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AMD XC5VSX50T-3FFG665C
- Part No.:
- XC5VSX50T-3FFG665C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 665-BBGA, FCBGA
- Datasheet:
-
XC5VSX50T-3FFG665C.pdf
- Description:
- IC FPGA 360 I/O 665FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,275
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Product details
Overview
XC5VSX50T-3FFG665C from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 49,600 logic cells, 2.5 Gbps serial transceivers, and embedded Block RAM totaling 3.8 MB. It implements high-speed signal processing in radar baseband subsystems with deterministic latency and multi-gigabit I/O.
For engineers reviewing the XC5VSX50T-3FFG665C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver compliance (VSR, XAUI), I/O bank voltage flexibility (1.2 V to 3.3 V), and triple modular redundancy (TMR) support for radiation-tolerant designs.
Technical Context
The XC5VSX50T-3FFG665C integrates 64 RocketIO GTP transceivers operating at 1.0–2.5 Gbps, each supporting protocols including SATA, PCIe 1.0, and Serial RapidIO. Its configurable logic blocks (CLBs) include dual 6-input LUTs and integrated carry chains for arithmetic acceleration.
It supports SelectIO technology with programmable slew rate, drive strength, and on-die termination across 16 I/O banks. Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption enabled through AES-256 keys stored in on-chip eFUSE.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 49,600 - provides gate count equivalent to ~250K ASIC gates for complex digital logic implementation |
| Block RAM | 3.8 MB - enables large on-chip data buffering for FFT, filtering, or packet reassembly without external memory |
| GTP Transceivers | 64 × 1.0–2.5 Gbps - supports 10-lane XAUI or dual 4-lane Serial RapidIO links with built-in clock data recovery |
| I/O Banks | 16 - allows mixed-voltage interface design with independent VCCO per bank (1.2 V to 3.3 V) |
| Configuration Mode | Master SelectMAP or JTAG - enables field-upgradable bitstreams with CRC-verified loading and AES-256 encrypted storage |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequency for critical paths in high-throughput signal chains |
Pinout & Package
XC5VSX50T-3FFG665C is housed in a 665-pin Fine-Pitch Flip-Chip Ball Grid Array (FFG) package with 35 mm × 35 mm body size, 1.0 mm ball pitch, and Pb-free/ROHS-compliant finish. Thermal performance supports junction temperatures up to +100°C under sustained 5.2 W typical power dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| MGTREFCLK0P/N | Differential reference clock input | Provides low-jitter clock source for GTP transceiver PLLs; requires 100 Ω differential termination |
| IO_L0N_0 | Bank 0 I/O (negative side) | Configurable as LVDS, SSTL, or HSTL; supports programmable input delay for source-synchronous capture |
| CCLK | Configuration clock | Drives internal configuration logic during Master SelectMAP mode; max frequency 50 MHz |
| DONE | Configuration status output | Open-drain signal pulled high externally; asserts high when bitstream loading and CRC check complete |
| VCCAUX | Analog auxiliary supply | Must be regulated to 2.5 V ±3%; powers transceiver PLLs, configuration logic, and internal bias circuits |
Key Features
| Feature | Design Value |
|---|---|
| Embedded PowerPC 440 cores | Two hard-core 32-bit RISC processors enable real-time control plane offload while FPGA fabric handles data plane acceleration |
| DSP48E slices | 192 dedicated 25×18 multipliers with pipeline registers support 250+ GMAC/s for radar pulse compression or beamforming |
| Triple Modular Redundancy (TMR) | Hardware-supported voting logic and configuration scrubbing mitigate single-event upsets in space-grade applications |
| SelectIO technology | Per-pin programmability of I/O standard, slew rate, drive strength, and on-die termination simplifies board-level signal integrity tuning |
| AES-256 bitstream encryption | eFUSE-based key storage prevents unauthorized bitstream readback or cloning in deployed systems |
Applications
| Radar Baseband Processing | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Real-time digital beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes time-critical signal path logic; GTP transceivers interface with ADC/DAC FMC modules at 1.25 Gbps. Use Value: Deterministic sub-10 ns latency across processing pipelines enables coherent integration over 1024 pulses without external buffering. | Use Scenario: High-fidelity ultrasound echo digitization and RF beam synthesis in portable imaging platforms. IC Role / Device Role / Timing Role: Configurable I/O banks connect to 14-bit, 125 MSPS ADCs; DSP48E slices perform real-time envelope detection and log compression. Use Value: On-chip Block RAM eliminates need for external DDR2, reducing BOM cost and PCB layer count by two layers. |
| Avionics Data Concentrators | High-Energy Physics Trigger Systems |
Use Scenario: ARINC 429/664 (AFDX) protocol bridging and deterministic packet scheduling in flight control networks. IC Role / Device Role / Timing Role: PowerPC 440 cores run lightweight RTOS for network stack; CLBs implement time-triggered scheduler with hardware timestamping. Use Value: Hardware-enforced jitter < 50 ns ensures AFDX end-to-end latency remains within 100 µs guarantee. | Use Scenario: Level-1 trigger decision logic in particle detector readout systems requiring nanosecond-level coincidence detection. IC Role / Device Role / Timing Role: LUT-based pattern matching engine processes 16 parallel 80-MHz data streams; TMR logic maintains uptime during cosmic ray strikes. Use Value: Single-event upset recovery time < 2 µs prevents false triggers during high-radiation beam runs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture; 2588K logic cells; 128 GTY transceivers (up to 32.75 Gbps); no embedded PowerPC | Targets 5G fronthaul and AI inference where bandwidth >25 Gbps required; lacks radiation-hardened TMR flow | Choose for higher serial bandwidth and AI-accelerated compute; avoid if legacy PowerPC software stack or TMR certification is mandatory |
| XC7VX485T-2FFG1761I | 7-series architecture; 485,760 logic cells; 36 GTP transceivers (up to 6.6 Gbps); includes PCI Express Gen2 endpoint block | Suitable for PCIe-based instrumentation and test equipment; lower transceiver count limits multi-lane protocol support | Choose for PCIe Gen2 host interface integration and lower power; avoid if >64 transceivers or PowerPC co-processing is needed |
Compared with XC5VSX50T-3FFG665C, the XCVU9P offers 5× more logic and 2× higher transceiver speed but removes PowerPC cores and certified TMR toolflow; the XC7VX485T retains PCIe integration and lower static power but halves transceiver count and lacks radiation mitigation features.
