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AMD XC6SLX100-2FGG484I
- Part No.:
- XC6SLX100-2FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100-2FGG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,326
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Product details
Overview
XC6SLX100-2FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100-2FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS/PCIe-compatible transceivers, dual-boot configuration capability, and JTAG boundary-scan compliance for production testability.
Technical Context
The XC6SLX100-2FGG484I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry chains. It supports SelectIO™ standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS and TMDS.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using internal or external configuration memory. The device includes integrated clock management with DCMs (Digital Clock Managers) supporting frequency synthesis, phase shifting, and duty-cycle correction across six independent clock networks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total programmable fabric resources for combinatorial and sequential logic implementation |
| User I/O Pins | 348 - supports high-density interface routing with bank-wise voltage and standard assignment |
| Block RAM | 1,824 Kbits - distributed across 182 blocks of 18 Kbits each for data buffering and FIFOs |
| DSP Slices | 220 × DSP48A1 - fixed-point arithmetic units enabling multiply-accumulate operations at up to 250 MHz |
| Speed Grade | -2 - guarantees timing closure at worst-case industrial temperature and voltage conditions |
| Operating Temp | -40°C to +100°C - qualified for extended industrial environments without derating |
| Package | FGG484 - 484-pin Fine-Pitch Ball Grid Array with 1.0 mm pitch and 23×23 array |
Pinout & Package
XC6SLX100-2FGG484I is housed in a 484-pin Fine-Pitch BGA (FGG484) package with 1.0 mm ball pitch, thermal pad, and RoHS-compliant finish. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and VREF settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output confirming successful configuration completion and releasing INIT_B |
| H2 | PROGRAM_B | Active-low input initiating full reconfiguration and clearing configuration memory |
| K1 | INIT_B | Open-drain output indicating configuration status and memory initialization state |
| M3 | TCK | JTAG test clock input synchronized to TMS/TDI for boundary-scan and debug access |
| N2 | TMS | JTAG test mode select controlling state machine transitions during programming and verification |
| P1 | TDO | JTAG test data output carrying scan-out results from instruction/data registers |
| R1 | TDI | JTAG test data input shifting instructions and configuration data into device registers |
| U1 | CCLK | Configuration clock output driving external PROM or master SPI configuration source |
Key Features
| Feature | Design Value |
|---|---|
| Dual-Boot Configuration Support | Enables field-upgradable firmware with fallback to known-good bitstream stored in external SPI flash |
| SelectIO™ Technology | Per-bank I/O voltage flexibility (1.2V–3.3V) and signal standard compatibility including LVDS and SSTL-18 |
| Digital Clock Manager (DCM) | Provides jitter reduction, frequency synthesis, and phase alignment across six independent clock domains |
| Partial Reconfiguration | Allows dynamic module swapping without interrupting active logic operation in real-time control applications |
| ISE Design Suite Compatibility | Full toolchain support through Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation |
Applications
| Industrial Motion Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond latency requirements in CNC and robotics drives. IC Role / Device Role / Timing Role: FPGA fabric executes position/velocity PID loops while DCMs synchronize encoder capture and PWM update clocks. Use Value: Deterministic timing from -2 speed grade and 348 I/Os enables direct connection to multi-axis encoder interfaces and isolated gate drivers. | Use Scenario: High-speed digital pattern generation and response analysis in semiconductor wafer testing platforms. IC Role / Device Role / Timing Role: Configurable I/O banks drive DUT signals at 200+ Mbps with precise setup/hold margins enforced by I/O delay calibration. Use Value: LVDS-capable I/Os and 220 DSP48A1 slices allow parallel signature analysis and real-time pass/fail decision logic. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: Block RAM buffers raw ADC streams while DSP slices perform beamforming coefficient multiplication. Use Value: 1,824 Kbits of on-chip RAM eliminates external memory bottlenecks and reduces EMI-sensitive interconnects. | Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems with dual-redundant paths. IC Role / Device Role / Timing Role: Dedicated I/O banks isolate and translate between different bus voltage levels and timing protocols. Use Value: Industrial temperature rating and configuration security features meet DO-254 design assurance level A requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-2FGG484I | 147,443 logic cells, 2,184 Kbits BRAM, same package and speed grade | Higher resource count supports larger state machines and more concurrent protocol stacks | Choose when additional logic density or BRAM is required without changing PCB layout |
| XC7S100-2FTG256I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, smaller 256-pin FTBGA package | Larger BRAM and improved DSP efficiency but incompatible pinout and configuration interface | Consider for new designs prioritizing power efficiency and higher memory bandwidth over legacy toolchain compatibility |
Compared with XC6SLX100-2FGG484I, the XC6SLX150-2FGG484I offers scalable logic headroom within identical mechanical and thermal constraints, while the XC7S100-2FTG256I delivers architectural improvements at the cost of redesign effort and ISE-to-Vivado migration.
Availability
XC6SLX100-2FGG484I is available at Aetrix Electronics and suitable for industrial motion control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply across long product lifecycles.
Supply support for XC6SLX100-2FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered programmable logic solutions for high-reliability embedded systems.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power operation, flexible I/O, and proven reliability in industrial and automotive environments.
FAQ
What is the maximum supported I/O standard for XC6SLX100-2FGG484I?
The XC6SLX100-2FGG484I supports LVDS, LVPECL, SSTL-18, SSTL-2, HSTL-I, and LVCMOS up to 3.3V across its 12 I/O banks. Each bank operates independently with configurable VCCO and optional VREF, enabling mixed-voltage interface designs without level shifters.
Does XC6SLX100-2FGG484I support JTAG boundary-scan for production testing?
Yes, XC6SLX100-2FGG484I fully complies with IEEE 1149.1 and includes dedicated TCK, TMS, TDI, TDO, and TRST pins. Boundary-scan testing is enabled by default after configuration and supports full device interconnect verification in-system.
Can XC6SLX100-2FGG484I be configured via SPI flash memory?
Yes, XC6SLX100-2FGG484I supports Master SPI configuration mode using external serial flash. The CCLK pin outputs a free-running clock to drive the flash, and up to 32 MB of configuration data can be loaded automatically on power-up.
What clock management resources are available in XC6SLX100-2FGG484I?
XC6SLX100-2FGG484I integrates six Digital Clock Managers (DCMs), each providing frequency synthesis, phase shifting, duty-cycle correction, and clock doubling. These support up to six independent clock domains with jitter below 100 ps RMS.
Is partial reconfiguration supported on XC6SLX100-2FGG484I?
Yes, XC6SLX100-2FGG484I supports partial reconfiguration through the ISE Design Suite. This allows dynamic replacement of logic modules while maintaining operation of the rest of the design, critical for real-time industrial control and adaptive signal processing.
XC6SLX100-2FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100-2FGG484I FAQ
1.How can I place an order for XC6SLX100-2FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2FGG484I reliable?
The price and inventory of XC6SLX100-2FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2FGG484I?
XC6SLX100-2FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2FGG484I?
For technical support, including XC6SLX100-2FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2FGG484I requirements.
6.How does Aetrix verify that XC6SLX100-2FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2FGG484I?
All XC6SLX100-2FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-2FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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