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AMD XC6SLX100-3FG484I
- Part No.:
- XC6SLX100-3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100-3FG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,065
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Product details
Overview
XC6SLX100-3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 18 Kbit block RAM, 216 DSP48A1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control, embedded vision preprocessing, and protocol bridging applications.
For engineers reviewing the XC6SLX100-3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, multi-voltage bank operation (1.2V/1.8V/2.5V/3.3V), and JTAG boundary-scan compliance for system-level testability.
Technical Context
The XC6SLX100-3FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic functions. It integrates SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and SSTL.
Configuration is performed via Master Serial mode using external SPI flash or JTAG interface. The device includes internal oscillator, startup clock divider, and configuration watchdog timer to ensure reliable power-up sequencing and bitstream integrity verification.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 348 - supports high-pin-count interfaces such as parallel camera sensors or multi-lane memory buses |
| Block RAM | 1,824 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 216 - provides fixed-point multiply-accumulate capability for filtering and control algorithms |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz for critical paths under industrial temperature conditions |
| Operating Temp | -40°C to +100°C - qualified for use in uncooled industrial enclosures and outdoor equipment |
Pinout & Package
XC6SLX100-3FG484I is housed in a 484-pin Fine-Pitch Ball Grid Array (FBGA) package with 27 × 27 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Pin assignments follow Xilinx UG382 v1.11 and are organized into 12 I/O banks with independent VCCO and VREF supply domains.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_DONE | Open-drain output signaling successful configuration completion; pulled high externally to enable downstream logic |
| H2 | INIT_B | Active-low open-drain status signal indicating configuration memory readiness or error condition |
| J1 | PROGRAM_B | Active-low input initiating master serial or JTAG reconfiguration; requires external pull-up |
| K2 | TCK | JTAG test clock input synchronized to TMS/TDI for boundary-scan and debug access |
| L1 | TMS | JTAG test mode select controlling state machine transitions during programming and testing |
| M2 | TDO | JTAG test data output carrying scan-out results from boundary-scan register or device ID |
Key Features
| Feature | Design Value |
|---|---|
| Multi-Voltage I/O Banks | Supports concurrent 1.2V, 1.8V, 2.5V, and 3.3V interfaces - eliminates level-shifter ICs in mixed-voltage systems |
| Embedded Block RAM | 1,824 Kbits distributed across 192 blocks - enables dual-port RAM, shift registers, and true dual-port FIFO implementation |
| DSP48A1 Slices | 216 dedicated arithmetic units with 25×18-bit multipliers - delivers 108 GMAC/s peak throughput for real-time control loops |
| SelectIO Technology | LVDS, SSTL, HSTL, and differential signaling support - ensures signal integrity for high-speed parallel interfaces up to 1 Gbps |
| Configuration Security | Bitstream encryption via AES-256 and HMAC authentication - prevents unauthorized cloning and IP theft in deployed systems |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric executes PWM generation, current sampling synchronization, and PI loop computation with sub-microsecond latency. Use Value: XC6SLX100-3FG484I's 216 DSP48A1 slices enable simultaneous execution of multiple FOC loops while maintaining deterministic timing. | Use Scenario: Pixel-level filtering, Bayer demosaicing, and histogram equalization for HD CMOS image sensors in smart cameras. IC Role / Device Role / Timing Role: Configurable logic processes raw sensor streams in-line before compression or transmission over GigE Vision. Use Value: XC6SLX100-3FG484I's 348 user I/Os support parallel 12-bit sensor interfaces at 72 MHz, avoiding bottlenecks from serialized links. |
| Protocol Bridging | Test & Measurement Equipment |
