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AMD XC6SLX100-N3CSG484I
- Part No.:
- XC6SLX100-N3CSG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-FBGA, CSPBGA
- Datasheet:
-
XC6SLX100-N3CSG484I.pdf
- Description:
- IC FPGA 338 I/O 484CSBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,888
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Product details
Overview
XC6SLX100-N3CSG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 180 DSP48A1 slices, and 4,729 kbits of block RAM. It operates at -3 speed grade with industrial temperature range (–40°C to +100°C) and uses a 484-pin CSBGA package. It is deployed in industrial motor control systems requiring deterministic timing and real-time I/O processing.
For engineers reviewing the XC6SLX100-N3CSG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic capacity, I/O count (348 user I/Os), LVDS support, embedded memory depth, and industrial-grade thermal performance.
Technical Context
The XC6SLX100-N3CSG484I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates six CMT clock management tiles-each containing two DCMs-for multi-phase clock synthesis and jitter reduction.
It supports SelectIO™ standards including LVCMOS, LVDS, SSTL, and HSTL across 348 user-configurable I/O pins. Configuration is performed via Master SPI, Slave Serial, or JTAG, with bitstream encryption available using AES-256.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - determines maximum combinational/sequential logic density for custom RTL implementation |
| DSP Slices | 180 × DSP48A1 - enables fixed-point multiply-accumulate operations up to 25×18-bit per slice |
| Block RAM | 4,729 kbits - supports dual-port memory buffers, FIFOs, or coefficient storage for signal processing |
| User I/O Pins | 348 - provides parallel interface capability for sensors, ADCs, FPGAs, or microcontrollers |
| Speed Grade | -3 - guarantees timing closure at 667 MHz DDR3 interface clock and 500 MHz system clock |
| Operating Temp | –40°C to +100°C - validated for deployment in enclosed industrial enclosures without forced cooling |
| Package | 484-pin CSBGA (19×19 mm, 1.0 mm pitch) - enables high I/O count with thermal reliability in space-constrained PCBs |
Pinout & Package
XC6SLX100-N3CSG484I is housed in a 484-pin Chip Scale Ball Grid Array (CSBGA) package with 19×19 array, 1.0 mm ball pitch, and exposed thermal pad. Pin functions are defined per UG382 (v1.11) and include configuration, clock, I/O, power, and ground terminals.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain status output confirming successful configuration loading and initialization |
| P17 | INIT_B | Active-low open-drain signal indicating device readiness for configuration or detecting CRC error |
| V22, W22 | CLK0, CLK1 | Dedicated single-ended clock inputs routed to CMT for low-skew global clock distribution |
| A10–D14 | IO_LxxN/IO_LxxP | Differential I/O pairs supporting LVDS at up to 1.0 Gbps with internal termination |
| R1, T1 | VCCO_0 | I/O bank voltage supply (1.2 V / 1.35 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V selectable per bank) |
| E18, E19 | VCCAUX | 1.8 V auxiliary supply powering configuration logic, clock management, and JTAG circuitry |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCIe Endpoint Block | Hard IP supporting Gen1 x1/x2 link layer with integrated DMA engine for host-FPGA data streaming |
| Embedded Memory Controller | Hard macro supporting DDR2/DDR3 SDRAM up to 800 Mbps with calibration and refresh control |
| AES-256 Bitstream Encryption | Prevents unauthorized configuration cloning or reverse engineering of implemented logic design |
| SelectIO Technology | Per-bank voltage and standard flexibility enables mixed-voltage I/O interfacing without level shifters |
| Multi-Channel Clock Management | Six CMTs provide independent phase-shifted clocks for video pixel timing, ADC sampling, and control loops |
Applications
| Industrial Motor Drive | Automated Test Equipment |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with encoder feedback and PWM generation. IC Role / Device Role / Timing Role: FPGA fabric executes closed-loop control algorithm; CMTs generate synchronized 20 kHz PWM carriers and ADC sampling triggers. Use Value: Deterministic sub-microsecond latency between current sensing and PWM update ensures torque ripple < 2% at full load. | Use Scenario: High-speed digital pattern generation and response capture for semiconductor device functional testing. IC Role / Device Role / Timing Role: XC6SLX100-N3CSG484I acts as programmable vector generator and comparator with precise cycle-accurate timing alignment. Use Value: 348 user I/Os support parallel 128-bit wide test buses; -3 speed grade ensures setup/hold compliance at 150 MHz test clock. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Aggregation and preprocessing of multi-channel ultrasound echo data before transmission to host processor. IC Role / Device Role / Timing Role: Configurable logic implements FIR filtering and beamforming; block RAM buffers raw RF samples at 40 MSPS. Use Value: 4,729 kbits block RAM enables 256-sample deep pipeline per channel without external memory access. | Use Scenario: ARINC 429 and MIL-STD-1553B bus bridging with time-stamped message routing in flight control subsystems. IC Role / Device Role / Timing Role: XC6SLX100-N3CSG484I serves as protocol-aware bridge with deterministic interrupt latency under 500 ns. Use Value: Industrial temperature rating and SEU-hardened configuration memory ensure operation during extended high-altitude thermal cycles. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-L2FLGA2104E | UltraScale+ architecture; 2,586K logic cells; 64 GB/s transceiver bandwidth; no CMTs (uses MMCM/PLL only) | Targets high-throughput video processing or AI inference acceleration; requires PCIe Gen3/Gen4 host interface | Choose when migrating from Spartan-6 to higher bandwidth, lower latency, and larger logic capacity-requires full HDL redesign and new PCB layout. |
| XC7A100T-2CSG324I | Artix-7 architecture; 101,440 logic cells; identical I/O count (210); lacks integrated PCIe block and DDR3 controller hard IP | Suitable for cost-sensitive industrial controllers where soft-core PCIe or DDR3 PHY is acceptable | Prefer for new designs needing lower power and smaller footprint than XC6SLX100-N3CSG484I, but accept added soft IP integration effort. |
Compared with XC6SLX100-N3CSG484I, the XC7A100T-2CSG324I offers comparable logic density in a smaller package but requires soft IP for PCIe and DDR3, while the XCVU9P-L2FLGA2104E delivers orders-of-magnitude higher throughput at significantly higher cost, power, and design complexity.
