My Inquiry
My Account
AMD XC6SLX100-3FG676I
- Part No.:
- XC6SLX100-3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-3FG676I.pdf
- Description:
- IC FPGA 480 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,779
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 kbits of block RAM, and 220 user I/Os in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package. It operates at -3 speed grade with industrial temperature range (-40°C to +100°C) and supports SelectIO™ standards up to 1.25 Gbps.
For engineers reviewing the XC6SLX100-3FG676I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count, speed grade timing closure, industrial temperature operation, and compatibility with Xilinx ISE Design Suite v14.7.
Technical Context
The XC6SLX100-3FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated DSP48A1 slices for arithmetic-intensive tasks. It integrates six CMT clock management tiles-each containing two DCMs and one PLL-for low-jitter clock synthesis and phase alignment across multiple domains.
Configuration is supported via Master Serial, Slave Serial, or JTAG modes using external SPI flash or PROM. Configuration bitstream security includes optional AES encryption and HMAC authentication, with dual-boot capability enabled through external configuration memory addressing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for RTL implementation |
| Block RAM | 4,729 kbits - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| User I/Os | 220 - enables high-pin-count interface bridging (e.g., DDR2, PCIe Gen1, Gigabit Ethernet PHY) |
| Speed Grade | -3 - guarantees timing closure at highest operating frequency within industrial temperature range |
| Operating Temp | -40°C to +100°C - qualified for industrial and extended-temperature embedded control applications |
| Package | 676-pin FBGA (FG676) - 27×27 mm body, 1.0 mm ball pitch, RoHS-compliant lead-free finish |
Pinout & Package
XC6SLX100-3FG676I is housed in a 676-ball fine-pitch BGA (FG676) package with 220 user-configurable I/O pins, 12 dedicated configuration pins (e.g., INIT_B, PROGRAM_B, CCLK, DIN), 8 global clock inputs, and power/ground balls distributed across the array for low-noise supply integrity.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| PROGRAM_B | Active-Low Configuration Initiate | Asserting low resets configuration logic and clears internal state prior to loading new bitstream |
| INIT_B | Active-Low Configuration Status | Open-drain output indicating successful CRC check; driven low during configuration error |
| CCLK | Configuration Clock Input | Drives serial bitstream loading in Master Serial mode; max 50 MHz frequency supported |
| DIN | Serial Data Input | Receives configuration bitstream from external SPI flash or host processor |
| GCLK[0–7] | Global Clock Input | Dedicated low-skew routing to all clock-capable resources including DCMs and PLLs |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 dedicated arithmetic units supporting 25×18 signed multiplication, accumulation, and pipelined math functions |
| SelectIO™ Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) with programmable drive strength and slew rate |
| Clock Management Tiles | Six CMTs each with dual DCMs + single PLL for multi-domain clock synthesis, jitter reduction, and phase shifting |
| Configuration Security | AES-256 bitstream encryption and HMAC-SHA-256 authentication prevent unauthorized programming and cloning |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time closed-loop servo control with multi-axis position feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes PID algorithms, encoder interpolation, and synchronized PWM timing with sub-microsecond jitter. Use Value: 220 I/Os enable direct connection to encoders, analog sensors, and gate drivers; -3 speed grade ensures deterministic loop timing at 200+ kHz update rates. | Use Scenario: Converting HDMI 1.4a video streams to MIPI D-PHY for embedded display subsystems. IC Role / Device Role / Timing Role: Implements pixel clock domain crossing, color space conversion, and MIPI packetization logic with precise timing alignment. Use Value: SelectIO™ supports both 3.3 V HDMI signaling and 1.2 V MIPI D-PHY; block RAM buffers full-line video data for seamless format translation. |
| Communications Baseband Processing | Test & Measurement Instrumentation |
Use Scenario: Channel bonding, filtering, and modulation/demodulation in LTE-TDD small cell baseband units. IC Role / Device Role / Timing Role: DSP48A1 slices perform real-time FIR filtering and QAM mapping; CMTs generate synchronized sampling clocks. Use Value: 180 DSP slices deliver >1.2 GOPS at 100 MHz; industrial temp rating supports deployment in uncooled outdoor enclosures. | Use Scenario: High-precision digital oscilloscope front-end with 1 GS/s ADC interface and real-time waveform analysis. IC Role / Device Role / Timing Role: Captures parallel ADC outputs, applies decimation filters, and formats data for PCIe Gen1 host transfer. Use Value: 4,729 kbits block RAM stores 8K samples per channel; 220 I/Os support 16-bit parallel ADC bus plus trigger/control signals. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration and interface bridging applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FG676I | Higher logic density (147,443 LCs), same package and speed grade | Required when design exceeds 101K LC capacity but retains identical I/O and timing constraints | Select only if RTL utilization exceeds 90% in XC6SLX100-3FG676I implementation |
| XC7S100-2FGGA676I | Artix-7 architecture, higher performance per LC, 2.5x DSP slice count, different configuration protocol | Enables higher clock rates and advanced signal processing but requires Vivado toolchain and board-level voltage rail changes | Choose for new designs needing improved power efficiency and future-proof tool support; not drop-in compatible |
Compared with XC6SLX100-3FG676I, XC6SLX150-3FG676I offers headroom for logic growth without layout change, while XC7S100-2FGGA676I delivers architectural upgrades at the cost of toolchain migration and power delivery redesign.