Use Scenario: Translating between legacy RS-422/485 fieldbus and modern Ethernet/IP or PROFINET endpoints in factory automation gateways. IC Role / Device Role / Timing Role: Implements dual-port FIFOs and state machines to buffer and reformat packets across asynchronous clock domains. Use Value: XC6SLX100-3FG484I's multi-voltage I/O banks allow direct connection to both 5V RS-485 transceivers and 3.3V Ethernet PHYs without level shifters. | Use Scenario: High-resolution waveform capture and trigger logic in portable oscilloscopes and signal analyzers. IC Role / Device Role / Timing Role: Manages ADC data acquisition, deep memory buffering, and real-time trigger detection using block RAM and LUT-based comparators. Use Value: XC6SLX100-3FG484I's 1,824 Kbits of embedded RAM supports 128k-sample buffers at full ADC sample rates without external memory latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based digital logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG484I | 147,443 logic cells, 2,184 Kbits BRAM, same package and pinout | Higher gate count supports larger state machines and more complex protocol stacks | Choose when design requires >100K logic cells but must retain identical PCB layout and thermal profile |
| XC7S100-2FTG256I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, smaller 256-pin FTBGA package | Lower power, higher BRAM density, and integrated PCIe Gen2 endpoint - suited for compact, high-bandwidth edge devices | Choose when migrating to 28nm process benefits is acceptable and board redesign is feasible |
Compared with XC6SLX100-3FG484I, XC6SLX150-3FG484I offers scalable logic headroom within identical mechanical and thermal constraints, while XC7S100-2FTG256I delivers architectural improvements at the cost of package change and toolchain migration.
Availability
XC6SLX100-3FG484I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and protocol bridging applications requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions for data center, AI, client, and embedded markets following its acquisition of Xilinx in 2022.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power programmable logic with robust I/O flexibility and industrial-grade reliability.
FAQ
What is the configuration method supported by XC6SLX100-3FG484I?
XC6SLX100-3FG484I supports Master Serial (via SPI flash), JTAG, and Slave SelectMAP configuration modes. The default startup sequence uses the internal oscillator and configuration watchdog timer to verify bitstream integrity before releasing INIT_B and asserting CONFIG_DONE. XC6SLX100-3FG484I does not require external clock sources for configuration.
Does XC6SLX100-3FG484I support LVDS signaling?
Yes, XC6SLX100-3FG484I supports LVDS input and output standards across I/O banks configured for 2.5V VCCO. Each differential pair can operate at up to 1.0 Gbps with proper termination and routing. XC6SLX100-3FG484I requires external 100Ω differential termination resistors placed near the receiver.
What is the maximum operating frequency of XC6SLX100-3FG484I?
The -3 speed grade of XC6SLX100-3FG484I guarantees timing closure for critical paths up to 500 MHz under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and resource utilization. XC6SLX100-3FG484I's internal clock networks support global and regional clock distribution with skew < 150 ps.
Is XC6SLX100-3FG484I qualified for industrial temperature operation?
Yes, XC6SLX100-3FG484I is rated for -40°C to +100°C ambient operating temperature and undergoes full characterization across this range. Thermal performance is validated using JEDEC JESD51-2 compliant board layouts. XC6SLX100-3FG484I meets industrial qualification requirements per Xilinx DS162 specification.
Can XC6SLX100-3FG484I be programmed in-system via JTAG?
Yes, XC6SLX100-3FG484I supports full in-system programming and debugging via IEEE 1149.1 JTAG interface. TCK, TMS, TDI, and TDO pins are dedicated and electrically compatible with standard JTAG adapters. XC6SLX100-3FG484I allows boundary-scan testing, configuration bitstream loading, and real-time debug probe insertion without requiring device power cycle.
XC6SLX100-3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100-3FG484I FAQ
1.How can I place an order for XC6SLX100-3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-3FG484I reliable?
The price and inventory of XC6SLX100-3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-3FG484I?
XC6SLX100-3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-3FG484I?
For technical support, including XC6SLX100-3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-3FG484I requirements.
6.How does Aetrix verify that XC6SLX100-3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-3FG484I?
All XC6SLX100-3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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