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AMD XC6SLX100-2FGG676I
- Part No.:
- XC6SLX100-2FGG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-2FGG676I.pdf
- Description:
- IC FPGA 480 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,676
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Product details
Overview
XC6SLX100-2FGG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control systems requiring deterministic timing and I/O flexibility.
For engineers reviewing the XC6SLX100-2FGG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), LVDS support, embedded memory depth, and industrial-grade thermal performance.
Technical Context
The XC6SLX100-2FGG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates SelectIO™ technology supporting single-ended (LVTTL, LVCMOS) and differential (LVDS, RSDS, BLVDS) standards up to 1,080 Mbps per I/O pair.
Its clocking architecture includes four DCMs (Digital Clock Managers) and two PLLs for jitter reduction, phase shifting, frequency synthesis, and duty-cycle correction-enabling precise timing control across multiple synchronous domains in real-time industrial interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom IP integration |
| Block RAM | 4,729 Kbits - supports dual-port FIFOs, data buffering, or small on-chip memory tables |
| DSP Slices | 220 × DSP48A1 - enables fixed-point filtering, FFT, and motor control algorithms without external processors |
| User I/O Pins | 480 - provides high-density interface routing for multi-protocol industrial backplanes |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature derating |
| Operating Temp | -40°C to +100°C - qualified for sealed enclosures in factory automation and outdoor power electronics |
| Package | 676-pin FGG (Fine-Pitch BGA, 27×27 mm, 1.0 mm pitch) - enables high I/O count with controlled impedance routing |
Pinout & Package
XC6SLX100-2FGG676I is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG) package with 27×27 array, 1.0 mm ball pitch, and standard 0.75 mm ball diameter. The package supports thermal dissipation up to 5.2 W under industrial airflow conditions.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCINT | Core supply | 1.2 V ±3% - powers internal logic and CLB fabric; requires low-noise regulation |
| VCCAUX | Auxiliary supply | 2.5 V ±5% - powers configuration logic, JTAG, and select I/O banks |
| VCCO | I/O bank supply | 1.2–3.3 V selectable per bank - enables mixed-voltage interface coexistence |
| CONFIG_IO | Configuration I/O | Dedicated pins for master SPI, JTAG, or boundary-scan initialization |
| CLKIN | Primary clock input | Differential-capable input for feeding DCM/PLL with sub-100 ps jitter tolerance |
| INIT_B | Configuration status | Open-drain active-low signal indicating successful bitstream loading or error condition |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe® Endpoint Block | Gen1 x1 hard IP - eliminates soft-core overhead and reduces latency for host communication in embedded vision systems |
| SelectIO™ Technology | Supports 18 I/O standards including LVDS, SSTL, HSTL - enables direct interfacing with ADCs, SERDES, and legacy industrial buses |
| Multi-Boot Capability | Two independent bitstreams stored in external SPI flash - allows field-upgradable firmware and fail-safe fallback operation |
| Power-Down Mode | Reduces static current to <50 µA - extends uptime in battery-backed monitoring nodes during idle cycles |
| ISE Design Suite Support | Fully compatible with Xilinx ISE 14.7 - ensures long-term toolchain stability for maintenance-critical industrial deployments |
Applications
| Industrial Motor Drive Controller | Programmable Logic Relay (PLR) |
|---|---|
Use Scenario: Closed-loop vector control of 3-phase AC induction motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: Real-time hardware accelerator for space-vector modulation, current loop computation, and safety interlock logic. Use Value: Achieves 250 ns interrupt response and deterministic 10 kHz PWM update rate using on-chip DSP slices and fast carry chains. | Use Scenario: Replacement for electromechanical relays in distributed I/O cabinets with configurable logic and diagnostics. IC Role / Device Role / Timing Role: Configurable state machine implementing ladder logic, watchdog timers, and digital input debouncing. Use Value: Supports 64 discrete inputs/outputs with cycle times under 1 ms and SIL2-compliant fault detection via dual-lockstep monitoring. |
| High-Speed Data Acquisition Node | Railway Signaling Interface Unit |
Use Scenario: Simultaneous sampling of 16-channel 14-bit ADCs at 1 MSPS with timestamping and packetization. IC Role / Device Role / Timing Role: Synchronization hub coordinating ADC parallel outputs, DDR2 memory write bursts, and Gigabit Ethernet framing. Use Value: Uses 480 user I/Os to route parallel ADC bus and LVDS clock/data pairs while maintaining <2 ns skew across all channels. | Use Scenario: Interfacing between ERTMS/ETCS Level 1 balises and onboard train control units with fail-safe protocol handling. IC Role / Device Role / Timing Role: Protocol translator and safety monitor enforcing CRC-16 validation, timeout supervision, and dual-channel redundancy checking. Use Value: Implements CENELEC SIL4-compliant logic using triple-modular redundancy (TMR) voting and lockstep comparison of dual bitstreams. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based industrial control applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FFVB2104I | UltraScale+ architecture, 2,586K logic cells, 48.8 GB/s transceiver bandwidth, 0.85 V core | Targeted at high-throughput video processing and 10G Ethernet; overqualified for deterministic motor control | Higher cost and power; justified only when migrating to PCIe Gen3 or 100G MAC offload |
| XC7A100T-2FGG484I | Artix-7 family, 101,440 logic cells, no hard PCIe block, lower I/O count (285), same -2 speed grade | Lacks integrated PCIe endpoint but offers improved DSP efficiency and lower static power | Better fit for cost-sensitive, non-PCIe industrial gateways where board space and thermal budget are constrained |
Compared with XC6SLX100-2FGG676I, the XC7A100T-2FGG484I reduces static power by 35% and simplifies PCB layout with smaller 484-pin package, while the XCVU9P-2FFVB2104I adds transceiver bandwidth and hardened IP at significantly higher cost and thermal complexity.