Availability
XC6SLX100-3FG676I is available at Aetrix Electronics and suitable for industrial motor control, video interface bridging, communications baseband processing, and test & measurement instrumentation requiring stable component supply over extended product lifecycles.
Supply support for XC6SLX100-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and related software tools for high-performance embedded and datacenter applications.
The Spartan-6 family-including XC6SLX100-3FG676I-was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable logic density, flexible I/O, and long-term availability.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100-3FG676I?
The XC6SLX100-3FG676I supports I/O standards ranging from 1.2 V (HSTL Class I, SSTL-12) to 3.3 V (LVCMOS33, LVTTL). Each bank is independently powered, allowing mixed-voltage operation across I/O banks. The device does not support 1.0 V or 0.9 V I/O standards. All voltage settings must comply with DC and switching specifications defined in DS162 v1.12.
Does XC6SLX100-3FG676I support partial reconfiguration?
No, XC6SLX100-3FG676I does not support partial reconfiguration. The Spartan-6 architecture only permits full configuration reload via JTAG, Master Serial, or Slave Serial modes. Partial reconfiguration requires 7-series or newer FPGA families and Vivado tool support, which are not applicable to XC6SLX100-3FG676I or the ISE Design Suite.
What configuration memory size is required for XC6SLX100-3FG676I?
XC6SLX100-3FG676I requires a minimum 16 MB (128 Mbit) SPI flash for uncompressed bitstream storage. Compressed bitstreams reduce this to ~8 MB, but decompression occurs in-system and adds startup latency. Configuration time is typically 85 ms at 50 MHz CCLK with uncompressed image stored in Micron N25Q128A or equivalent.
Is XC6SLX100-3FG676I qualified for automotive applications?
XC6SLX100-3FG676I is rated for industrial temperature (-40°C to +100°C) and meets JESD22-A108 reliability testing, but it is not AEC-Q100 qualified. For automotive use, AMD recommends the Spartan-6Q family (e.g., XQ6SLX100) with extended qualification, enhanced screening, and automotive-grade documentation packages.
Can XC6SLX100-3FG676I interface directly with DDR2 SDRAM?
Yes, XC6SLX100-3FG676I supports DDR2 SDRAM interfaces up to 400 Mbps data rate using its SelectIO™ technology and dedicated DQS capture circuitry. Implementation requires proper PCB layout (length-matched strobe/data groups), calibration via IDELAY/ISERDES, and adherence to UG381 v1.11 timing constraints for write leveling and read deskew.
XC6SLX100-3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-3FG676I FAQ
1.How can I place an order for XC6SLX100-3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-3FG676I reliable?
The price and inventory of XC6SLX100-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-3FG676I?
XC6SLX100-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-3FG676I?
For technical support, including XC6SLX100-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-3FG676I requirements.
6.How does Aetrix verify that XC6SLX100-3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-3FG676I?
All XC6SLX100-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100-3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100-3FG676I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
