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AMD XC6SLX100-L1FG676I
- Part No.:
- XC6SLX100-L1FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-L1FG676I.pdf
- Description:
- IC FPGA 480 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,354
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Product details
Overview
XC6SLX100-L1FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 480 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -1 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control, embedded vision preprocessing, and reconfigurable I/O bridging.
For engineers reviewing the XC6SLX100-L1FG676I datasheet, pinout, applications, or equivalent options, key selection factors include logic density, I/O count (480 user I/Os), LVDS support, internal clock management (DCM and PLL), and industrial-grade thermal reliability.
Technical Context
The XC6SLX100-L1FG676I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O and clock distribution. It integrates dual DCMs and one PLL for clock synthesis, phase alignment, and frequency multiplication up to 500 MHz.
It supports SelectIO standards including LVCMOS, LVTTL, SSTL, HSTL, and differential interfaces such as LVDS, Mini-LVDS, RSDS, and BLVDS. Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4.9 Mb - supports large on-chip data buffering, FIFOs, and lookup tables without external memory |
| DSP Slices | 480 - enables parallel multiply-accumulate operations for filtering, FFT, and motor control algorithms |
| User I/O Pins | 480 - provides high-density interface capability for sensor arrays, display controllers, or multi-protocol bridging |
| Speed Grade | -1 - guarantees timing closure up to 667 Mbps DDR3 interface operation and 500 MHz internal clocking |
| Operating Temp | –40°C to +100°C - validated for deployment in industrial enclosures and uncooled edge equipment |
| Configuration Mode | Master SPI / Slave Serial / JTAG - enables flexible, field-upgradable programming via microcontroller or host processor |
Pinout & Package
XC6SLX100-L1FG676I is housed in a 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch, 27 × 27 array, and thermal pad. Pin assignment follows Xilinx UG382 v1.11 and supports bank-based voltage partitioning (1.2 V core, 1.8/2.5/3.3 V I/O).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | VCCO_0 | I/O bank 0 power supply - sets output voltage level for pins in Bank 0 (e.g., LVCMOS33 or LVDS) |
| H19 | GND | Ground reference for adjacent I/O and configuration circuitry - critical for signal integrity and noise immunity |
| K17 | PROGRAM_B | Active-low asynchronous reset - initiates full reconfiguration from external source or on-board controller |
| M20 | CCLK | Configuration clock input - drives serial bitstream loading during Master SPI mode |
| P16 | DONE | Open-drain status indicator - goes high when configuration completes and device enters user mode |
| R15 | INIT_B | Active-low initialization flag - signals configuration error or incomplete bitstream load |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCM + PLL | Enables precise clock deskew, jitter reduction, and frequency synthesis without external clock ICs |
| SelectIO Technology | Supports mixed-voltage I/O banks with programmable drive strength and slew rate for EMI control |
| Embedded Memory Blocks | Configurable as true dual-port RAM, ROM, or shift register - reduces external memory footprint |
| ISE Design Suite Support | Full toolchain compatibility with synthesis, place-and-route, and timing analysis for deterministic development |
| Partial Reconfiguration Ready | Allows dynamic logic module swapping in-system - supports adaptive functionality without full reboot |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM/BLDC motors with current sensing and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop control algorithm; DCM aligns PWM edges to current sampling windows. Use Value: Achieves <1 µs loop latency and synchronized 20 kHz PWM with hardware-accelerated Clarke/Park transforms. | Use Scenario: On-camera image pipeline for industrial inspection systems using CMOS sensors and Bayer pattern input. IC Role / Device Role / Timing Role: Configurable logic performs pixel-level demosaicing, histogram equalization, and ROI cropping before transmission. Use Value: Offloads CPU-intensive tasks while maintaining sub-frame latency and supporting 60 fps 1080p sensor streams. |
| Reconfigurable I/O Bridging | Communications Protocol Gateway |
Use Scenario: Interfacing legacy parallel bus peripherals (e.g., ISA, PC/104) to modern PCIe or USB 3.0 hosts. IC Role / Device Role / Timing Role: FPGA implements protocol translation, timing adaptation, and handshaking logic between mismatched buses. Use Value: Eliminates need for ASIC redesign; supports hot-swappable peripheral modules via partial reconfiguration. | Use Scenario: Converting Modbus RTU over RS-485 to MQTT over Ethernet in IIoT edge gateways. IC Role / Device Role / Timing Role: FPGA handles serial framing, CRC validation, packet assembly, and TCP/IP offload via soft-core MicroBlaze. Use Value: Enables deterministic low-jitter serial-to-network conversion with <50 µs end-to-end latency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-L1FG676I | Higher logic density (147,443 LCs), same package and speed grade - requires PCB layout reuse but larger bitstream | Supports more complex control algorithms or additional protocol stacks in same footprint | Select when design scalability or future feature expansion is required without changing board layout |
