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AMD XC6SLX100-3FGG484C

Part No.:
XC6SLX100-3FGG484C
Manufacturer:
AMD
Category:
FPGAs (Field Programmable Gate Array)
Package:
484-BBGA
Datasheet:
AetrixXC6SLX100-3FGG484C.pdf
Description:
IC FPGA 326 I/O 484FBGA
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,697

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Product details

Overview

XC6SLX100-3FGG484C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48E1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is packaged in a 484-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control and embedded vision systems.

For engineers reviewing the XC6SLX100-3FGG484C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, DCI termination, and integrated clock management with six DCMs and one PLL.

Technical Context

The XC6SLX100-3FGG484C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six Digital Clock Managers (DCMs) and one Phase-Locked Loop (PLL) for clock synthesis, multiplication, phase shifting, and jitter reduction.

I/O banks support multiple standards including LVCMOS, LVTTL, SSTL, HSTL, and differential signaling such as LVDS and TMDS. Each bank is independently powered with selectable VCCO voltages (1.2 V to 3.3 V), enabling mixed-voltage interface design without level shifters.

Key Specifications

ParameterValue and Actual Design Meaning
Logic Cells101,280 - determines maximum combinational/sequential logic capacity for system-on-chip integration
Block RAM1,824 Kbits - supports on-chip data buffering, FIFOs, and small memory-mapped peripherals
DSP Slices220 × DSP48E1 - enables fixed-point multiply-accumulate operations at up to 250 MHz
User I/O Pins348 - provides high-density parallel interface capability for sensors, displays, and FMC connectors
Speed Grade-3 - guarantees timing closure at 500 MHz system clock with worst-case industrial temperature (0–85°C)
Core Voltage1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption

Pinout & Package

XC6SLX100-3FGG484C is housed in a 484-ball Fine-Pitch BGA (FGG) package with 23 × 23 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad is exposed on underside for enhanced heat dissipation.

Pin/TerminalCircuit RoleDesign Meaning
G19VCCINT1.2 V core supply input for FPGA logic fabric and CLBs
A17VCCAUX2.5 V auxiliary supply for configuration circuitry and SelectIO banks
P20VCCO_0Programmable I/O bank voltage (1.2–3.3 V) for Bank 0
T14CONFIG_DONEOpen-drain status signal indicating successful configuration completion
R15INIT_BActive-low bidirectional pin used during configuration to indicate device readiness
Y16CLKIN_0_PDifferential clock input pair for primary DCM/PLL reference clock

Key Features

FeatureDesign Value
Integrated Clock ManagementSix DCMs + one PLL enable precise clock synthesis, skew control, and jitter filtering across multiple domains
DCI (Digitally Controlled Impedance)On-die series termination eliminates external resistors for impedance-matched high-speed I/O (e.g., DDR2/3)
Multi-Standard I/OSupport for LVDS, TMDS, SSTL-18/25, HSTL-I/II allows direct interfacing with video encoders, memory, and FPGAs
ISE Design Suite SupportFully supported by Xilinx ISE 14.7 with place-and-route, timing analysis, and bitstream generation

Applications

Industrial Motor ControlEmbedded Vision Processing

Use Scenario: Real-time field-oriented control (FOC) of three-phase PMSM/BLDC motors with encoder feedback and PWM generation.

IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller with sub-microsecond loop timing and synchronized PWM output.

Use Value: XC6SLX100-3FGG484C delivers 348 I/Os for sensor interfaces and 220 DSP slices for fast current-loop computation.

Use Scenario: Preprocessing pipeline for HD camera inputs including Bayer demosaicing, gamma correction, and edge enhancement before CPU/GPU handoff.

IC Role / Device Role / Timing Role: FPGA serves as low-latency image co-processor handling pixel-level operations in parallel hardware.

Use Value: XC6SLX100-3FGG484C provides 1,824 Kbits of block RAM for line buffers and dual-clock domain support for sensor-to-processor data staging.

Medical Imaging InterfaceTest & Measurement Equipment

Use Scenario: High-fidelity analog front-end digitization and time-stamped data aggregation from ultrasound transducer arrays.

IC Role / Device Role / Timing Role: FPGA manages multi-channel ADC synchronization, digital beamforming, and PCIe endpoint packetization.

Use Value: XC6SLX100-3FGG484C supports LVDS I/O for 100+ channel ADC links and includes six DCMs for precise sampling clock alignment.

Use Scenario: Modular signal generation and acquisition platform supporting arbitrary waveform synthesis and 16-bit simultaneous sampling.

IC Role / Device Role / Timing Role: FPGA implements reconfigurable digital pattern generators, trigger sequencers, and DMA controllers.

Use Value: XC6SLX100-3FGG484C offers 101,280 logic cells for custom protocol engines and supports 250 MHz system clocks for high-throughput data streaming.

