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AMD XC6SLX100-L1FG484I
- Part No.:
- XC6SLX100-L1FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100-L1FG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,866
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Product details
Overview
XC6SLX100-L1FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA with 101,280 logic cells, 484-pin Fine-Pitch Ball Grid Array (FBGA) package, -1 speed grade, and industrial temperature range (–40°C to +100°C). It integrates Block RAM, DSP48A1 slices, and SelectIO™ technology for high-speed I/O interfacing in embedded vision and industrial control systems.
For engineers reviewing the XC6SLX100-L1FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), differential signaling support (LVDS, SSTL), embedded memory depth (4,976 Kbits), and industrial-grade thermal reliability.
Technical Context
The XC6SLX100-L1FG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for clock networks and global enable signals. It supports multi-standard I/O banks operating at 1.2V to 3.3V, including LVCMOS, LVTTL, HSTL, and LVDS.
Embedded resources include 18 Kbit Block RAM primitives (up to 4,976 Kbits total), 180 DSP48A1 slices for arithmetic-intensive tasks, and integrated PCI Express® Endpoint (v1.1) and Gigabit Ethernet MAC blocks. Configuration is performed via SPI serial flash or JTAG.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic density for system-on-chip integration |
| User I/O Pins | 348 - supports wide parallel interfaces, multiple peripheral buses, or high-channel-count sensor aggregation |
| Block RAM | 4,976 Kbits - enables local data buffering, FIFOs, or small frame stores without external memory |
| DSP Slices | 180 - delivers 180 independent 18×18-bit multiply-accumulate operations per clock cycle |
| Speed Grade | -1 - guarantees timing closure up to 667 Mbps DDR3 interface operation at industrial temperature |
| Operating Temp | –40°C to +100°C - qualified for deployment in uncooled industrial enclosures and factory-floor environments |
| Configuration Mode | Master SPI, Slave Serial, JTAG - enables flexible, field-upgradable firmware loading from flash or host processor |
Pinout & Package
XC6SLX100-L1FG484I is housed in a 484-ball Fine-Pitch BGA (FG484) package with 25 mm × 25 mm body size, 1.0 mm ball pitch, and standard 0.75 mm ball diameter. The package supports reflow soldering per IPC/JEDEC J-STD-020D and includes thermal pad for enhanced heat dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally to maintain signal integrity for LVDS/SSTL interfaces |
| P2 | CLKIN_1 | Dedicated global clock input - low-jitter path for synchronous logic timing and PLL reference |
| T14 | M0 | Configuration mode select - sets boot source (SPI flash vs. JTAG) during power-up initialization |
| V17 | PROGRAM_B | Active-low configuration reset - initiates full reconfiguration sequence when asserted |
| W18 | INIT_B | Open-drain status output - indicates configuration memory readiness before DONE assertion |
| Y19 | DONE | Open-drain configuration completion - drives high after bitstream validation and I/O release |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Gen1 x1 link - enables direct host CPU communication without external bridge IC or protocol translation |
| SelectIO Technology | Multi-standard I/O with programmable drive strength and slew rate - reduces board-level termination components and layout complexity |
| DSP48A1 Slice | 18×18-bit multiplier + 48-bit accumulator - supports real-time filtering, FFT, and motor control algorithms in single-cycle latency |
| Block RAM Configuration | True dual-port or simple dual-port modes - allows concurrent read/write access for pipelined data flow in video processing pipelines |
| Power-Down Mode | Per-bank I/O isolation and core voltage gating - reduces static power by >60% during idle periods in battery-backed systems |
Applications
| Industrial Motion Control | Machine Vision Edge Processor |
|---|---|
Use Scenario: Real-time servo loop execution with sub-microsecond jitter in CNC and robotic arms. IC Role / Device Role / Timing Role: FPGA fabric implements PID controllers, encoder interpolation, and PWM generation with deterministic timing. Use Value: 101,280 logic cells and 180 DSP slices enable simultaneous multi-axis control and safety monitoring logic. | Use Scenario: On-camera preprocessing of 1080p@60fps image streams before transmission to host. IC Role / Device Role / Timing Role: XC6SLX100-L1FG484I acts as pixel pipeline accelerator with parallel Bayer demosaic, noise reduction, and histogram equalization. Use Value: 4,976 Kbits of Block RAM provides line buffers for real-time 2D convolution without external DRAM latency. |
| Programmable Logic Controller (PLC) | Test & Measurement Equipment |
