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AMD XC6SLX100-3FGG676C
- Part No.:
- XC6SLX100-3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-3FGG676C.pdf
- Description:
- IC FPGA 480 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,357
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Product details
Overview
XC6SLX100-3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,795 Kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FGG676) and used in industrial video processing and reconfigurable I/O bridging applications.
For engineers reviewing the XC6SLX100-3FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), LVDS support, embedded memory depth, and thermal performance in compact PCB layouts.
Technical Context
The XC6SLX100-3FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports multi-standard I/O banks with programmable drive strength, slew rate, and on-chip termination (SSTL, HSTL, LVCMOS, LVDS).
It integrates dual-clock domain management via Digital Clock Managers (DCMs), supports JTAG boundary-scan (IEEE 1149.1), and enables partial reconfiguration through SelectMAP and SPI interfaces. Configuration is performed via external serial PROM or master SPI mode.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4,795 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external SRAM |
| DSP Slices | 220 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 480 - supports high-channel-count interface bridging (e.g., parallel camera sensors or display controllers) |
| Speed Grade | -3 - guarantees timing closure at 100% worst-case junction temperature (85°C) and 10% voltage tolerance |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| I/O Standards | SSTL-2, SSTL-18, HSTL-I, LVCMOS, LVDS - enables direct interfacing with DDR2, image sensors, and FPGAs |
Pinout & Package
XC6SLX100-3FGG676C is housed in a 676-ball Fine-Pitch Flip-Chip BGA (FGG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.85 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration clock input | Drives internal configuration logic during master SPI or SelectMAP mode; must be stable before INIT_B deassertion |
| INIT_B | Open-drain status output | Indicates configuration memory clearing or CRC error; pulled high externally to enable configuration |
| PROGRAM_B | Active-low reset input | Forces device into configuration reset state; asynchronous to all clocks and resets internal logic |
| DONE | Open-drain completion indicator | Signals successful configuration load; requires external pull-up to confirm startup readiness |
| VCCO_0 | I/O bank supply | Provides selectable voltage (1.2–3.3 V) for Bank 0 I/Os; must match connected peripheral interface standard |
| GND | Ground reference | Multiple dedicated balls per bank ensure low-inductance return paths for signal integrity and EMI control |
Key Features
| Feature | Design Value |
|---|---|
| Dual DCM clock management | Enables independent frequency synthesis, phase shifting, and duty-cycle correction for multiple clock domains |
| Integrated PCI Express endpoint | Supports Gen1 x1 link (2.5 Gbps) without external PHY; reduces latency and board space vs discrete solutions |
| Embedded Block RAM with ECC | Allows single-bit error correction in critical memory buffers, improving system reliability in industrial environments |
| Multi-voltage I/O banks | Permits simultaneous interfacing with 1.8 V, 2.5 V, and 3.3 V peripherals on same device without level shifters |
| Partial reconfiguration support | Allows runtime logic updates in designated regions while maintaining operation in others-ideal for adaptive systems |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of high-resolution CMOS sensor streams in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction prior to CPU transfer. Use Value: Reduces host processor load by offloading compute-intensive vision algorithms with deterministic latency under 10 µs. | Use Scenario: Bridging between legacy analog video outputs (e.g., CCD-based endoscopes) and digital display subsystems. IC Role / Device Role / Timing Role: Acts as a video format converter and timing controller, synchronizing NTSC/PAL signals to HDMI or LVDS panels. Use Value: Enables drop-in replacement of aging ASICs using reprogrammable logic, supporting field-upgradable video standards. |
| Programmable Logic Controller I/O Expansion | Test & Measurement Signal Generation |
Use Scenario: Adding isolated digital I/O, PWM, and quadrature encoder interfaces to modular PLC backplanes. IC Role / Device Role / Timing Role: Configurable I/O engine managing 48+ channels with cycle-accurate timing and galvanic isolation control. Use Value: Eliminates need for multiple ASICs or CPLDs, reducing BOM count and enabling firmware-defined I/O behavior. | Use Scenario: Generating synchronized multi-channel arbitrary waveforms for semiconductor ATE and RF calibration fixtures. IC Role / Device Role / Timing Role: High-speed pattern generator using block RAM and distributed logic to produce 100+ MHz sample rates with sub-ns jitter. Use Value: Achieves <15 ps RMS jitter on differential outputs, meeting IEEE 1149.4 boundary-scan test accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-3FGG676C | 147,443 logic cells, 5,888 Kbits BRAM, same package and speed grade | Higher gate count supports larger state machines and more concurrent IP cores | Select when XC6SLX100-3FGG676C resource utilization exceeds 90% in Vivado implementation |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 4,915 Kbits BRAM, -2 speed grade, smaller 324-pin CSP package | Lacks native PCI Express but adds AXI interconnect and higher DSP efficiency | Prefer for new designs requiring AXI-based SoC integration or lower static power; not pin-compatible with XC6SLX100-3FGG676C |
Compared with XC6SLX100-3FGG676C, the XC6SLX150-3FGG676C offers headroom for design growth within identical footprint and timing, while the XC7A100T-2CSG324C shifts toward modern SoC-style integration at the cost of migration effort and package redesign.
