My Inquiry
My Account
AMD XC6SLX100-3FGG484I
- Part No.:
- XC6SLX100-3FGG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100-3FGG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,267
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100-3FGG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48E1 slices, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It is used in industrial motor control systems requiring deterministic I/O timing and real-time logic processing.
For engineers reviewing the XC6SLX100-3FGG484I datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (348 user I/Os), LVDS support, embedded memory depth, and industrial-grade thermal reliability.
Technical Context
The XC6SLX100-3FGG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates 220 DSP48E1 slices supporting 18×25-bit multiply-accumulate operations and 18 Kbit of distributed/block RAM per CLB column.
It supports SelectIO™ standards including LVCMOS, LVDS, SSTL, and HSTL across 348 user-configurable I/O pins, and includes dual 10-bit ADCs for system monitoring. Configuration is performed via SPI, BPI, or JTAG interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total programmable logic resources for combinatorial and sequential logic implementation |
| User I/O Pins | 348 - supports high-density interface bridging and multi-protocol connectivity |
| Block RAM | 1,824 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 220 × DSP48E1 - delivers 220 parallel 18×25-bit MAC operations per clock cycle |
| Speed Grade | -3 - guarantees timing closure up to 667 MHz for internal logic and 1,050 Mbps for LVDS I/O |
| Operating Temp | -40°C to +100°C - qualified for industrial environments without derating |
| Configuration Interface | Master SPI, Slave Serial, JTAG - enables flexible, secure, and field-upgradable programming |
Pinout & Package
Package: FGG484 - 484-pin Fine-Pitch Ball Grid Array (FBGA), 23×23 mm, 1.0 mm pitch, RoHS-compliant, industrial temperature rating.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally for signal integrity |
| P2 | IO_L0N_0 | Differential input pair (N) for Bank 0 - supports LVDS, TMDS, RSDS |
| R1 | IO_L0P_0 | Differential input pair (P) for Bank 0 - paired with P2 for noise-immune signaling |
| T14 | M0 | Configuration mode select - sets boot source (SPI/BPI/JTAG) at power-up |
| V17 | PROGRAM_B | Active-low asynchronous reset - initiates reconfiguration and clears configuration memory |
| W18 | INIT_B | Open-drain status output - indicates configuration completion or error condition |
| Y16 | CCLK | Configuration clock input - drives internal configuration logic during master SPI mode |
Key Features
| Feature | Design Value |
|---|---|
| Embedded DSP Blocks | 220 DSP48E1 slices enable real-time filtering, FFT, and motor vector control without external processors |
| SelectIO Technology | Support for 19 I/O standards including LVDS and SSTL-18 allows direct interfacing with ADCs, DDR2, and display controllers |
| Dual 10-bit ADCs | On-chip analog monitoring of VCCINT, VCCAUX, and die temperature eliminates need for external supervisory ICs |
| ISE Design Suite Support | Fully supported by Xilinx ISE 14.7 - enables timing closure, place-and-route, and bitstream generation for industrial deployments |
| Partial Reconfiguration Ready | Hardware architecture supports dynamic logic swapping - enables runtime feature updates and fault recovery |
Applications
| Industrial Motor Control | Automated Test Equipment (ATE) |
|---|---|
Use Scenario: Closed-loop servo drive with field-oriented control (FOC) and encoder feedback. IC Role / Device Role / Timing Role: Real-time logic engine executing PWM generation, current loop computation, and safety monitoring. Use Value: 220 DSP48E1 slices deliver sub-1 µs current loop latency; 348 I/Os route encoder, analog sensor, and isolation signals without glue logic. | Use Scenario: High-channel-count digital pattern generator with synchronized stimulus/response capture. IC Role / Device Role / Timing Role: Pin electronics controller managing per-pin voltage level, timing, and protocol state machines. Use Value: -3 speed grade ensures 1.05 Gbps LVDS I/O timing margin; block RAM buffers test vectors for burst-mode execution. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Ultrasound beamformer interface aggregating 128-channel echo data from ADCs to PCIe host. IC Role / Device Role / Timing Role: Protocol bridge and data preprocessor converting LVDS sensor streams to AXI-Stream for DMA transfer. Use Value: SelectIO support for LVDS and SSTL-18 enables direct connection to 14-bit medical ADCs; 1,824 Kbits block RAM absorbs channel skew. | Use Scenario: ARINC 429/664 (AFDX) gateway consolidating sensor and actuator data across multiple avionics bays. IC Role / Device Role / Timing Role: Deterministic packet scheduler and CRC engine with time-triggered I/O arbitration. Use Value: Industrial temp rating (-40°C to +100°C) meets DO-160 Section 22 Category D vibration/thermal requirements; dual ADC monitors power rail health. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG676I | 147,443 logic cells, 360 I/Os, larger FGG676 package (27×27 mm) | Higher gate count supports more complex control algorithms and additional protocol stacks | Choose when >100K logic cells or >348 I/Os are required; requires PCB redesign due to different footprint |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 210 I/Os, lower static power, no integrated ADC | Lacks dual 10-bit ADCs; supports PCIe Gen2 and DDR3 natively but not DDR2 | Prefer for new designs needing lower power or PCIe integration; not drop-in due to different configuration and I/O voltage schemes |
Compared with XC6SLX100-3FGG484I, the XC6SLX150-3FGG676I offers higher density but demands mechanical redesign, while the XC7A100T-2CSG324I provides modern transceivers and power efficiency at the cost of analog monitoring capability and legacy interface support.
Availability
XC6SLX100-3FGG484I is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term manufacturability.
Supply support for XC6SLX100-3FGG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for industrial and aerospace legacy support and long-lifecycle deployments.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring reliable I/O flexibility, embedded processing, and industrial temperature operation - especially where migration from older ASIC or CPLD platforms is needed.
FAQ
What is the maximum supported LVDS data rate for XC6SLX100-3FGG484I?
The XC6SLX100-3FGG484I supports LVDS signaling up to 1,050 Mbps per differential pair under -3 speed grade conditions. This is verified in the Spartan-6 DC and Switching Characteristics datasheet (DS162, v1.9), Table 14, and applies to all I/O banks configured for LVDS_25 or LVDS_33 standards with proper termination and layout.
Does XC6SLX100-3FGG484I include on-chip analog-to-digital converters?
Yes, the XC6SLX100-3FGG484I integrates two independent 10-bit ADCs accessible via the XADC hard IP block. These monitor internal supply voltages (VCCINT, VCCAUX) and die temperature, and support external analog inputs through dedicated VP/VN pins - no external ADC required for basic system health monitoring.
What configuration modes does XC6SLX100-3FGG484I support?
The XC6SLX100-3FGG484I supports three primary configuration modes: Master SPI (using internal oscillator), Slave Serial (driven by external controller), and JTAG (for debugging and programming). Mode selection is controlled by M2:M0 pins at power-up, and all modes are fully supported in Xilinx ISE 14.7 toolchain.
Is XC6SLX100-3FGG484I qualified for industrial temperature operation?
Yes, the XC6SLX100-3FGG484I carries the 'I' suffix denoting industrial temperature qualification (-40°C to +100°C). This rating is tested and guaranteed per Xilinx specification DS162, and applies across all I/O banks, logic fabric, and embedded blocks without derating.
Can XC6SLX100-3FGG484I implement partial reconfiguration in the field?
Yes, the XC6SLX100-3FGG484I hardware architecture supports partial reconfiguration, allowing dynamic swapping of logic modules without resetting the entire device. Implementation requires Xilinx ISE 14.7 with PlanAhead tools and adherence to area-group constraints and frame-based bitstream generation.
XC6SLX100-3FGG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100-3FGG484I FAQ
1.How can I place an order for XC6SLX100-3FGG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-3FGG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-3FGG484I reliable?
The price and inventory of XC6SLX100-3FGG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-3FGG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-3FGG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-3FGG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-3FGG484I?
XC6SLX100-3FGG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-3FGG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-3FGG484I?
For technical support, including XC6SLX100-3FGG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-3FGG484I requirements.
6.How does Aetrix verify that XC6SLX100-3FGG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-3FGG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-3FGG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-3FGG484I?
All XC6SLX100-3FGG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-3FGG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-3FGG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-3FGG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100-3FGG484I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