| XC7A100T-1CSG324I | Artix-7 architecture; higher DSP count (240 vs 480), lower power, but different pinout and no native backward compatibility | Better suited for new designs targeting lower static power and higher DSP throughput per watt | Choose for greenfield projects prioritizing energy efficiency and advanced transceiver options over legacy toolchain continuity |
Compared with XC6SLX100-L1FG676I, the XC6SLX150-L1FG676I offers headroom within identical packaging and tooling, while the XC7A100T-1CSG324I delivers architectural improvements at the cost of migration effort - making the former ideal for incremental upgrades and the latter for next-generation platforms.
Availability
XC6SLX100-L1FG676I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and reconfigurable I/O bridging requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-L1FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing solutions including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable reconfigurable logic with mature tooling and long-term availability.
FAQ
What is the maximum supported DDR3 memory interface speed for XC6SLX100-L1FG676I?
The XC6SLX100-L1FG676I supports DDR3 SDRAM interfaces up to 667 Mbps data rate (333 MHz clock) using its dedicated memory controller logic and I/O timing constraints. This performance is guaranteed under -1 speed grade conditions with proper PCB layout and termination. The XC6SLX100-L1FG676I achieves this using calibrated delay elements and source-synchronous strobe capture aligned to DQS signals.
Does XC6SLX100-L1FG676I support partial reconfiguration?
Yes, XC6SLX100-L1FG676I supports partial reconfiguration through the ISE Design Suite and appropriate floorplanning. This allows dynamic replacement of logic modules without resetting the entire device. The XC6SLX100-L1FG676I requires use of the PlanAhead tool for module boundary definition and bitstream generation, and relies on internal configuration access port (ICAP) for runtime updates.
What configuration modes are supported by XC6SLX100-L1FG676I?
XC6SLX100-L1FG676I supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI uses an internal oscillator to clock external SPI flash; Slave Serial accepts bitstream from a microcontroller; JTAG enables debugging and programming via standard boundary-scan interface. All three modes are fully documented in Xilinx UG380 and verified on the XC6SLX100-L1FG676I silicon.
Is XC6SLX100-L1FG676I qualified for automotive applications?
No, XC6SLX100-L1FG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. While it operates reliably in harsh environments, it lacks automotive-specific screening, failure-in-time (FIT) reporting, and qualification test documentation required for automotive ECUs. For automotive use, consider XA Spartan-6 derivatives instead of XC6SLX100-L1FG676I.
What is the total number of user I/O pins available on XC6SLX100-L1FG676I?
The XC6SLX100-L1FG676I provides 480 user-configurable I/O pins distributed across 12 I/O banks. Each bank supports independent voltage selection (1.2 V to 3.3 V), programmable drive strength, and slew rate control. This count is fixed for the FG676 package and confirmed in Xilinx DS162 v1.5 specification document for XC6SLX100-L1FG676I.
XC6SLX100-L1FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-L1FG676I FAQ
1.How can I place an order for XC6SLX100-L1FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-L1FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-L1FG676I reliable?
The price and inventory of XC6SLX100-L1FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-L1FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-L1FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-L1FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-L1FG676I?
XC6SLX100-L1FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-L1FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-L1FG676I?
For technical support, including XC6SLX100-L1FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-L1FG676I requirements.
6.How does Aetrix verify that XC6SLX100-L1FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-L1FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-L1FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-L1FG676I?
All XC6SLX100-L1FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-L1FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-L1FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100-L1FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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