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AMD XC6SLX100-2FG676C
- Part No.:
- XC6SLX100-2FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-2FG676C.pdf
- Description:
- IC FPGA 480 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,139
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Product details
Overview
XC6SLX100-2FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbits block RAM per block, 240 DSP48A1 slices, and operates at -2 speed grade with 1.2 V core voltage. It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100-2FG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (480 user I/Os), LVDS-compatible banks, single-ended signaling support, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX100-2FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), dedicated carry chains, and distributed RAM. It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS and TMDS.
It integrates dual-register flip-flops per slice, six-input LUTs, and supports system-level features like Digital Clock Managers (DCMs) for clock synthesis and phase alignment, and internal configuration access port (ICAP) for dynamic reconfiguration.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total programmable fabric resources for combinatorial and sequential logic implementation |
| User I/O Pins | 480 - configurable single-ended or differential I/Os across 24 banks with independent voltage support |
| Block RAM | 2,152 Kbits - distributed across 228 blocks of 18 Kbits each for data buffering and FIFOs |
| DSP Slices | 240 - fixed-function multiply-accumulate units supporting 18×18-bit signed multiplication |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in typical conditions |
| Core Voltage | 1.2 V ±3% - required supply for CLB and interconnect operation with defined power integrity constraints |
| Package | FG676 - 676-pin Fine-Pitch Ball Grid Array with 1.0 mm pitch and 27×27 array |
Pinout & Package
XC6SLX100-2FG676C is housed in a 676-ball FBGA package (package code FG676) with 27×27 ball array, 1.0 mm pitch, and thermal pad exposed on underside for enhanced heat dissipation in high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GND | Ground reference | Multiple dedicated balls provide low-inductance return paths for core, I/O, and analog supplies |
| VCCO_0–VCCO_23 | I/O bank voltage | 24 independent VCCO supplies allow mixed-voltage I/O interfaces (e.g., 3.3 V, 2.5 V, 1.8 V, 1.5 V) |
| VCCAUX | Auxiliary supply | 1.8 V supply powering configuration logic, DCMs, and JTAG interface |
| VCCINT | Core supply | 1.2 V supply powering CLBs, interconnect, and block RAM |
| PROGRAM_B | Configuration reset | Active-low asynchronous input that clears configuration memory and initiates reload from external source |
| INIT_B | Configuration status | Open-drain output indicating configuration memory readiness and CRC pass/fail during startup |
| CCLK | Configuration clock | Input clock for master serial configuration mode; frequency ≤ 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, frequency multiplication/division, and duty-cycle correction without external PLL components |
| System Monitor | On-chip analog-to-digital converter measures die temperature and supply voltages (VCCINT, VCCAUX, VCCO) for real-time health monitoring |
| Internal Configuration Access Port (ICAP) | Enables runtime partial reconfiguration of logic sections without full device reset or external programming interface |
| SelectIO Technology | Supports 19 I/O standards with programmable drive strength, slew rate, and termination for signal integrity optimization across PCB trace lengths |
| JTAG Boundary Scan | IEEE 1149.1-compliant test access port enables board-level interconnect testing and in-system programming |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency and synchronized multi-axis position updates. IC Role / Device Role / Timing Role: FPGA fabric implements closed-loop PID controllers, encoder interface logic, and time-critical PWM generation. Use Value: 480 user I/Os enable direct connection to multiple motor drivers and feedback sensors; DCM ensures precise clock synchronization across axes. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor device validation. IC Role / Device Role / Timing Role: Configurable I/O banks interface with DUTs at multiple voltage levels while internal logic performs protocol translation and timing analysis. Use Value: Mixed-voltage I/O support (1.5 V to 3.3 V) allows compatibility with legacy and advanced DUTs; ICAP enables rapid test vector updates without hardware rework. |
| Medical Imaging Interface | Avionics Data Acquisition |
