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AMD XC6SLX100-2FGG676C
- Part No.:
- XC6SLX100-2FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-2FGG676C.pdf
- Description:
- IC FPGA 480 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,889
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Product details
Overview
XC6SLX100-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 480 I/O pins, and a -2 speed grade with 1.2 V core voltage. It integrates 4,720 Kbits of block RAM, 220 DSP48A1 slices, and supports LVDS, SSTL, and HSTL I/O standards. It is used in industrial vision systems requiring real-time image preprocessing and deterministic latency.
For engineers reviewing the XC6SLX100-2FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade timing closure, embedded memory capacity, and supported I/O standards for interface compatibility with image sensors and FPGAs in edge-accelerated vision pipelines.
Technical Context
The XC6SLX100-2FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It includes dual-port block RAM blocks up to 18 Kbits each and hard-wired DSP48A1 slices supporting 18×18-bit signed multiplication with 48-bit accumulation.
Configuration is performed via Master SelectMAP or JTAG, with support for bitstream encryption using AES-256. The device uses MultiBoot with fallback capability and supports system-level integration through PCI Express® Gen1 x1 endpoint configuration with integrated endpoints.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom IP implementation |
| I/O Pins | 480 - supports high-pin-count parallel interfaces such as CMOS image sensor buses or multi-lane ADC links |
| Block RAM | 4,720 Kbits - enables on-chip frame buffering and line buffers for real-time video processing |
| DSP Slices | 220 × DSP48A1 - delivers fixed-point math throughput for convolution, filtering, and feature extraction |
| Speed Grade | -2 - guarantees timing closure at 500 MHz I/O toggle rate and 333 MHz system clock in worst-case industrial conditions |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with ≤±15 mV ripple for stable operation |
Pinout & Package
XC6SLX100-2FGG676C is housed in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm pitch, 27×27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.55 mm (height), RoHS-compliant and Pb-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF capacitors near ball |
| M20 | VCCAUX | 1.2 V auxiliary supply for configuration logic and transceivers - low-noise regulation required |
| T19 | VCCINT | 1.2 V core supply - feeds CLBs, RAM, and DSP slices; sensitive to PSRR and transient load response |
| R15 | PROGRAM_B | Active-Low asynchronous reset - pulls low to reinitialize configuration logic and clear SRAM contents |
| P16 | CCLK | Configuration clock input - drives internal shift register during SelectMAP or slave serial mode |
| Y17 | INIT_B | Open-drain status output - goes high-Z after successful configuration, low during error or reconfiguration |
Key Features
| Feature | Design Value |
|---|---|
| MultiBoot with fallback | Enables field-upgradable bitstreams and safe recovery from corrupted configuration images |
| AES-256 bitstream encryption | Protects proprietary IP against reverse engineering and unauthorized cloning of design assets |
| PCIe Gen1 x1 endpoint | Provides direct host CPU connectivity without external bridge IC, reducing BOM and latency |
| Dual-ported block RAM | Allows concurrent read/write access for pipelined video frame buffering and pixel stream alignment |
| LVDS I/O support (up to 1050 Mbps) | Enables high-speed serialized sensor interfaces such as Camera Link or custom differential camera buses |
Applications
| Industrial Machine Vision | Medical Imaging Front-End |
|---|---|
Use Scenario: Real-time defect detection on high-speed production lines using area-scan CMOS sensors. IC Role / Device Role / Timing Role: FPGA acts as pixel preprocessor, performing Bayer demosaicing, histogram equalization, and ROI extraction before sending compressed metadata to host. Use Value: 480 I/O pins enable parallel 24-bit sensor bus capture; 220 DSP slices accelerate real-time filtering without external co-processor. | Use Scenario: Ultrasound beamforming control and echo digitization in portable diagnostic devices. IC Role / Device Role / Timing Role: Synchronizes multi-channel ADC sampling, applies time-gain compensation, and formats data for USB 2.0 transmission. Use Value: Block RAM provides on-chip delay-line storage for beam steering; LVDS I/O supports 1050 Mbps ADC serialization links. |
| Avionics Data Acquisition | Programmable Logic Controller (PLC) |
