AMD XC5VSX95T-3FF1136C

Overview

XC5VSX95T-3FF1136C from AMD (formerly Xilinx) is a Virtex-5 FPGA with 94,208 logic cells, 12.5 Mb of block RAM, 320 DSP48E slices, and 640 user I/Os in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FFG1136) package. It targets high-performance digital signal processing and reconfigurable computing in radar, medical imaging, and high-speed data acquisition systems.

For engineers reviewing the XC5VSX95T-3FF1136C datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, embedded memory depth, DSP slice count, I/O voltage support (1.2 V/1.5 V/1.8 V/2.5 V), and speed grade (-3 = highest performance).

Technical Context

The XC5VSX95T-3FF1136C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated DSP48E slices for multiply-accumulate operations, and high-speed serial transceivers supporting up to 3.75 Gb/s. It integrates SelectIO technology with programmable I/O standards including LVCMOS, SSTL, HSTL, and differential standards like LVDS and RSDS.

Its clocking system includes up to 32 DCMs (Digital Clock Managers) and 16 PLLs for precise clock synthesis, phase alignment, and jitter reduction across multiple clock domains. The device supports partial reconfiguration and System Monitor functionality for on-chip temperature and supply voltage monitoring.

Key Specifications

Pinout & Package

XC5VSX95T-3FF1136C is housed in a 1136-ball Flip-Chip Fine-Pitch BGA (FFG1136) package with 35 mm × 35 mm footprint and 1.0 mm ball pitch. Thermal and mechanical design requires adherence to Xilinx UG192 and UG193 layout guidelines.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XC5VSX95T-3FF1136C, the XCVU9P-2FLGA2104I delivers significantly higher compute density and bandwidth but demands new PCB layout and Vivado toolflow adoption; the XC6VLX240T-3FF1156C offers incremental logic scaling within similar mechanical constraints but lacks native high-speed transceivers.

Availability

XC5VSX95T-3FF1136C is available at Aetrix Electronics and suitable for radar signal processing, medical imaging systems, and high-speed data acquisition requiring stable component supply throughout extended product lifecycles.

Supply support for XC5VSX95T-3FF1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor leader delivering adaptive computing solutions, acquired Xilinx in 2022 to expand its FPGA and adaptive SoC portfolio.

The Virtex-5 family was designed for high-bandwidth, compute-intensive applications including aerospace, defense, and scientific instrumentation where deterministic timing and mixed-signal integration are critical.

FAQ

What is the maximum supported I/O standard voltage for XC5VSX95T-3FF1136C?

The XC5VSX95T-3FF1136C supports I/O bank voltages of 1.2 V, 1.5 V, 1.8 V, and 2.5 V. Each I/O bank is independently configurable, allowing mixed-voltage operation across banks. It does not support 3.3 V I/O in HR banks without external level-shifting circuitry, as confirmed in Xilinx DS106 and UG190 documentation.

Does XC5VSX95T-3FF1136C include built-in transceivers?

Yes, the XC5VSX95T-3FF1136C integrates RocketIO GTP transceivers capable of serial data rates up to 3.75 Gb/s. These transceivers support protocols including PCIe Gen1/Gen2, Serial RapidIO, and Aurora, and require external reference clocks and proper AC-coupled differential routing per UG193 guidelines.

What configuration modes are supported by XC5VSX95T-3FF1136C?

The XC5VSX95T-3FF1136C supports Master SelectMAP, Slave SelectMAP, Slave Serial, and JTAG configuration modes. Configuration is initiated via dedicated CONFIG_IO pins, and bitstream security features include AES encryption and HMAC authentication, as specified in Xilinx UG191.

Is partial reconfiguration supported on XC5VSX95T-3FF1136C?

Yes, partial reconfiguration is fully supported on XC5VSX95T-3FF1136C using the PlanAhead and ISE Design Suite toolflows. This enables dynamic replacement of logic modules without resetting the entire device, preserving state in unmodified regions during runtime updates.

What thermal management guidance applies to XC5VSX95T-3FF1136C?

XC5VSX95T-3FF1136C requires a thermal solution rated for up to 3.5 W typical power dissipation under active use. Xilinx recommends a 4-layer PCB with internal ground/power planes, thermal vias under the package, and optional heat sink attachment per UG192. Junction temperature must remain below 100°C for commercial-grade operation.