Use Scenario: Modular I/O expansion module supporting analog/digital inputs, relay outputs, and fieldbus protocols. IC Role / Device Role / Timing Role: Configurable I/O banks interface with isolated ADCs, optocoupled digital lines, and RS-485 transceivers. Use Value: 348 user I/Os and multi-voltage support allow direct connection to diverse industrial sensors and actuators. | Use Scenario: High-precision waveform generation and acquisition in automated test systems. IC Role / Device Role / Timing Role: XC6SLX100-L1FG484I synchronizes DAC/ADC sampling clocks, manages pattern memory, and handles trigger logic. Use Value: Industrial temperature rating and -1 speed grade ensure stable 200+ MSPS sample timing across environmental stress tests. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic acceleration applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-L1FGG676I | 147,443 logic cells, 676-ball BGA, higher I/O count (444), larger footprint and power envelope | Better suited for multi-gigabit serial protocols and larger state machines requiring >120K LUTs | Select when design requires >120K logic cells or additional transceiver lanes beyond XC6SLX100-L1FG484I capability |
| XC7A100T-1CSG324I | Artix-7 architecture, 101,440 logic cells, 324-pin CSPBGA, lower static power, no native PCI Express endpoint | Lacks integrated PCIe but adds 6.6 Gbps transceivers and improved DSP efficiency for high-throughput signal processing | Choose for new designs prioritizing transceiver bandwidth and dynamic power efficiency over legacy PCIe compatibility |
Compared with XC6SLX100-L1FG484I, XC6SLX150T-L1FGG676I offers greater logic density and I/O scalability at the cost of PCB area and thermal management complexity, while XC7A100T-1CSG324I trades PCIe integration for transceiver performance and lower power-making it suitable for next-generation high-speed serial applications.
Availability
XC6SLX100-L1FG484I is available at Aetrix Electronics and suitable for industrial automation, machine vision edge nodes, and programmable logic controller modules requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-L1FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, moderate logic density, and industrial temperature operation-targeting embedded control and interface bridging.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX100-L1FG484I?
The XC6SLX100-L1FG484I supports DDR3 SDRAM interfaces up to 667 Mbps data rate (333 MHz clock) under industrial temperature conditions, validated per UG388 v1.11 and constrained using the -1 speed grade timing models. This performance assumes proper PCB layout, matched trace lengths, and compliant termination. XC6SLX100-L1FG484I does not support DDR3L or LPDDR3 standards.
Does XC6SLX100-L1FG484I include hard IP for PCI Express?
Yes, XC6SLX100-L1FG484I integrates a hard PCI Express Endpoint block compliant with PCIe Base Specification v1.1 (2.5 Gbps per lane, x1 configuration). It supports enumeration, memory-mapped I/O, and MSI interrupts without external PHY. XC6SLX100-L1FG484I does not support PCIe Gen2 or multi-lane configurations.
What configuration modes are supported by XC6SLX100-L1FG484I?
XC6SLX100-L1FG484I supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI enables autonomous boot from external SPI flash; Slave Serial allows host processor-controlled configuration; JTAG is used for debugging and programming. All modes are accessible via dedicated pins (M0–M2, PROGRAM_B, INIT_B, DONE) and require no external logic. XC6SLX100-L1FG484I does not support BPI or NAND flash configuration.
Can XC6SLX100-L1FG484I operate reliably at 100°C junction temperature?
Yes, XC6SLX100-L1FG484I is rated for industrial temperature operation (–40°C to +100°C ambient), with thermal design guidelines specifying maximum junction temperature of 125°C. Reliable operation at 100°C ambient requires adequate PCB copper pour, thermal vias under the FG484 package, and airflow ≥0.5 m/s. XC6SLX100-L1FG484I has been validated per JEDEC JESD22-A108F for 1000-hour storage at 150°C.
How many differential I/O pairs does XC6SLX100-L1FG484I support?
XC6SLX100-L1FG484I supports up to 174 differential I/O pairs (348 single-ended signals), distributed across 12 I/O banks. Each bank supports LVDS, BLVDS, RSDS, and mini-LVDS signaling with internal differential termination. XC6SLX100-L1FG484I does not support current-mode logic (CML) or PECL standards.
XC6SLX100-L1FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100-L1FG484I FAQ
1.How can I place an order for XC6SLX100-L1FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-L1FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-L1FG484I reliable?
The price and inventory of XC6SLX100-L1FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-L1FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-L1FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-L1FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-L1FG484I?
XC6SLX100-L1FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-L1FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-L1FG484I?
For technical support, including XC6SLX100-L1FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-L1FG484I requirements.
6.How does Aetrix verify that XC6SLX100-L1FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-L1FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-L1FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-L1FG484I?
All XC6SLX100-L1FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-L1FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-L1FG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-L1FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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