Availability
XC5VSX50T-3FFG665C is available at Aetrix Electronics and suitable for radar subsystems, medical imaging front-ends, avionics data concentrators, and high-energy physics trigger systems requiring stable component supply across extended product lifecycles.
Supply support for XC5VSX50T-3FFG665C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, embedded, and aerospace applications following its acquisition of Xilinx in 2022.
The Virtex-5 family was engineered for high-bandwidth, deterministic-latency signal processing in defense radar, satellite communications, and scientific instrumentation where transceiver density and radiation tolerance are critical.
FAQ
What is the maximum supported transceiver data rate for XC5VSX50T-3FFG665C?
The XC5VSX50T-3FFG665C supports GTP transceivers operating at 1.0–2.5 Gbps per lane. This range enables compliance with XAUI (3.125 Gbps aggregate), SATA II (3.0 Gbps), and PCIe 1.0 (2.5 Gbps) standards. The -3 speed grade ensures timing closure at the upper end of this range under worst-case voltage and temperature conditions. XC5VSX50T-3FFG665C does not support rates above 2.5 Gbps per transceiver lane.
Does XC5VSX50T-3FFG665C include embedded processor cores?
Yes, XC5VSX50T-3FFG665C integrates two hard-core PowerPC 440 RISC processors running at up to 550 MHz. These cores operate independently of the FPGA fabric and support full Linux or VxWorks execution. XC5VSX50T-3FFG665C uses dedicated on-chip buses (PLB and OPB) to interface with fabric resources, enabling tightly coupled control-plane/data-plane architectures in radar and avionics systems.
What configuration methods are supported by XC5VSX50T-3FFG665C?
XC5VSX50T-3FFG665C supports Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. Master SelectMAP uses an external PROM or flash memory to auto-load bitstream on power-up; JTAG enables in-system programming and debugging. XC5VSX50T-3FFG665C also supports fallback configuration and multi-boot from dual SPI flash devices, with CRC verification and AES-256 decryption applied to all loaded bitstreams.
Is XC5VSX50T-3FFG665C qualified for aerospace or radiation-tolerant applications?
XC5VSX50T-3FFG665C is not a radiation-hardened part, but it supports Triple Modular Redundancy (TMR) design methodology with dedicated tools and configuration scrubbing. Customers have deployed XC5VSX50T-3FFG665C in low-earth orbit payloads using TMR-protected logic and external shielding. XC5VSX50T-3FFG665C has been used in NASA and ESA missions where single-event upset mitigation is implemented at the HDL level, not in silicon.
What I/O standards are supported by XC5VSX50T-3FFG665C?
XC5VSX50T-3FFG665C supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS, BLVDS, RSDS, and Differential SSTL across its 16 I/O banks. Each bank operates at independent VCCO voltages from 1.2 V to 3.3 V. XC5VSX50T-3FFG665C also provides programmable drive strength (2–24 mA), slew rate control, and on-die termination (25–150 Ω) per I/O pin.
XC5VSX50T-3FFG665C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 665-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 4080
- Number of Logic Elements/Cells:
- 52224
- Total RAM Bits:
- 4866048
- Number of I/O:
- 360
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 665-FCBGA (27x27)
XC5VSX50T-3FFG665C FAQ
1.How can I place an order for XC5VSX50T-3FFG665C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX50T-3FFG665C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX50T-3FFG665C reliable?
The price and inventory of XC5VSX50T-3FFG665C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX50T-3FFG665C is usually 5 days.
3.What payment methods are accepted for XC5VSX50T-3FFG665C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX50T-3FFG665C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX50T-3FFG665C?
XC5VSX50T-3FFG665C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX50T-3FFG665C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX50T-3FFG665C?
For technical support, including XC5VSX50T-3FFG665C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX50T-3FFG665C requirements.
6.How does Aetrix verify that XC5VSX50T-3FFG665C is sourced from the original manufacturer or authorized distributors?
All XC5VSX50T-3FFG665C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX50T-3FFG665C meets industry standards.
7.What is the process for return or replacement of XC5VSX50T-3FFG665C?
All XC5VSX50T-3FFG665C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX50T-3FFG665C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX50T-3FFG665C part is unused and in its original packaging.
Return procedure for XC5VSX50T-3FFG665C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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