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AMD XC6SLX100-N3FGG676C
- Part No.:
- XC6SLX100-N3FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100-N3FGG676C.pdf
- Description:
- IC FPGA 480 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,812
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Product details
Overview
XC6SLX100-N3FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48A1 slices, and operates at -3 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Flip-Chip BGA (FFBG) and used in industrial video processing and reconfigurable I/O bridging applications.
For engineers reviewing the XC6SLX100-N3FGG676C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (516 user I/Os), differential signaling support (LVDS, TMDS), embedded memory depth, and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX100-N3FGG676C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated carry logic for arithmetic. It integrates dual-clock FIFOs, shift registers, and SRL16E primitives for efficient data path implementation.
Configuration is supported via Master Serial, Slave Serial, or JTAG modes using external SPI flash or processor-controlled interfaces. Configuration bitstream security includes optional AES encryption and HMAC authentication to protect intellectual property.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| Block RAM | 4,729 Kbits - supports large FIFOs, frame buffers, or lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - enables fixed-point multiply-accumulate operations at up to 250 MHz |
| User I/O Pins | 516 - provides high-density interface capability for parallel buses, camera sensors, or display controllers |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial temperature conditions |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with <15 mV ripple for stable operation |
Pinout & Package
Package: 676-pin Fine-Pitch Flip-Chip BGA (FFBG), 27×27 mm, 1.0 mm ball pitch, RoHS-compliant, lead-free.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| VCCO_0 | I/O bank power | Supplies 1.2–3.3 V to Bank 0 I/Os; must be decoupled with 100 nF + 10 µF per bank |
| VCCAUX | Auxiliary power | Provides 2.5 V to configuration logic, PLLs, and transceivers; noise-sensitive rail |
| GND | Ground reference | Multiple dedicated ground balls per quadrant; required for signal integrity and thermal dissipation |
| PROGRAM_B | Configuration control | Active-low asynchronous reset that clears configuration memory and initiates reload from boot source |
| CCLK | Configuration clock | Driven by external master during slave serial mode; max frequency 50 MHz |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PLLs | Four digital PLLs support jitter reduction, frequency synthesis, and phase alignment across multiple clock domains |
| Differential I/O Standards | Supports LVDS, RSDS, BLVDS, and TMDS at up to 1.0 Gbps per pair without external terminators |
| Embedded Memory Blocks | 18 Kb block RAMs configurable as true dual-port RAM, ROM, or shift register with byte-write enable |
| Configurable I/O Banks | Six independent I/O banks allow mixed-voltage operation (1.2 V to 3.3 V) on same device for multi-standard interfacing |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of HD camera feeds in automated optical inspection systems. IC Role / Device Role / Timing Role: FPGA acts as pixel-level pipeline accelerator with programmable ROI cropping and histogram equalization. Use Value: Enables sub-10 µs latency for defect detection loops without offloading to host CPU. | Use Scenario: Bridging between legacy CMOS image sensor interfaces and modern PCIe-based image acquisition cards. IC Role / Device Role / Timing Role: Configurable parallel-to-serial converter with embedded sync pattern insertion and error correction. Use Value: Eliminates need for discrete level-shifters and serializer ICs while supporting 12-bit 60 fps sensor streams. |
| Programmable Logic Controller I/O Expansion | Test Equipment Signal Generation |
Use Scenario: Adding isolated analog/digital I/O modules to modular PLC backplanes with field-upgradable firmware. IC Role / Device Role / Timing Role: Reconfigurable I/O controller managing 32-channel isolated ADC/DAC and relay drivers via SPI and GPIO. Use Value: Reduces bill-of-materials by consolidating interface logic and enabling runtime protocol switching (Modbus RTU vs. CANopen). | Use Scenario: Generating synchronized multi-channel stimulus waveforms in automated test equipment for semiconductor validation. IC Role / Device Role / Timing Role: High-precision waveform sequencer using block RAM-based pattern storage and DDR-capable I/O for 200+ MHz output clocks. Use Value: Achieves <100 ps channel-to-channel skew across 16 outputs without external delay calibration hardware. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150-N3FGG900C | 147,443 logic cells, 576 user I/Os, larger FFBG package (900-ball) | Higher gate count supports more complex video pipelines or dual-core soft processors | Select when XC6SLX100-N3FGG676C resource utilization exceeds 85% in place-and-route |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 210 I/Os, lower static power, no native LVDS at 1.0 Gbps | Better power efficiency but reduced I/O count and differential signaling bandwidth | Prefer for battery-powered or thermally constrained deployments where I/O density is secondary |
Compared with XC6SLX100-N3FGG676C, XC6SLX150-N3FGG900C offers scalable logic capacity in the same family, while XC7A100T-2CSG324C provides architectural improvements at the cost of I/O flexibility and legacy interface compatibility.