Equivalent & Alternatives

The following parts are listed as comparable options for similar FPGA-based control and interface applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
XC6SLX150-3FGG484C147,443 logic cells, 2,128 Kbits BRAM, same package and speed gradeHigher gate count supports larger state machines and more complex IP coresSelect when additional logic density or memory is required without changing PCB layout
XC7A100T-2CSG324CArtix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, 240 DSP slices, 324-pin CSPBGALower static power, enhanced transceiver support, but different pinout and voltage requirementsChoose for new designs needing higher performance per watt or integrated transceivers; not drop-in compatible

Compared with XC6SLX100-3FGG484C, the XC6SLX150-3FGG484C offers scalable logic headroom within identical thermal and mechanical constraints, while the XC7A100T-2CSG324C delivers architectural improvements at the cost of board redesign and toolchain migration.

Availability

XC6SLX100-3FGG484C is available at Aetrix Electronics and suitable for industrial motor control, embedded vision processing, and medical imaging interface applications requiring stable component supply and long-term lifecycle assurance.

Supply support for XC6SLX100-3FGG484C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. AMD is a global semiconductor leader focused on adaptive computing, AI, and high-performance processing.

The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, I/O flexibility, and low-power operation - especially in industrial automation, video surveillance, and communications infrastructure.

FAQ

What is the operating temperature range for XC6SLX100-3FGG484C?

The XC6SLX100-3FGG484C is rated for industrial temperature range: 0 °C to +85 °C ambient. This specification applies to the C-grade version indicated by the final 'C' in the part number. Thermal performance must be validated with board-level airflow and copper pour design per Xilinx UG382 guidelines.

Does XC6SLX100-3FGG484C support JTAG boundary-scan testing?

Yes, XC6SLX100-3FGG484C fully supports IEEE 1149.1 JTAG boundary-scan via dedicated TCK, TMS, TDI, and TDO pins. The device implements TAP controller and instruction register compliant with Xilinx configuration architecture, enabling in-circuit programming and interconnect verification.

Can XC6SLX100-3FGG484C interface directly with DDR2 SDRAM?

Yes, XC6SLX100-3FGG484C supports DDR2 SDRAM interfaces using its SelectIO resources with DCI termination and source-synchronous capture. Xilinx UG381 documents timing constraints and PHY implementation guidance for 400 MT/s operation with appropriate board layout and VCCO = 1.8 V.

What configuration modes does XC6SLX100-3FGG484C support?

XC6SLX100-3FGG484C supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Bitstream loading can be initiated from SPI flash (e.g., Micron N25Q series), microcontroller, or host processor, with fallback support via JTAG for debug and recovery.

Is XC6SLX100-3FGG484C compatible with Vivado Design Suite?

No, XC6SLX100-3FGG484C is supported exclusively by Xilinx ISE Design Suite 14.7. Vivado does not support Spartan-6 devices. Migration to Artix-7 or newer families is required to use Vivado, and XC6SLX100-3FGG484C bitstreams cannot be generated in Vivado.

XC6SLX100-3FGG484C Specifications

Product attributes
Attribute value
Manufacturer:
AMD
Series:
Spartan®-6 LX
Package/Case:
484-BBGA
Packaging:
Tray
Product Status:
Active
Programmable:
Not Verified
Number of LABs/CLBs:
7911
Number of Logic Elements/Cells:
101261
Total RAM Bits:
4939776
Number of I/O:
326
Number of Gates:
-
Voltage - Supply:
1.14V ~ 1.26V
Mounting Type:
Surface Mount
Operating Temperature:
0°C ~ 85°C (TJ)
Grade:
-
Qualification:
-
Supplier Device Package:
484-FBGA (23x23)

XC6SLX100-3FGG484C FAQ

1.How can I place an order for XC6SLX100-3FGG484C through Aetrix?

Please submit a Request for Quotation (RFQ) for XC6SLX100-3FGG484C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for XC6SLX100-3FGG484C reliable?

The price and inventory of XC6SLX100-3FGG484C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-3FGG484C is usually 5 days.

3.What payment methods are accepted for XC6SLX100-3FGG484C?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-3FGG484C transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for XC6SLX100-3FGG484C?

XC6SLX100-3FGG484C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your XC6SLX100-3FGG484C order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for XC6SLX100-3FGG484C?

For technical support, including XC6SLX100-3FGG484C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-3FGG484C requirements.

6.How does Aetrix verify that XC6SLX100-3FGG484C is sourced from the original manufacturer or authorized distributors?

All XC6SLX100-3FGG484C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-3FGG484C meets industry standards.

7.What is the process for return or replacement of XC6SLX100-3FGG484C?

All XC6SLX100-3FGG484C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-3FGG484C, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The XC6SLX100-3FGG484C part is unused and in its original packaging.

Return procedure for XC6SLX100-3FGG484C:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

XC6SLX100-3FGG484C Tags

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