My Inquiry
My Account
AMD XC6SLX100-2FG676I
- Part No.:
- XC6SLX100-2FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-2FG676I.pdf
- Description:
- IC FPGA 480 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,519
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 480 DSP48A1 slices, and 4,729 Kbits of block RAM. It operates at -2 speed grade with I-grade temperature range (-40°C to +100°C) and is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA). It is used in industrial motor control systems requiring deterministic timing and real-time I/O processing.
For engineers reviewing the XC6SLX100-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), embedded memory capacity, DSP resource availability, and industrial-grade thermal performance.
Technical Context
The XC6SLX100-2FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, supporting synchronous design with global clock networks and regional clock buffers. It integrates SelectIO™ technology supporting LVCMOS, LVTTL, SSTL, HSTL, and differential standards including LVDS and TMDS up to 1.25 Gbps.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. The device supports partial reconfiguration and includes internal configuration monitoring with CRC error detection for bitstream integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 – determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 – supports high-channel-count interface bridging, sensor aggregation, or multi-protocol connectivity |
| Block RAM | 4,729 Kbits – enables local data buffering, FIFO implementation, or small-frame video line storage |
| DSP Slices | 480 – provides dedicated 18×18 multiplier-accumulator units for filtering, FFT, or motor control algorithms |
| Speed Grade | -2 – guarantees timing closure at 595 MHz for internal logic and 1.25 Gbps for differential I/O |
| Operating Temp | -40°C to +100°C (I-grade) – qualified for extended-temperature industrial environments without derating |
| Package | 676-pin FBGA (FG676) – 27×27 mm body, 1.0 mm ball pitch, compatible with standard SMT reflow profiles |
Pinout & Package
XC6SLX100-2FG676I is housed in a 676-ball fine-pitch BGA (FG676) package with 27×27 array, 1.0 mm ball pitch, and standard 0.75 mm ball diameter. Thermal pad is exposed on underside for enhanced heat dissipation in industrial enclosures.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply – must be decoupled locally for signal integrity in LVDS or SSTL interfaces |
| T1 | GCLK1 | Global clock input – low-skew routing to all clock regions; supports single-ended or differential (GCLK1/GCLK1B) |
| A1 | M0 | Configuration mode select – sets boot source (SPI, BPI, or JTAG) during power-up initialization |
| P2 | INIT_B | Open-drain status output – indicates configuration status and asserts low during CRC error or sync word mismatch |
| R1 | CCLK | Configuration clock – externally driven during slave serial mode; internally generated in master SPI mode |
| Y1 | PROGRAM_B | Active-low reset – forces reconfiguration and clears internal state; asynchronous to all clocks |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Memory Controller | Supports DDR2/DDR3 SDRAM up to 800 Mbps with built-in calibration and timing closure assistance |
| SelectIO Technology | Per-bank voltage support (1.2–3.3 V) enables mixed-voltage I/O interfacing without level shifters |
| Partial Reconfiguration | Allows dynamic logic module swapping during operation-critical for adaptive industrial controllers |
| Embedded Security | Bitstream encryption via AES-256 and HMAC authentication prevent unauthorized configuration and cloning |
| Power-Optimized Architecture | Multiple power domains and shutdown controls reduce active power by up to 40% vs. Virtex-5 equivalents |
Applications
| Industrial PLC I/O Expansion | Medical Imaging Data Acquisition |
|---|---|
Use Scenario: Modular PLC backplane adding analog/digital I/O, motion control, and fieldbus gateways. IC Role / Device Role / Timing Role: FPGA acts as real-time protocol bridge and deterministic I/O scheduler with sub-microsecond jitter. Use Value: 480 user I/Os and 480 DSP slices enable simultaneous EtherCAT, CANopen, and PWM generation without external co-processors. | Use Scenario: CT/MRI scanner front-end capturing multi-channel ADC data at 100+ MSPS with real-time preprocessing. IC Role / Device Role / Timing Role: FPGA performs channel synchronization, offset correction, and FIR filtering before transferring to host CPU. Use Value: 4,729 Kbits of block RAM buffers full-scan line data; DSP slices execute 128-tap filters at 200 MHz. |
| Avionics Display Interface | Test & Measurement Signal Generator |