Availability
XC6SLX100-N3FGG676C is available at Aetrix Electronics and suitable for industrial automation, medical imaging interface, and test equipment requiring stable component supply throughout extended product lifecycles.
Supply support for XC6SLX100-N3FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD is a global semiconductor leader delivering adaptive computing solutions, including FPGAs, adaptive SoCs, and AI accelerators for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications requiring low-power programmable logic with robust I/O flexibility and long-term availability-especially in industrial and medical equipment.
FAQ
What is the maximum operating junction temperature for XC6SLX100-N3FGG676C?
The XC6SLX100-N3FGG676C has a maximum junction temperature of 100°C under industrial-grade (-40°C to +100°C ambient) operation. Thermal design must ensure case temperature remains ≤85°C with appropriate PCB copper pour and airflow. The XC6SLX100-N3FGG676C datasheet specifies derating curves for sustained operation above 85°C ambient.
Does XC6SLX100-N3FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX100-N3FGG676C fully supports IEEE 1149.1 JTAG boundary-scan for board-level interconnect testing and in-system programming. All 516 user I/Os and internal logic are accessible via TAP controller, and the XC6SLX100-N3FGG676C includes dedicated TDI, TDO, TMS, and TCK pins compliant with standard JTAG chain topologies.
Can XC6SLX100-N3FGG676C configure from a Micron MT25QL SPI flash device?
Yes, XC6SLX100-N3FGG676C supports master SPI configuration mode with Micron MT25QL series devices. The XC6SLX100-N3FGG676C requires specific configuration settings-including 3-byte addressing and mode-bit initialization-and verified timing margins per UG380. MT25QL01G and MT25QL02G are commonly deployed with XC6SLX100-N3FGG676C in production systems.
How many global clock networks does XC6SLX100-N3FGG676C provide?
XC6SLX100-N3FGG676C provides eight global clock networks (GCLK), each driven by dedicated BUFGCTRL buffers. These networks distribute low-skew clocks to all logic regions and I/O banks. The XC6SLX100-N3FGG676C also supports regional clocking via BUFIO/BUFR for I/O-specific timing domains such as source-synchronous DDR interfaces.
Is XC6SLX100-N3FGG676C compatible with Xilinx ISE Design Suite 14.7?
Yes, XC6SLX100-N3FGG676C is fully supported in Xilinx ISE Design Suite 14.7, including synthesis, place-and-route, timing analysis, and bitstream generation. The XC6SLX100-N3FGG676C device file is included in ISE 14.7 Service Pack 7, and no third-party tools or patches are required for full functional verification.
XC6SLX100-N3FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LX
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 480
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100-N3FGG676C FAQ
1.How can I place an order for XC6SLX100-N3FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100-N3FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100-N3FGG676C reliable?
The price and inventory of XC6SLX100-N3FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100-N3FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100-N3FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100-N3FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100-N3FGG676C?
XC6SLX100-N3FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100-N3FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100-N3FGG676C?
For technical support, including XC6SLX100-N3FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100-N3FGG676C requirements.
6.How does Aetrix verify that XC6SLX100-N3FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100-N3FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100-N3FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100-N3FGG676C?
All XC6SLX100-N3FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100-N3FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100-N3FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100-N3FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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