AMD XC6SLX100-N3FG484I
- Part No.:
- XC6SLX100-N3FG484I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 484-BBGA
- Datasheet:
-
XC6SLX100-N3FG484I.pdf
- Description:
- IC FPGA 326 I/O 484FBGA
- Quantity:
- Payment:

- Shipping:

Inventory:3,977
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100-N3FG484I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 18 Kbits block RAM per block, 220 I/O pins, and operates at -3 speed grade with industrial temperature range (-40°C to +100°C). It serves as a reconfigurable logic fabric for digital signal processing in industrial motor control systems.
For engineers reviewing the XC6SLX100-N3FG484I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count, speed grade compliance, industrial temperature rating, and compatibility with Spartan-6 configuration interfaces and clocking resources.
Technical Context
The XC6SLX100-N3FG484I implements a fully programmable logic architecture based on 6-input LUTs and flip-flops, supporting synchronous design with dedicated carry chains and shift registers. It integrates 220 user-configurable I/Os compliant with LVCMOS, LVTTL, SSTL, and HSTL standards across multiple banks.
It includes six CMT clock management tiles-each with two DCMs-for jitter-reduced clock synthesis, phase shifting, and frequency multiplication up to 500 MHz. Configuration is supported via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - total available LUT+FF pairs for combinational and sequential logic implementation |
| Block RAM | 2,138 Kbits - distributed across 192 blocks of 18 Kbits each for on-chip data buffering |
| I/O Pins | 220 - user-programmable, banked I/Os supporting mixed-voltage operation and slew-rate control |
| Speed Grade | -3 - guarantees timing closure at maximum operating frequencies defined in Spartan-6 data sheet |
| Temperature Range | -40°C to +100°C - qualified for industrial environments without derating |
| Package | FG484 - 484-pin Fine-Pitch Ball Grid Array with 1.0 mm pitch and 23×23 mm body |
| Configuration Mode | Master Serial / Slave Serial / JTAG - supports boot from SPI flash or host processor initialization |
Pinout & Package
XC6SLX100-N3FG484I is housed in a 484-pin Fine-Pitch BGA (FG484) package with 1.0 mm ball pitch, thermal pad, and standard JEDEC MO-251AC footprint. Pin functions are organized into 12 I/O banks, each supporting independent VCCO and VREF settings.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | CONFIG_IO_0 / INIT_B | Active-low configuration initialization status indicator and dual-function I/O |
| K1 | CCLK | Configuration clock input for Master Serial mode; driven by FPGA during Slave Serial mode |
| M1 | DIN / PROGRAM_B | Serial configuration data input or active-low device programming trigger |
| P1 | DOUT | Serial configuration data output during readback or boundary-scan operations |
| T1 | PROG_B | Active-low global reset that clears configuration memory and restarts startup sequence |
| Y2 | CLK0 / GCLK0 | Global clock input routed to all CMTs and logic regions for synchronous timing distribution |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | Six CMTs with dual DCMs per tile enable precise clock phase alignment and frequency synthesis without external PLLs |
| Low-Power Architecture | 1.2 V core voltage and advanced power gating reduce dynamic and static power versus prior Spartan families |
| Multi-Standard I/O Support | Per-bank voltage selection allows concurrent LVCMOS33, LVDS, and SSTL18 interfaces on single device |
| Embedded Memory Blocks | 192 × 18 Kbit Block RAMs support true dual-port operation and byte-write enable for FIFO and buffer applications |
| Configuration Security | Bitstream encryption via AES-128 and HMAC-SHA-256 prevents unauthorized cloning and reverse engineering |
Applications
| Industrial Motor Control | Video Interface Bridge |
|---|---|
Use Scenario: Real-time PWM generation and encoder feedback processing in servo drives. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with deterministic latency. Use Value: 220 I/Os support simultaneous analog monitoring, digital I/O, and high-speed encoder inputs without external glue logic. | Use Scenario: Converting HDMI 1.4a video streams to MIPI DSI for embedded display modules. IC Role / Device Role / Timing Role: Protocol translation engine with pixel-clock domain crossing and packet reformatting. Use Value: Six CMTs provide independent, jitter-cleaned clocks for source and sink domains, enabling stable video handoff. |
| Programmable Logic PLC | Medical Imaging Data Path |
Use Scenario: Replacing fixed ASICs in modular PLC backplanes for field-upgradable I/O mapping. IC Role / Device Role / Timing Role: Field-programmable logic implementing custom I/O expansion and safety-critical logic scanning. Use Value: Industrial temperature rating and configuration encryption ensure long-term reliability and IP protection in factory-floor deployments. | Use Scenario: Preprocessing raw sensor data from ultrasound transducer arrays before ADC digitization. IC Role / Device Role / Timing Role: High-throughput data conditioning pipeline with parallel FIR filtering and gain calibration. Use Value: 101,261 logic cells enable real-time beamforming logic with sub-microsecond latency constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-N3FG676I | Higher logic density (147,443 cells), larger FG676 package, same -3 speed grade and industrial temp | Supports more complex control algorithms and additional peripheral interfaces | Select when design requires >100K logic cells or extra I/O beyond 220 pins |