Availability
XC6SLX100-3FGG676C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and programmable logic controller I/O expansion requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing, graphics, and visualization technologies for data center, client, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring balanced logic density, low power, and multi-standard I/O flexibility-targeting industrial control, video, and connectivity endpoints.
FAQ
What is the maximum operating junction temperature for XC6SLX100-3FGG676C?
The XC6SLX100-3FGG676C has a maximum operating junction temperature of +85°C, validated under worst-case voltage (1.23 V) and process corner conditions. Thermal design must maintain this limit using appropriate PCB copper area, thermal vias, and optional heatsink attachment to the package top metal. The XC6SLX100-3FGG676C datasheet specifies derating curves for ambient temperature versus power dissipation above 65°C.
Does XC6SLX100-3FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX100-3FGG676C fully complies with IEEE 1149.1 (JTAG) and supports boundary-scan testing via TCK, TMS, TDI, TDO, and TDO pins. It enables pre- and post-configuration testing of PCB interconnects and supports device programming through the JTAG port. The XC6SLX100-3FGG676C also supports IDCODE and BYPASS instructions required for chain integrity verification.
Can XC6SLX100-3FGG676C be configured using SPI flash memory?
Yes, XC6SLX100-3FGG676C supports master SPI configuration mode, allowing direct boot from industry-standard 4-wire SPI flash devices (e.g., Micron MT25QL, Winbond W25Q). The XC6SLX100-3FGG676C initiates read cycles automatically after power-up or PROGRAM_B assertion, eliminating need for external microcontroller bootloaders.
What I/O standards are supported on Bank 14 of XC6SLX100-3FGG676C?
Bank 14 of XC6SLX100-3FGG676C supports LVDS, Mini-LVDS, RSDS, and BLVDS differential standards, along with single-ended LVCMOS and LVTTL. Its VCCO must be set to 2.5 V for LVDS operation. The XC6SLX100-3FGG676C documentation confirms these standards are electrically validated and timing-characterized for that bank.
Is partial reconfiguration supported on XC6SLX100-3FGG676C?
Yes, XC6SLX100-3FGG676C supports partial reconfiguration through the ICAP (Internal Configuration Access Port) and PCIe-based configuration interfaces. This capability allows dynamic logic updates in designated regions while preserving operation elsewhere. Implementation requires Xilinx ISE Design Suite 14.7 or later and specific floorplanning constraints for the XC6SLX100-3FGG676C device.
XC6SLX100-3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-3FGG676C FAQ
1.How can I place an order for XC6SLX100-3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-3FGG676C reliable?
The price and inventory of XC6SLX100-3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100-3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-3FGG676C?
XC6SLX100-3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-3FGG676C?
For technical support, including XC6SLX100-3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-3FGG676C requirements.
6.How does Aetrix verify that XC6SLX100-3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100-3FGG676C?
All XC6SLX100-3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100-3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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