AMD XC5VSX95T-1FF1136I
- Part No.:
- XC5VSX95T-1FF1136I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VSX95T-1FF1136I.pdf
- Description:
- IC FPGA 640 I/O 1136FCBGA
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
XC5VSX95T-1FF1136I from AMD (formerly Xilinx) is a Virtex-5 FPGA featuring 94,208 logic cells, 128 DSP48E slices, 6.9 Mb of block RAM, and high-speed serial transceivers operating up to 3.75 Gb/s. It is packaged in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1136) and targets high-bandwidth digital signal processing in radar and wired communications infrastructure.
For engineers reviewing the XC5VSX95T-1FF1136I datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver lane count (12 lanes), I/O standard support (LVDS, SSTL, HSTL), embedded memory depth, and thermal performance under sustained 2.5 W dynamic power.
Technical Context
The XC5VSX95T-1FF1136I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and integrated RocketIO GTP transceivers. It supports multi-gigabit serial protocols including PCI Express Gen1, SATA, and Serial RapidIO.
Its SelectIO technology enables interface flexibility across 1.2 V to 3.3 V I/O standards, while the 6-input LUT-based logic fabric delivers deterministic timing closure for synchronous designs operating at up to 500 MHz system clock rates.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 94,208 - total programmable resources for combinatorial and sequential logic implementation |
| DSP Slices | 128 × DSP48E - fixed-point arithmetic units supporting 25×18-bit multiply and 48-bit accumulation per slice |
| Block RAM | 6.9 Mb - distributed memory capacity usable as FIFOs, buffers, or lookup tables with byte-write enable |
| Transceivers | 12 × RocketIO GTP - 1.6–3.75 Gb/s serial lanes with built-in 8B/10B encoding and clock data recovery |
| I/O Pins | 640 user-configurable - supports LVDS, SSTL-2, HSTL-I, and differential signaling with programmable slew rate |
| Package | FFG1136 - 35×35 mm flip-chip BGA with 1.0 mm ball pitch and thermal lid for industrial temperature operation |
Pinout & Package
XC5VSX95T-1FF1136I is housed in the FFG1136 package: a 1136-ball flip-chip BGA with thermal lid, designed for industrial temperature range (–40°C to +100°C junction). Pin assignment follows Xilinx UG192 (Virtex-5 Packaging and Pinout) with dedicated configuration, clock, JTAG, and transceiver banks.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock Input | Drives internal configuration state machine during master serial mode; requires 50 MHz max frequency |
| DONE | Configuration Status Output | Open-drain signal indicating successful bitstream loading and device initialization |
| M0–M2 | Mode Selection Inputs | Set configuration mode (e.g., Master Serial, Slave SelectMAP) at power-up |
| GTX_CLK0_M2C_P/N | Differential Transceiver Reference Clock | Provides low-jitter reference for GTP transceiver PLLs; must be routed with controlled impedance |
| VCCINT | Core Power Supply | 1.0 V ±3% supply for FPGA logic fabric; requires low-noise regulation and local decoupling |
Key Features
| Feature | Design Value |
|---|---|
| Advanced 65 nm copper process | Enables higher density and lower static power vs. previous 90 nm Virtex-4 generation |
| Integrated PCIe Endpoint Block | Hard IP supporting x1/x2/x4 Gen1 link layer with DMA and TLP parsing without soft-core overhead |
| Partial Reconfiguration Support | Allows dynamic module swapping in operational systems without full reconfiguration downtime |
| System Monitor (XADC) | On-die dual 12-bit ADC monitoring die temperature and supply voltages (VCCINT, VCCAUX) |
| Multi-Voltage I/O Banks | Eight independent I/O banks support mixed-voltage interfaces (1.2 V to 3.3 V) simultaneously on one device |
Applications
| Radar Signal Processing | High-Speed Wired Communications |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in ground-based phased-array radar systems. IC Role / Device Role / Timing Role: FPGA fabric executes parallel FFTs and adaptive filtering; GTP transceivers interface with ADC/DAC FMC modules at 3.125 Gb/s. Use Value: 128 DSP48E slices deliver >200 GOPS peak compute; deterministic timing ensures sub-microsecond latency for closed-loop tracking. | Use Scenario: Line-card processing in 10G Ethernet and OTN transport equipment with FEC offload. IC Role / Device Role / Timing Role: Implements IEEE 802.3ae MAC, Reed-Solomon encoder/decoder, and SerDes-to-parallel bridging logic. Use Value: Integrated PCIe endpoint enables direct host CPU access to packet buffers; 6.9 Mb block RAM supports 128-entry deep packet queues. |
| Medical Imaging Backend | Test & Measurement Instrumentation |
Use Scenario: Digital backend for ultrasound beamformers requiring channel count scaling and real-time image reconstruction. IC Role / Device Role / Timing Role: Configurable logic processes echo data streams from 128+ channels; LVDS I/O interfaces with analog front-end ASICs. Use Value: 640 user I/O pins support simultaneous high-channel-count sensor interfacing; 94K logic cells implement scalable FIR filter pipelines. | Use Scenario: High-resolution oscilloscope digitizer with 1 GS/s sampling and real-time waveform analysis. IC Role / Device Role / Timing Role: Synchronizes multi-channel ADCs, performs on-the-fly histogramming and trigger logic, and manages DDR2 memory buffering. Use Value: Embedded System Monitor provides real-time thermal derating feedback; 12 GTP lanes aggregate data from eight 125 MS/s ADCs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC5VLX110T-1FF1136I | Same package and speed grade, but 110K logic cells, no GTP transceivers, 240 DSP slices | Better suited for compute-intensive logic-only tasks; lacks serial I/O for backplane interconnect | Select when transceiver count is unnecessary and DSP resource density is prioritized over serial bandwidth |
| XCVU9P-2FFVB2104I | UltraScale architecture, 2588K logic cells, 128 GTY transceivers (up to 32.75 Gb/s), 114.5 Mb block RAM | Supports next-gen protocols (PCIe Gen4, 100G Ethernet); requires new PCB layout and toolchain migration | Choose for long-term roadmap continuity and bandwidth scalability beyond Virtex-5 limits |
Compared with XC5VSX95T-1FF1136I, XC5VLX110T-1FF1136I trades transceivers for additional DSP and logic, while XCVU9P-2FFVB2104I offers order-of-magnitude bandwidth and capacity growth at the cost of design rework and toolchain transition.