Availability
XC6SLX100-N3CSG484I is available at Aetrix Electronics and suitable for industrial motor drives, automated test equipment, and avionics data concentrators requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-N3CSG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and ACAPs for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, high-volume industrial and automotive applications requiring reliable I/O interfacing, deterministic logic execution, and long-term availability-exemplified by XC6SLX100-N3CSG484I.
FAQ
What is the maximum supported DDR3 data rate for XC6SLX100-N3CSG484I?
The XC6SLX100-N3CSG484I supports DDR3 SDRAM interfaces up to 800 Mbps (400 MHz clock) using its hard memory controller. This is verified in UG388 (v1.12) Table 1-10 and applies to all -3 speed grade devices in the CSBGA-484 package. The controller includes built-in calibration, refresh management, and burst-length support for x8/x16/x32 configurations. XC6SLX100-N3CSG484I does not support DDR3L or LPDDR variants.
Does XC6SLX100-N3CSG484I include hardware-accelerated cryptographic functions?
No, XC6SLX100-N3CSG484I does not contain dedicated cryptographic accelerators. It supports AES-256 bitstream encryption for configuration security, but does not implement SHA, RSA, or elliptic-curve engines in hardware. Cryptographic operations must be implemented in fabric using soft IP cores. XC6SLX100-N3CSG484I's block RAM and DSP slices can accelerate symmetric cipher primitives, but no public documentation confirms hardened crypto blocks.
Can XC6SLX100-N3CSG484I operate in a 1.2 V I/O bank?
Yes, XC6SLX100-N3CSG484I supports 1.2 V I/O operation in banks configured for LVCMOS12 or SSTL12 standards. Each of its 12 I/O banks is independently powered, allowing mixed-voltage operation across banks. UG382 Section 2.2.1 specifies VCCO range from 1.2 V to 3.3 V per bank. XC6SLX100-N3CSG484I requires proper decoupling and termination matching for signal integrity at 1.2 V.
Is XC6SLX100-N3CSG484I qualified for automotive AEC-Q100?
No, XC6SLX100-N3CSG484I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It lacks automotive-specific screening, failure rate reporting, or PPAP documentation. For automotive applications, AMD offers the Spartan-6Q family (e.g., XC6SLX100Q-3CSG484I) with AEC-Q100 Grade 3 qualification. XC6SLX100-N3CSG484I is intended for industrial, medical, and aerospace non-safety-critical use.
How many CMT clock management tiles are available in XC6SLX100-N3CSG484I?
XC6SLX100-N3CSG484I contains six Clock Management Tiles (CMTs), each with two Digital Clock Managers (DCMs). These provide independent clock synthesis, phase shifting, frequency multiplication/division, and duty-cycle correction. All six CMTs are fully accessible in the XC6SLX100-N3CSG484I device and documented in UG382 Figure 1-3. No CMTs are disabled or reserved in this speed grade or package variant.
XC6SLX100-N3CSG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-FBGA, CSPBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 338
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-CSPBGA (19x19)
XC6SLX100-N3CSG484I FAQ
1.How can I place an order for XC6SLX100-N3CSG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-N3CSG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-N3CSG484I reliable?
The price and inventory of XC6SLX100-N3CSG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-N3CSG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-N3CSG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-N3CSG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-N3CSG484I?
XC6SLX100-N3CSG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-N3CSG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-N3CSG484I?
For technical support, including XC6SLX100-N3CSG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-N3CSG484I requirements.
6.How does Aetrix verify that XC6SLX100-N3CSG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-N3CSG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-N3CSG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-N3CSG484I?
All XC6SLX100-N3CSG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-N3CSG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-N3CSG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-N3CSG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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