Use Scenario: Sensor fusion hub collecting ARINC 429, discrete I/O, and analog inputs in UAV flight control units. IC Role / Device Role / Timing Role: Configurable I/O banks interface heterogeneous protocols; PCIe endpoint routes consolidated telemetry to host processor. Use Value: -2 speed grade ensures deterministic timing for ARINC 429 decoding at 100 kbps; AES encryption secures firmware updates over air. | Use Scenario: Modular I/O expansion module handling 64-channel digital input with debounce and pulse-width measurement. IC Role / Device Role / Timing Role: Implements state machines for input conditioning, timestamping, and EtherCAT slave communication stack. Use Value: 101,280 logic cells accommodate full EtherCAT ASIC-equivalent functionality plus custom diagnostics logic. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and preprocessing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGA2104I | UltraScale architecture, 2,586K logic cells, 580 I/O, 0.85 V core, no native PCIe Gen1 endpoint | Targets higher-throughput radar signal processing; requires PCIe soft IP or external controller | Choose when >2× logic density and DDR4 memory interface are required; not drop-in compatible |
| XC7K160T-2FFG676I | Kintex-7 architecture, 162,240 logic cells, 300 I/O, 1.0 V core, PCIe Gen2 x4 endpoint | Suitable for PCIe-heavy designs like NVMe offload; lower I/O count limits parallel sensor interfacing | Prefer for designs needing Gen2 x4 bandwidth and higher DSP count; incompatible pinout and voltage rails |
Compared with XC6SLX100-2FGG676C, the XCVU9P offers vastly greater logic but lacks native PCIe Gen1 support and increases power/complexity, while XC7K160T provides faster PCIe and more DSP, yet sacrifices 180 I/O pins critical for parallel imaging interfaces.
Availability
XC6SLX100-2FGG676C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging front-end, and avionics data acquisition requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation and embedded vision.
FAQ
What is the maximum operating junction temperature for XC6SLX100-2FGG676C?
The XC6SLX100-2FGG676C has a maximum operating junction temperature of 100°C, validated under industrial temperature grade (-40°C to +100°C ambient). Thermal design must ensure θJA ≤ 12.5°C/W with 4-layer PCB, 2 oz copper, and ≥4 thermal vias under the thermal pad to maintain reliability. The XC6SLX100-2FGG676C datasheet specifies derating above 85°C ambient.
Does XC6SLX100-2FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX100-2FGG676C fully supports IEEE 1149.1 (JTAG) boundary-scan testing via TCK, TMS, TDI, TDO, and TCK pins. It implements mandatory instructions (SAMPLE/PRELOAD, EXTEST, BYPASS) and optional IDCODE, and supports programmable pull-ups on TMS and TDI. This capability is documented in the XC6SLX100-2FGG676C Configuration User Guide UG380.
Can XC6SLX100-2FGG676C configure from SPI flash without external microcontroller?
Yes, XC6SLX100-2FGG676C supports master SPI configuration mode, allowing autonomous boot from standard quad-SPI flash (e.g., Micron MT25QL) without host intervention. The XC6SLX100-2FGG676C initiates read cycles on power-up using internal oscillator, and supports dual/quad I/O modes for faster bitstream loading.
What I/O standards are supported on Bank 14 of XC6SLX100-2FGG676C?
Bank 14 of XC6SLX100-2FGG676C supports LVCMOS, LVTTL, PCI, HSTL_I, HSTL_II, SSTL18_I, SSTL18_II, and differential standards including LVDS_25, BLVDS_25, and RSDS. VCCO for Bank 14 must be set to 1.8 V for SSTL18 and 2.5 V for HSTL, per the XC6SLX100-2FGG676C Pin Planning Guide UG381.
Is XC6SLX100-2FGG676C qualified for automotive applications?
No, XC6SLX100-2FGG676C is rated for industrial temperature range (-40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure-in-time (FIT) reporting, and enhanced ESD protection required for automotive ECUs. For automotive use, AMD recommends the XA Spartan-6 family variants, which are explicitly qualified and labeled with XA prefix.
XC6SLX100-2FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-2FGG676C FAQ
1.How can I place an order for XC6SLX100-2FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2FGG676C reliable?
The price and inventory of XC6SLX100-2FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2FGG676C?
XC6SLX100-2FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2FGG676C?
For technical support, including XC6SLX100-2FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2FGG676C requirements.
6.How does Aetrix verify that XC6SLX100-2FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2FGG676C?
All XC6SLX100-2FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100-2FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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