My Inquiry
My Account
AMD XC6SLX100-2CSG484I
- Part No.:
- XC6SLX100-2CSG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX100-2CSG484I.pdf
- Description:
- IC FPGA 338 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,650
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100-2CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbits block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX100-2CSG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), differential signaling support (LVDS, TMDS), configuration interface options (SPI, SelectMAP), and industrial-grade thermal reliability.
Technical Context
The XC6SLX100-2CSG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It supports multi-standard I/O banks with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (100 Ω differential, 50–150 Ω single-ended).
Configuration is performed via Master SPI or Slave SelectMAP mode using external flash or processor. JTAG boundary-scan (IEEE 1149.1) is supported for testing and programming. The device includes internal oscillator (1–10 MHz) and dual-boot capability with fallback configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - provides sufficient resources for medium-complexity digital controllers or protocol bridging logic |
| User I/O Pins | 348 - enables high-density interface consolidation (e.g., parallel bus + multiple serial links) |
| Block RAM | 1,824 Kbits - supports buffering of video frames or packetized communication data streams |
| DSP Slices | 220 × DSP48A1 - delivers 220 parallel multiply-accumulate operations per clock cycle for motor control algorithms |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for deployment in enclosed industrial enclosures without active cooling |
| Package | CSG484 - 484-pin CCGA-style fine-pitch ball grid array with 1.0 mm pitch and 23×23 array |
Pinout & Package
The XC6SLX100-2CSG484I is housed in a 484-pin CSG (Chip Scale Grid Array) package with 1.0 mm ball pitch, 23×23 ball array, and Pb-free/ROHS-compliant finish. Thermal pad on underside requires solder paste stencil design per Xilinx UG381.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND / VCCO | Power supply reference per I/O bank | Enables independent voltage setting (1.2–3.3 V) per bank for mixed-voltage interface interfacing |
| IO_LxxN/IO_LxxP | Differential I/O pair | Supports LVDS, RSDS, or TMDS signaling with internal 100 Ω termination and skew-matched routing |
| M0–M2 | Configuration mode select | Determines boot source (SPI flash, NAND, or processor-controlled SelectMAP) at power-up |
| CCLK | Configuration clock input | Accepts up to 50 MHz clock during master SPI configuration; drives slave devices in daisy-chain mode |
| DONE | Configuration status output | Drives high after successful bitstream load and CRC check; used for system reset synchronization |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | 12 independent banks support simultaneous 1.2 V, 1.5 V, 1.8 V, 2.5 V, and 3.3 V interfaces without level shifters |
| Integrated Clock Management | Four DCMs provide jitter-reduced clock synthesis, phase shifting, and frequency multiplication for synchronous subsystems |
| Embedded Block RAM | 1,824 Kbits distributed across 112 blocks enable dual-port FIFOs or small lookup tables without external memory |
| Configurable I/O Standards | Supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, and TMDS - simplifies integration with FPGAs, ASICs, and display controllers |
| Industrial Temperature Rating | Qualified across -40°C to +100°C ambient, enabling use in uncooled factory automation cabinets |
Applications
| Industrial Motor Drive Controller | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time PWM generation, current loop feedback sampling, and field-oriented control (FOC) execution in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond I/O response latency. Use Value: Deterministic timing ensures consistent PWM edge placement and ADC sampling alignment, reducing torque ripple by up to 12% versus microcontroller-based solutions. | Use Scenario: High-speed digital pattern generation and acquisition for semiconductor wafer probing. IC Role / Device Role / Timing Role: Programmable vector engine synchronizing 32-channel parallel test vectors with <100 ps channel-to-channel skew. Use Value: On-chip delay calibration and per-pin slew control maintain signal integrity at 150 Mbps per pin across all 348 I/Os. |
| Video Interface Bridge | Programmable Logic PLC Module |
Use Scenario: Converting MIPI D-PHY camera streams to HDMI 1.4a output for machine vision inspection systems. IC Role / Device Role / Timing Role: Protocol translation engine with embedded SerDes-like serialization/deserialization using I/O logic and block RAM buffers. Use Value: Supports 720p60 video throughput with <2-line latency using 16-bit DDR I/O and dual-edge capture techniques. | Use Scenario: Replacing fixed-function ASICs in modular PLC backplanes requiring field-upgradable logic for I/O expansion and safety monitoring. IC Role / Device Role / Timing Role: Reconfigurable logic core implementing custom ladder logic, motion profiling, and SIL2-compliant diagnostics. Use Value: Enables firmware-level updates to control logic without hardware redesign or downtime during plant maintenance windows. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586K logic cells, 48.8 Gb/s transceivers, higher power and cost | Targeted at high-bandwidth video processing or 5G fronthaul - overqualified for deterministic I/O tasks | Select only when >1 Gbps serial connectivity or >500K logic cells are required; not drop-in compatible |
| XC7A100T-2CSG324I | Artix-7 family, 101,440 logic cells, same I/O count (210), but lacks dedicated DSP48A1 slices and has lower block RAM (4.9 Mb) | Better suited for low-cost, low-power applications where DSP-intensive motor control is not needed | Consider for cost-sensitive designs with relaxed DSP and memory requirements; pinout and footprint differ |
Compared with XC6SLX100-2CSG484I, the XC7A100T-2CSG324I offers lower static power and newer toolchain support but sacrifices DSP density and industrial I/O robustness; the XCVU9P-2FLGA2104I delivers massive scalability at the expense of thermal management complexity and BOM cost.
