AMD XC5VSX95T-2FF1136C
- Part No.:
- XC5VSX95T-2FF1136C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 1136-BBGA, FCBGA
- Datasheet:
-
XC5VSX95T-2FF1136C.pdf
- Description:
- IC FPGA 640 I/O 1136FCBGA
- Quantity:
- Payment:

- Shipping:

Inventory:1,670
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Product details
Overview
XC5VSX95T-2FF1136C from AMD is a Virtex-5 FPGA featuring 94,200 logic cells, 128 DSP48E slices, 6.9 Mb of block RAM, and 480 user I/Os in an 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1136) package. It targets high-performance digital signal processing and embedded vision systems requiring deterministic timing and multi-gigabit serial connectivity.
For engineers reviewing the XC5VSX95T-2FF1136C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage support (1.2 V to 3.3 V), -2 speed grade timing performance, integrated PCIe® Gen1 endpoint capability, and GTP transceiver data rates up to 3.75 Gbps.
Technical Context
The XC5VSX95T-2FF1136C implements a hierarchical FPGA architecture with six distinct logic tile types, including dedicated DSP and memory blocks. It integrates 24 GTP serial transceivers supporting protocols including SATA, PCI Express, and Serial RapidIO.
Configuration occurs via Master SelectMAP or JTAG, with bitstream encryption and Device DNA authentication available for secure deployment. The device supports partial reconfiguration and dynamic power management through multiple I/O bank voltage domains and per-bank VCCO control.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 94,200 - provides scalable fabric for complex RTL implementations with predictable timing closure |
| DSP Slices | 128 × DSP48E - enables parallel multiply-accumulate operations at up to 550 MHz for radar and video filtering |
| Block RAM | 6.9 Mb - supports large on-chip buffering for frame stores, FIFOs, and coefficient tables |
| GTP Transceivers | 24 × 3.75 Gbps - delivers native SerDes for multi-protocol serial interfaces without external PHYs |
| I/O Pins | 480 user I/Os - configurable across 12 banks with independent VCCO and VREF per bank |
| Speed Grade | -2 - guarantees maximum clock frequencies up to 550 MHz for system logic and 311 MHz for I/O registers |
| Package | FFG1136 - 35 mm × 35 mm flip-chip BGA with 1.0 mm ball pitch, compatible with standard PCB assembly processes |
Pinout & Package
XC5VSX95T-2FF1136C is housed in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG1136) package with 480 user-configurable I/Os distributed across 12 I/O banks. Power and ground balls are arranged per Xilinx/AMD FPGA packaging standards to support low-noise supply delivery and thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core Supply | 1.0 V ±3% supply for FPGA logic fabric; requires low-ESR decoupling near package corners |
| VCCAUX | Auxiliary Supply | 2.5 V supply for configuration circuitry, JTAG, and certain I/O banks; shared with transceiver auxiliary rails |
| VCCO_0–VCCO_11 | I/O Bank Supply | Programmable 1.2 V to 3.3 V per bank; enables mixed-voltage interface coexistence on single board |
| MR | Master Reset | Active-low asynchronous reset that clears configuration memory and halts startup sequence |
| CCLK | Configuration Clock | Input clock for Master SelectMAP configuration mode; frequency ≤ 50 MHz |
| INIT_B | Configuration Status | Open-drain output indicating configuration status; pulled high during valid bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint | Hard IP block supporting x1/x2/x4 Gen1 links with full protocol stack handling and DMA engine |
| Partial Reconfiguration | Enables dynamic module swapping without full device reset-critical for adaptive computing and runtime function updates |
| Device DNA Security | Unique 57-bit identifier fused at manufacture; used for bitstream encryption key binding and anti-cloning enforcement |
| Multi-Voltage I/O Banks | 12 independent banks each support selectable VCCO (1.2–3.3 V) and VREF, enabling direct interfacing to DDR2, LVDS, and SSTL devices |
| GTP Transceiver Calibration | On-chip calibration engine compensates for PVT variation to maintain 3.75 Gbps link integrity without external tuning |
Applications
| Radar Signal Processing | Medical Imaging Acceleration |
|---|---|
Use Scenario: Real-time beamforming and pulse-Doppler processing in phased-array radar systems. IC Role / Device Role / Timing Role: High-throughput parallel processor implementing FFT, CFAR, and STAP algorithms with sub-microsecond latency. Use Value: 128 DSP48E slices deliver >200 GOPS peak compute; GTP transceivers stream ADC data directly from RF front-end at 3.125 Gbps. | Use Scenario: On-board reconstruction pipeline for CT and MRI scanners requiring deterministic throughput and low jitter. IC Role / Device Role / Timing Role: Co-processor managing back-projection, filtering, and DICOM compression while interfacing with DDR2 memory and GigE cameras. Use Value: 6.9 Mb block RAM buffers full sinogram frames; PCIe Gen1 endpoint enables direct host memory mapping for zero-copy transfers. |
| Avionics Data Concentrators | High-Speed Test Equipment |
Use Scenario: ARINC 429/664 and MIL-STD-1553 bus aggregation in flight control computers. IC Role / Device Role / Timing Role: Protocol-aware bridge with time-stamped packet routing, error correction, and deterministic scheduling. Use Value: 480 I/Os support concurrent multi-bus physical layer interfaces; -2 speed grade ensures <5 ns setup/hold margins for 10 MHz ARINC clocks. | Use Scenario: Modular ATE platforms requiring reconfigurable pattern generation and high-fidelity response analysis. IC Role / Device Role / Timing Role: Vector generator and comparator core synchronized to 200 MHz system clock with picosecond-level jitter control. Use Value: GTP transceivers provide loopback-capable 3.75 Gbps stimulus channels; partial reconfiguration allows test algorithm updates without hardware swap. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-performance FPGA applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2588K logic cells, 60 GTY transceivers (12.5 Gbps), larger FFG2104 package | Targets next-gen 5G and AI inference where higher density and bandwidth justify cost and board space | Select when migrating beyond Virtex-5 capacity limits or requiring >6 Gbps serial I/O |
| XC5VLX110T-2FF1136C | Same Virtex-5 family, 110K logic cells, no DSP48E slices, identical FFG1136 package and pinout | Suitable for logic-intensive but math-light applications such as protocol bridging and I/O expansion | Choose for cost-sensitive designs needing same footprint and configuration but lower DSP demand |
Compared with XC5VSX95T-2FF1136C, the XCVU9P-2FLGA2104I offers significantly higher bandwidth and logic density at increased cost and complexity, while the XC5VLX110T-2FF1136C shares mechanical compatibility and configuration flow but omits DSP resources-making it viable only where arithmetic acceleration is unnecessary.
