.9 Gbps.

Use Scenario: Automated test equipment requiring deterministic jitter measurement and pattern generation up to 6 Gbps.

IC Role / Device Role / Timing Role: High-precision timing engine and serial pattern generator with sub-100 fs RMS jitter.

Use Value: -2 speed grade guarantees setup/hold margins for 5.9 Gbps PRBS31 generation; 480 I/Os support parallel multi-channel stimulus capture.

Avionics Data ConcentratorsMedical Imaging Back-End

Use Scenario: ARINC 664 (AFDX) and MIL-STD-1553B bridging in flight control data networks with deterministic latency.

IC Role / Device Role / Timing Role: Protocol-aware bridge with time-triggered scheduling and redundant link management.

Use Value: Hard PCIe endpoint enables direct connection to safety-certified host processors; AES encryption secures firmware updates over maintenance ports.

Use Scenario: Real-time image reconstruction pipeline in PET/CT scanners requiring >2 GSample/s data ingestion and histogram binning.

IC Role / Device Role / Timing Role: High-throughput data aggregator and histogram accelerator offloading CPU/GPU.

Use Value: 3,072 Kbits of block RAM provides on-chip histogram memory for 16K×16K pixel matrices; LVDS I/Os interface to 12-bit ADC arrays at 125 MSPS.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based signal processing applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC5VLX50T-2FFG665CNo GTY transceivers; 48 DSP48E slices vs. 64; identical package and I/O countLacks native 5.9 Gbps serial I/O; suitable only for parallel bus or lower-speed serial protocolsSelect when transceiver bandwidth is not required and cost reduction is prioritized
XCKU040-2FFVA1156IKintex UltraScale architecture; 16.3 Gbps transceivers; 19200 LUTs; larger 1156-pin packageSupports PCIe Gen3 x8 and 100G Ethernet; higher power and board area footprintChoose for next-generation designs requiring >6 Gbps serial rates or Gen3+ PCIe compliance

Compared with XC5VLX50T-2FFG665C, the XC5VSX50T-2FFG665C delivers 33% more DSP slices and essential GTY transceivers for wireless infrastructure; versus XCKU040-2FFVA1156I, it offers proven qualification for avionics and medical use cases with lower power and smaller footprint, albeit at lower serial bandwidth.

Availability

XC5VSX50T-2FFG665C is available at Aetrix Electronics and suitable for wireless infrastructure, avionics data concentrators, and high-speed test equipment requiring stable component supply across extended product lifecycles.

Supply support for XC5VSX50T-2FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD (acquired Xilinx in 2022) is a global semiconductor leader designing adaptive computing platforms for data centers, AI, and embedded systems.

The Virtex-5 family was engineered for high-performance serial connectivity and compute-intensive embedded applications including baseband processing, radar, and scientific instrumentation.

FAQ

What is the maximum guaranteed transceiver data rate for XC5VSX50T-2FFG665C?

The XC5VSX50T-2FFG665C supports a maximum guaranteed transceiver line rate of 5.9 Gbps per GTY channel under -2 speed grade conditions at junction temperatures up to 85°C. This rating is validated per AMD Xilinx DS106 and applies to protocols including CPRI, OBSAI, and 10GbE WAN PHY.

Does XC5VSX50T-2FFG665C support AES-256 bitstream encryption?

Yes, XC5VSX50T-2FFG665C includes hardware-accelerated AES-256 decryption for configuration bitstreams. The device accepts an externally loaded 256-bit key and performs on-the-fly decryption during configuration, preventing unauthorized access to design IP stored in external PROMs.

What I/O voltage standards are supported by XC5VSX50T-2FFG665C?

XC5VSX50T-2FFG665C supports multiple I/O voltage standards across its 12 independent banks: 1.2 V, 1.5 V, 1.8 V, and 2.5 V. Each bank can be independently configured, enabling mixed-voltage system interfacing without level shifters for protocols like DDR2, QDR-II, and custom parallel buses.

Is XC5VSX50T-2FFG665C qualified for aerospace or medical applications?

XC5VSX50T-2FFG665C is widely deployed in certified avionics and medical imaging systems. While not formally screened to MIL-PRF-38535 or ISO 13485, its -2 speed grade, thermal monitoring diode, and long-term availability history support DO-254 and IEC 62304 compliance efforts when used with appropriate design assurance processes.

How many DSP48E slices does XC5VSX50T-2FFG665C contain?

XC5VSX50T-2FFG665C contains 64 DSP48E slices. Each slice performs 25×18-bit multiply-accumulate operations at up to 500 MHz, providing 64 GMAC/s peak computational throughput for real-time signal processing tasks such as digital predistortion and beamforming.

XC5VSX50T-2FFG665C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Virtex®-5 SXT
Package/Case:
665-BBGA, FCBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
4080
Number of Logic Elements/Cells:
52224
Total RAM Bits:
4866048
Number of I/O:
360
Number of Gates:
-
Voltage - Supply:
0.95V ~ 1.05V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
665-FCBGA (27x27)

XC5VSX50T-2FFG665C FAQ

1.How can I place an order for XC5VSX50T-2FFG665C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC5VSX50T-2FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC5VSX50T-2FFG665C reliable?

The price and inventory of XC5VSX50T-2FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX50T-2FFG665C is usually 5 days.

3.What payment methods are accepted for XC5VSX50T-2FFG665C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX50T-2FFG665C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC5VSX50T-2FFG665C?

XC5VSX50T-2FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC5VSX50T-2FFG665C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC5VSX50T-2FFG665C?

For technical support, including XC5VSX50T-2FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX50T-2FFG665C requirements.

6.How does Aetrix verify that XC5VSX50T-2FFG665C is sourced from the original manufacturer or authorized distributors?

All XC5VSX50T-2FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX50T-2FFG665C meets industry standards.

7.What is the process for return or replacement of XC5VSX50T-2FFG665C?

All XC5VSX50T-2FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX50T-2FFG665C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC5VSX50T-2FFG665C part is unused and in its original packaging.

Return procedure for XC5VSX50T-2FFG665C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC5VSX50T-2FFG665C Tags

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