Availability
XC6SLX100-2CSG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, video interface bridging, and programmable logic PLC modules requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-2CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable I/O performance, low static power, and industrial temperature operation - especially in motor control, display, and industrial communications.
FAQ
What is the maximum operating frequency of the XC6SLX100-2CSG484I?
The XC6SLX100-2CSG484I is rated at speed grade -2, guaranteeing timing closure for critical paths up to 500 MHz under industrial temperature conditions (-40°C to +100°C). Actual achievable frequency depends on design utilization, routing congestion, and I/O standard selection - verified via Xilinx ISE timing analysis reports for the XC6SLX100-2CSG484I.
Does the XC6SLX100-2CSG484I support JTAG boundary-scan?
Yes, the XC6SLX100-2CSG484I fully supports IEEE 1149.1 JTAG boundary-scan for device programming, debugging, and interconnect testing. The TDI, TDO, TMS, TCK, and TRST pins are dedicated and electrically compliant per JTAG specification - confirmed in Xilinx DS162 datasheet section 5 for the XC6SLX100-2CSG484I.
Can the XC6SLX100-2CSG484I be configured via SPI flash?
Yes, the XC6SLX100-2CSG484I supports Master SPI configuration mode using standard quad-SPI or standard SPI flash devices (e.g., Micron MT25QL series). Configuration occurs automatically at power-up when M0–M2 pins are set to 000, and the XC6SLX100-2CSG484I drives the CCLK signal to clock data from flash into its configuration memory.
What I/O standards are supported by the XC6SLX100-2CSG484I?
The XC6SLX100-2CSG484I supports LVCMOS, LVTTL, SSTL, HSTL, LVDS, RSDS, and TMDS across its 12 independently powered I/O banks. Each bank can be set to 1.2 V, 1.35 V, 1.5 V, 1.8 V, 2.5 V, or 3.3 V, enabling direct interfacing with diverse peripherals without external level shifters - as specified in the XC6SLX100-2CSG484I DC and switching characteristics table.
Is the XC6SLX100-2CSG484I qualified for industrial temperature operation?
Yes, the XC6SLX100-2CSG484I is explicitly qualified for industrial temperature range (-40°C to +100°C) and marked with suffix 'I' to denote this rating. Thermal performance is validated per JEDEC JESD22-A104 reliability testing, and the XC6SLX100-2CSG484I maintains full functionality and timing compliance across this range without derating.
XC6SLX100-2CSG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX100-2CSG484I FAQ
1.How can I place an order for XC6SLX100-2CSG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2CSG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2CSG484I reliable?
The price and inventory of XC6SLX100-2CSG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2CSG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2CSG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2CSG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2CSG484I?
XC6SLX100-2CSG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2CSG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2CSG484I?
For technical support, including XC6SLX100-2CSG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2CSG484I requirements.
6.How does Aetrix verify that XC6SLX100-2CSG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2CSG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2CSG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2CSG484I?
All XC6SLX100-2CSG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2CSG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2CSG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-2CSG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100-2CSG484I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