Availability
XC5VSX95T-2FF1136C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging acceleration, avionics data concentrators, and high-speed test equipment requiring stable component supply and long-term lifecycle support.
Supply support for XC5VSX95T-2FF1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with heritage in FPGA technology through its acquisition of Xilinx.
The Virtex-5 family was designed for demanding high-speed digital signal processing, embedded vision, and wired/wireless infrastructure applications requiring balanced logic, memory, and DSP resources.
FAQ
What is the maximum operating temperature for XC5VSX95T-2FF1136C?
The XC5VSX95T-2FF1136C is rated for commercial temperature range operation (0 °C to +85 °C case temperature). Its thermal design requires a minimum of four thermal vias under the package and a 4-layer PCB with internal ground/power planes to maintain junction temperature below 100 °C under full utilization. The device includes on-die thermal sensors accessible via JTAG for real-time monitoring in deployed XC5VSX95T-2FF1136C systems.
Does XC5VSX95T-2FF1136C support JTAG boundary-scan testing?
Yes, XC5VSX95T-2FF1136C fully complies with IEEE 1149.1 (JTAG) standards and supports boundary-scan testing of all user I/O pins. The TAP controller enables instruction register access, data register read/write, and IDCODE verification. This capability is active during and after configuration, allowing in-system validation of solder joints and interconnect integrity on boards using XC5VSX95T-2FF1136C without requiring functional firmware.
Can XC5VSX95T-2FF1136C be configured via SPI flash memory?
No, XC5VSX95T-2FF1136C does not support native SPI flash configuration. It requires either Master SelectMAP mode (using parallel NOR flash or microcontroller-driven parallel interface) or JTAG programming. Configuration bitstreams must be loaded through dedicated CCLK, D0–D7, and associated control signals. External SPI-to-parallel bridge ICs may be used, but XC5VSX95T-2FF1136C itself lacks internal SPI controller logic.
What PCIe capabilities does XC5VSX95T-2FF1136C provide?
XC5VSX95T-2FF1136C integrates a hard PCIe Gen1 endpoint block supporting x1, x2, and x4 link widths with full transaction layer, data link layer, and physical layer implementation. It handles TLP encoding/decoding, credit-based flow control, and MSI/MSI-X interrupt generation. The PCIe interface operates at 2.5 Gbps per lane and is validated for use with Intel and AMD host chipsets-no external PHY required in XC5VSX95T-2FF1136C designs.
Is XC5VSX95T-2FF1136C pin-compatible with other Virtex-5 FFG1136 devices?
XC5VSX95T-2FF1136C shares the FFG1136 package footprint and ball map with other Virtex-5 devices in the same density class and speed grade, including XC5VLX110T-2FF1136C and XC5VTX240T-2FF1136C. However, I/O bank assignments, configuration pin functions, and transceiver locations differ between families (SXT vs. LXT vs. TXT), so PCB layout reuse requires verification against each device's specific pinout documentation-not assumed compatibility for XC5VSX95T-2FF1136C.
XC5VSX95T-2FF1136C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Virtex®-5 SXT
- Package/Case:
- 1136-BBGA, FCBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7360
- Number of Logic Elements/Cells:
- 94208
- Total RAM Bits:
- 8994816
- Number of I/O:
- 640
- Number of Gates:
- -
- Voltage - Supply:
- 0.95V ~ 1.05V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 1136-FCBGA (35x35)
XC5VSX95T-2FF1136C FAQ
1.How can I place an order for XC5VSX95T-2FF1136C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC5VSX95T-2FF1136C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC5VSX95T-2FF1136C reliable?
The price and inventory of XC5VSX95T-2FF1136C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC5VSX95T-2FF1136C is usually 5 days.
3.What payment methods are accepted for XC5VSX95T-2FF1136C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC5VSX95T-2FF1136C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC5VSX95T-2FF1136C?
XC5VSX95T-2FF1136C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC5VSX95T-2FF1136C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC5VSX95T-2FF1136C?
For technical support, including XC5VSX95T-2FF1136C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC5VSX95T-2FF1136C requirements.
6.How does Aetrix verify that XC5VSX95T-2FF1136C is sourced from the original manufacturer or authorized distributors?
All XC5VSX95T-2FF1136C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC5VSX95T-2FF1136C meets industry standards.
7.What is the process for return or replacement of XC5VSX95T-2FF1136C?
All XC5VSX95T-2FF1136C units undergo pre-shipment inspection (PSI). If there is an issue with XC5VSX95T-2FF1136C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC5VSX95T-2FF1136C part is unused and in its original packaging.
Return procedure for XC5VSX95T-2FF1136C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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