Use Scenario: ARINC 429/664 and LVDS display controller in ruggedized cockpit displays. IC Role / Device Role / Timing Role: FPGA handles protocol translation, frame buffering, and pixel clock generation with deterministic latency. Use Value: SelectIO supports 1.8 V LVDS and 2.5 V ARINC drivers natively; -2 speed grade ensures <5 ns setup/hold margins. | Use Scenario: High-resolution arbitrary waveform generator producing multi-tone RF stimuli up to 200 MHz. IC Role / Device Role / Timing Role: FPGA implements DDS cores, interpolation filters, and digital upconverters synchronized to ultra-stable reference clocks. Use Value: 101,261 logic cells accommodate dual-channel 16-bit DAC controllers with real-time amplitude modulation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FG676I | 147,443 logic cells, 560 DSP slices, same package and speed grade | Higher gate count supports larger protocol stacks (e.g., PROFINET + TSN) or dual-core soft processors | Choose when additional logic resources are required without changing PCB layout or thermal design |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 240 DSP slices, smaller 324-pin CSP package | Lacks native DDR3 controller but adds PCIe Gen2 endpoint and improved power efficiency | Prefer for new designs needing PCIe connectivity or lower static power; requires board redesign due to package change |
Compared with XC6SLX100-2FG676I, XC6SLX150-2FG676I offers headroom for future firmware expansion within identical mechanical and thermal constraints, while XC7A100T-2CSG324I trades I/O count and memory bandwidth for serial interconnect capability and 35% lower static power-making it suitable for space-constrained, power-sensitive upgrades.
Availability
XC6SLX100-2FG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging equipment, and avionics display systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family-including XC6SLX100-2FG676I-was designed for cost-sensitive, power-efficient, high-volume industrial and automotive applications requiring reliable I/O interfacing and real-time logic execution.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100-2FG676I?
XC6SLX100-2FG676I supports I/O voltages from 1.2 V to 3.3 V per bank, with SelectIO technology enabling mixed-voltage operation. Each I/O bank has independent VCCO, allowing concurrent use of LVDS (2.5 V), SSTL18 (1.8 V), and LVCMOS33 (3.3 V) signals on the same device without external level shifters. This flexibility simplifies interface consolidation in multi-protocol industrial controllers.
Does XC6SLX100-2FG676I support JTAG boundary-scan testing?
Yes, XC6SLX100-2FG676I fully supports IEEE 1149.1 JTAG boundary-scan for PCB-level test and debug. The TAP controller enables instruction register access, device ID readback, and boundary-scan chain configuration. JTAG is used for both initial programming and in-system verification of I/O pin functionality during manufacturing test sequences.
Can XC6SLX100-2FG676I configure from a serial NOR flash device?
Yes, XC6SLX100-2FG676I supports Master SPI configuration mode and is compatible with standard 4-wire SPI NOR flash devices such as Spansion S25FL series. Configuration occurs automatically on power-up when M[2:0] pins are set to 001, loading the bitstream into internal SRAM. Boot time is typically under 100 ms for 256-Mbit flash devices.
What thermal management guidance applies to XC6SLX100-2FG676I in sealed industrial enclosures?
XC6SLX100-2FG676I specifies a maximum junction temperature of +125°C and is rated for I-grade operation (-40°C to +100°C ambient). In sealed enclosures, thermal vias under the exposed thermal pad and 2–4 oz copper planes on inner layers reduce θJA to ≤22°C/W. Forced airflow >1 m/s further extends safe operating margin for sustained 85°C ambient conditions.
Is partial reconfiguration supported on XC6SLX100-2FG676I, and what tools enable it?
Yes, XC6SLX100-2FG676I supports dynamic partial reconfiguration using Xilinx ISE Design Suite 14.7 with PlanAhead implementation tools. Reconfigurable modules must be placed in designated "reconfigurable partitions" and validated for timing isolation. This capability enables runtime adaptation in motor drives-such as switching between PID and model-predictive control logic-without system reset.
XC6SLX100-2FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-2FG676I FAQ
1.How can I place an order for XC6SLX100-2FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2FG676I reliable?
The price and inventory of XC6SLX100-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2FG676I?
XC6SLX100-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2FG676I?
For technical support, including XC6SLX100-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2FG676I requirements.
6.How does Aetrix verify that XC6SLX100-2FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2FG676I?
All XC6SLX100-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100-2FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100-2FG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