Availability
XC6SLX100-2FGG676I is available at Aetrix Electronics and suitable for industrial motor drives, railway signaling interfaces, and high-speed data acquisition systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-2FGG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains full support for the Spartan-6 product family. Xilinx pioneered programmable logic architecture and system-on-chip integration for embedded applications.
The Spartan-6 family was designed specifically for cost-sensitive, high-volume industrial and automotive applications requiring predictable timing, long-term availability, and industrial temperature qualification - not general-purpose computing.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100-2FGG676I?
The XC6SLX100-2FGG676I supports I/O voltages from 1.2 V to 3.3 V per bank, with individual bank configuration. Each I/O bank can be independently set to LVTTL, LVCMOS, SSTL, HSTL, or LVDS levels. This allows mixed-voltage operation across different peripheral interfaces without level-shifting components, provided VCCO matches the selected standard's requirement.
Does XC6SLX100-2FGG676I include built-in configuration memory?
No, XC6SLX100-2FGG676I does not include on-chip nonvolatile configuration memory. It relies on external serial PROM or flash memory (e.g., Micron MT25QL series) for bitstream storage. Configuration occurs via Master SPI, Slave SelectMAP, or JTAG modes at power-up, with INIT_B and DONE signals confirming successful load sequence.
Can XC6SLX100-2FGG676I operate in a -40°C to +100°C ambient environment without derating?
Yes, XC6SLX100-2FGG676I is fully specified and tested for industrial temperature operation from -40°C to +100°C. Its -2 speed grade includes timing margins validated across this full range, and thermal design guidelines specify maximum junction temperature of 125°C with appropriate PCB copper area and airflow. No voltage or frequency derating is required within this envelope.
How many clock management resources does XC6SLX100-2FGG676I provide?
XC6SLX100-2FGG676I integrates four Digital Clock Managers (DCMs) and two Phase-Locked Loops (PLLs). Each DCM supports frequency synthesis, phase shifting, and duty-cycle correction; each PLL provides wider multiplication/division ranges and lower jitter. These resources enable independent clock domains for peripherals, memory interfaces, and real-time control loops without external clock generators.
Is XC6SLX100-2FGG676I compatible with Vivado Design Suite?
No, XC6SLX100-2FGG676I is not supported in Vivado Design Suite. It requires Xilinx ISE Design Suite 14.7 - the final and only officially supported toolchain. While partial synthesis may occur in newer tools via third-party plugins, timing closure, bitstream generation, and JTAG programming are guaranteed only in ISE 14.7 with the Spartan-6 device libraries.
XC6SLX100-2FGG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-2FGG676I FAQ
1.How can I place an order for XC6SLX100-2FGG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-2FGG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-2FGG676I reliable?
The price and inventory of XC6SLX100-2FGG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-2FGG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-2FGG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-2FGG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-2FGG676I?
XC6SLX100-2FGG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-2FGG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-2FGG676I?
For technical support, including XC6SLX100-2FGG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-2FGG676I requirements.
6.How does Aetrix verify that XC6SLX100-2FGG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-2FGG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-2FGG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-2FGG676I?
All XC6SLX100-2FGG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-2FGG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-2FGG676I part is unused and in its original packaging.
Return procedure for XC6SLX100-2FGG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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