Use Scenario: Aggregation and preprocessing of parallel sensor streams from ultrasound transducer arrays. IC Role / Device Role / Timing Role: Block RAM buffers raw echo data; DSP slices perform beamforming coefficient application in real time. Use Value: 2,152 Kbits of block RAM provides sufficient depth for multi-channel line buffering; 240 DSP slices sustain >200 GOPS for real-time image reconstruction. | Use Scenario: ARINC 429 and MIL-STD-1553 bus interfacing with deterministic timestamping and error detection. IC Role / Device Role / Timing Role: Dedicated logic implements protocol state machines, Manchester decoding, and cyclic redundancy check (CRC) generation. Use Value: LVDS-capable I/O banks ensure noise-immune transmission over aircraft wiring harnesses; DCM aligns timestamps to UTC reference with <1 ns jitter. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG676C | 147,443 logic cells, 3,124 Kbits block RAM, same package and pinout | Higher gate count supports larger state machines and more complex datapaths | Select when design requires >100K logic cells or additional DSP resources without changing PCB layout |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 4.9 Mb block RAM, 225 DSP slices, different package (CSG324) | Enhanced routing, higher clock rates, and improved power efficiency but requires new PCB layout | Choose for new designs needing lower static power, better DSP throughput, or PCIe Gen2 endpoint integration |
Compared with XC6SLX100-2FG676C, the XC6SLX150-2FG676C offers scalable capacity within identical mechanical and thermal constraints, while the XC7A100T-2CSG324C delivers architectural improvements at the cost of layout redesign and toolchain migration.
Availability
XC6SLX100-2FG676C is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and avionics data acquisition requiring stable component supply and long-term lifecycle assurance.
Supply support for XC6SLX100-2FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI accelerators for data center, embedded, and edge applications.
The Spartan-6 family, including XC6SLX100-2FG676C, was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and flexible I/O in industrial and automotive environments.
FAQ
What is the maximum operating frequency supported by XC6SLX100-2FG676C?
The XC6SLX100-2FG676C is rated at speed grade -2, guaranteeing timing closure for system clocks up to 500 MHz under typical voltage and temperature conditions. Actual achievable frequency depends on design complexity, routing congestion, and I/O standard selection. The DCM supports output frequencies up to 500 MHz with jitter specifications defined in the Spartan-6 DC and switching characteristics datasheet.
Does XC6SLX100-2FG676C support partial reconfiguration?
Yes, XC6SLX100-2FG676C supports partial reconfiguration via its Internal Configuration Access Port (ICAP). This allows dynamic modification of specific logic regions while the rest of the design remains operational. Implementation requires use of Xilinx ISE Design Suite 14.7 or later with appropriate floorplanning and bitstream generation settings.
What I/O standards are supported by XC6SLX100-2FG676C?
XC6SLX100-2FG676C supports 19 SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential standards such as LVDS, RSDS, and TMDS. Each of the 24 I/O banks can be independently configured for different VCCO voltages ranging from 1.2 V to 3.3 V, enabling mixed-signaling interfaces on a single device.
Is XC6SLX100-2FG676C RoHS compliant and lead-free?
Yes, XC6SLX100-2FG676C is RoHS compliant and manufactured with lead-free packaging. The FG676 package uses matte tin finish on solder balls and meets JEDEC J-STD-020 moisture sensitivity level 3 requirements. Full compliance documentation is available through AMD's product change notifications and material declarations.
What configuration modes does XC6SLX100-2FG676C support?
XC6SLX100-2FG676C supports Master Serial, Slave Serial, Master SelectMAP, Slave SelectMAP, and JTAG configuration modes. External configuration sources include SPI flash, PROM, or processor-controlled parallel interfaces. Configuration bitstream size is approximately 9.2 Mbits for full device programming in compressed bitstream format.
XC6SLX100-2FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-2FG676C FAQ
1.How can I place an order for XC6SLX100-2FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2FG676C reliable?
The price and inventory of XC6SLX100-2FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2FG676C?
XC6SLX100-2FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2FG676C?
For technical support, including XC6SLX100-2FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2FG676C requirements.
6.How does Aetrix verify that XC6SLX100-2FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2FG676C?
All XC6SLX100-2FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2FG676C part is unused and in its original packaging.
Return procedure for XC6SLX100-2FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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