AMD XC5VSX95T-3FFG1136C

Overview

XC5VSX95T-3FFG1136C from AMD is a Virtex-5 FPGA with 94,208 logic cells, 12.8 Gb/s serial transceiver capability (via RocketIO GTP), and 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) packaging. It targets high-performance digital signal processing in radar beamforming systems requiring deterministic latency and multi-gigabit serial I/O.

For engineers reviewing the XC5VSX95T-3FFG1136C datasheet, pinout, applications, or equivalent options, key selection criteria include transceiver line rate, CLB count, DSP48E slice availability, and thermal performance under sustained 3.2 W dynamic power dissipation.

Technical Context

The XC5VSX95T-3FFG1136C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), 192 embedded DSP48E slices for arithmetic-intensive tasks, and 24 RocketIO GTP transceivers supporting 1.0–3.2 Gb/s line rates. It uses 65 nm copper process technology and supports SelectIO standards including LVDS, SSTL, and HSTL.

Configuration occurs via Master SelectMAP or JTAG, with dual-boot capability using internal configuration memory. The device integrates 6.4 Mb of block RAM and supports partial reconfiguration for runtime logic updates without system reset.

Key Specifications

Pinout & Package

XC5VSX95T-3FFG1136C is housed in a 1136-pin Flip-Chip Fine-Pitch Ball Grid Array (FC-FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and thermal lid for enhanced heat dissipation in conduction-cooled modules.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-performance FPGA applications.

Compared with XCVU9P-2FLGA2104I and XC7VX690T-2FFG1927I, the XC5VSX95T-3FFG1136C offers optimal balance of transceiver count, logic density, and thermal profile for mid-band phased array systems operating below 6 GHz, with proven reliability in extended-temperature industrial deployments.

Availability

XC5VSX95T-3FFG1136C is available at Aetrix Electronics and suitable for radar subsystems, medical imaging front-ends, avionics data concentrators, and high-speed test instrumentation requiring stable component supply across long production lifecycles.

Supply support for XC5VSX95T-3FFG1136C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD is a global semiconductor company focused on high-performance and adaptive computing solutions, with leadership in FPGA, CPU, GPU, and adaptive SoC technologies.

The Virtex-5 family was engineered for demanding signal processing and high-speed serial connectivity applications in defense, aerospace, and medical imaging systems where deterministic timing and radiation-tolerant configuration are essential.

FAQ

What is the maximum supported transceiver line rate for XC5VSX95T-3FFG1136C?

The XC5VSX95T-3FFG1136C supports RocketIO GTP transceivers with a maximum line rate of 3.2 Gb/s per lane. This specification is validated across commercial temperature range (0°C to 85°C) and applies to all 24 transceiver quads. Line rate configuration is performed via IDELAY/ODELAY primitives and transceiver attribute settings in the Xilinx ISE design suite.

Does XC5VSX95T-3FFG1136C support partial reconfiguration?

Yes, the XC5VSX95T-3FFG1136C supports partial reconfiguration through the use of modular design flow in Xilinx ISE 14.7. This allows dynamic replacement of logical modules-such as filter coefficients or protocol engines-without resetting the entire device. Configuration is managed via ICAP interface or dedicated PR boundary logic within the FPGA fabric.

What I/O standards are supported by XC5VSX95T-3FFG1136C?

The XC5VSX95T-3FFG1136C supports LVDS, SSTL-2 Class I/II, HSTL-I/II, and LVCMOS standards across its 640 user I/O pins. Each I/O bank is independently configurable for voltage (1.2 V to 3.3 V), slew rate, and drive strength. Differential standards require adjacent pin pairing and proper termination matching per bank.

What is the thermal design power (TDP) of XC5VSX95T-3FFG1136C under typical operation?

The XC5VSX95T-3FFG1136C has a typical dynamic power consumption of 3.2 W at 85°C junction temperature with 50% logic utilization and active transceivers. Static power contributes 1.2 W. Thermal design must accommodate 35 K/W junction-to-case resistance using the FC-FBGA thermal lid, requiring ≥200 LFM airflow or heatsink interface with ≤0.5 °C·in²/W thermal resistance.

Is XC5VSX95T-3FFG1136C compatible with Xilinx ISE 14.7 design tools?

Yes, XC5VSX95T-3FFG1136C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. Device-specific constraints files (.ucf), simulation models (VHDL/Verilog), and transceiver wizard IP cores are provided in the Virtex-5 library. No newer tool versions support this device.