| XC7S100-2FGGA676I | Artix-7 family successor with 101K logic cells, 28 nm process, higher DSP slice count, and lower static power | Enables migration path with improved performance-per-watt and integrated PCIe Gen2 endpoint | Choose for new designs requiring longer product lifecycle, enhanced security features, or native PCIe connectivity |
Compared with XC6SLX100-N3FG484I, XC6SLX150-N3FG676I offers scalable logic capacity within the same architecture, while XC7S100-2FGGA676I delivers architectural evolution with process node advantage and expanded interface integration-both require PCB redesign due to different packages and pinouts.
Availability
XC6SLX100-N3FG484I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controllers, and medical imaging subsystems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100-N3FG484I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power programmable logic with industrial-grade reliability and broad I/O flexibility.
FAQ
What is the maximum operating frequency supported by XC6SLX100-N3FG484I?
The XC6SLX100-N3FG484I is rated at speed grade -3, meaning it meets timing specifications up to 500 MHz for internal logic paths and 333 MHz for I/O interfaces under industrial temperature conditions. Actual achievable frequency depends on design placement, routing, and clocking structure. The XC6SLX100-N3FG484I datasheet defines worst-case timing parameters for setup/hold and propagation delays across all operating corners.
Does XC6SLX100-N3FG484I support JTAG boundary-scan testing?
Yes, XC6SLX100-N3FG484I includes IEEE 1149.1-compliant JTAG TAP controller for boundary-scan testing, configuration, and debug access. All 220 I/O pins are accessible through the BSCAN primitive, and the XC6SLX100-N3FG484I supports INTEST, EXTEST, and SAMPLE instructions per JTAG standard.
What configuration memory options are compatible with XC6SLX100-N3FG484I?
XC6SLX100-N3FG484I supports Master Serial mode with standard SPI flash devices (e.g., Micron MT25QL, Macronix MX25L), Slave Serial mode with microcontroller-driven configuration, and JTAG-based programming. The XC6SLX100-N3FG484I requires no external configuration PROM for JTAG-only development but needs SPI flash for autonomous boot.
Is XC6SLX100-N3FG484I pin-compatible with other Spartan-6 devices in the FG484 package?
No, XC6SLX100-N3FG484I is not pin-compatible with other Spartan-6 devices in the FG484 package. While physical package dimensions match, I/O bank assignments, configuration pin locations, and power pin allocations differ between XC6SLX75, XC6SLX100, and XC6SLX150 variants. Each requires unique PCB layout per device-specific pinout documentation.
What thermal management considerations apply to XC6SLX100-N3FG484I in industrial applications?
XC6SLX100-N3FG484I features an exposed thermal pad in the FG484 package requiring solder connection to a dedicated PCB copper pour for effective heat dissipation. Under full utilization at 100°C ambient, thermal simulation shows junction temperature remains within spec when using ≥4-layer board with ≥2 oz copper and ≥6 thermal vias under the pad. The XC6SLX100-N3FG484I thermal characteristics are validated per JEDEC JESD51-2.
XC6SLX100-N3FG484I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 484-BBGA
- Packaging:
- Tray
- Product Status:
- Obsolete
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 326
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 484-FBGA (23x23)
XC6SLX100-N3FG484I FAQ
1.How can I place an order for XC6SLX100-N3FG484I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-N3FG484I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-N3FG484I reliable?
The price and inventory of XC6SLX100-N3FG484I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-N3FG484I is usually 5 days.
3.What payment methods are accepted for XC6SLX100-N3FG484I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-N3FG484I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-N3FG484I?
XC6SLX100-N3FG484I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-N3FG484I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-N3FG484I?
For technical support, including XC6SLX100-N3FG484I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-N3FG484I requirements.
6.How does Aetrix verify that XC6SLX100-N3FG484I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-N3FG484I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-N3FG484I meets industry standards.
7.What is the process for return or replacement of XC6SLX100-N3FG484I?
All XC6SLX100-N3FG484I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-N3FG484I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-N3FG484I part is unused and in its original packaging.
Return procedure for XC6SLX100-N3FG484I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100-N3FG484I Tags

-
ICE40LP384-SG32
Lattice Semiconductor Corporation

-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation

-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation

-
10M02DCV36C8G
Intel

-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation

-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation

-
ICE40LP1K-CM36
Lattice Semiconductor Corporation

-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation

-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation

-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…