Availability
XC5VSX95T-1FF1136I is available at Aetrix Electronics and suitable for radar signal processing, high-speed wired communications, and medical imaging backend systems requiring stable component supply across extended product lifecycles.
Supply support for XC5VSX95T-1FF1136I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Virtex-5 family was originally designed by Xilinx for high-performance, high-bandwidth applications demanding both logic density and serial connectivity in aerospace, defense, and wired infrastructure.
FAQ
What is the maximum operating junction temperature for XC5VSX95T-1FF1136I?
The XC5VSX95T-1FF1136I is rated for industrial temperature operation with a maximum junction temperature of +100°C. This specification is validated under worst-case voltage, frequency, and ambient conditions defined in Xilinx DS100. Thermal management must maintain junction temperature within this limit using appropriate heatsinking and airflow, especially when operating multiple GTP transceivers at 3.75 Gb/s. The XC5VSX95T-1FF1136I integrates an on-die XADC for real-time monitoring of die temperature.
Does XC5VSX95T-1FF1136I support partial reconfiguration?
Yes, XC5VSX95T-1FF1136I supports partial reconfiguration through Xilinx ISE Design Suite 14.7 and later versions. This capability allows dynamic replacement of specific logic modules while the rest of the design remains operational. Use cases include protocol adaptation in communications gear or algorithm updates in radar processing. The XC5VSX95T-1FF1136I requires dedicated configuration logic and bitstream partitioning; full documentation is provided in UG194 (Virtex-5 Configuration User Guide).
What I/O standards are supported by XC5VSX95T-1FF1136I?
XC5VSX95T-1FF1136I supports LVDS, LVPECL, SSTL-18/2, HSTL-I/II, and differential signaling standards across its 640 user I/O pins. Each of the eight I/O banks operates independently and can be powered between 1.2 V and 3.3 V. The XC5VSX95T-1FF1136I does not support 1.0 V or sub-1.2 V I/O standards. Configuration and transceiver banks have fixed voltage requirements detailed in DS100.
Is XC5VSX95T-1FF1136I compatible with Vivado Design Suite?
No, XC5VSX95T-1FF1136I is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 as the final and only officially supported toolchain. Vivado targets 7-series and newer architectures. Migration to newer devices like Kintex-7 or Virtex-7 is necessary to use Vivado. The XC5VSX95T-1FF1136I bitstream generation, timing analysis, and debugging workflows are fully validated only in ISE 14.7.
What is the configuration memory requirement for XC5VSX95T-1FF1136I?
The XC5VSX95T-1FF1136I requires a minimum 25.6 Mbit (3.2 MB) configuration PROM for master serial mode, as specified in DS100. This accounts for full bitstream size, CRC overhead, and startup clock cycles. Commonly used devices include XCF32P or third-party SPI flash with proper timing margins. The XC5VSX95T-1FF1136I supports fallback and multi-boot configurations when paired with larger PROMs, enabling field-upgradable firmware images.
XC5VSX95T-1FF1136I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7360
- Number of Logic Elements/Cells:
- 94208
- Total RAM Bits:
- 8994816
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VSX95T-1FF1136I FAQ
1.How can I place an order for XC5VSX95T-1FF1136I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX95T-1FF1136I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX95T-1FF1136I reliable?
The price and inventory of XC5VSX95T-1FF1136I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX95T-1FF1136I is usually 5 days.
3.What payment methods are accepted for XC5VSX95T-1FF1136I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX95T-1FF1136I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX95T-1FF1136I?
XC5VSX95T-1FF1136I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX95T-1FF1136I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX95T-1FF1136I?
For technical support, including XC5VSX95T-1FF1136I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX95T-1FF1136I requirements.
6.How does Aetrix verify that XC5VSX95T-1FF1136I is sourced from the original manufacturer or authorized distributors?
All XC5VSX95T-1FF1136I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX95T-1FF1136I meets industry standards.
7.What is the process for return or replacement of XC5VSX95T-1FF1136I?
All XC5VSX95T-1FF1136I units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX95T-1FF1136I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX95T-1FF1136I part is unused and in its original packaging.
Return procedure for XC5VSX95T-1FF1136I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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