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AMD XC6SLX100T-2FG676C
- Part No.:
- XC6SLX100T-2FG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-2FG676C.pdf
- Description:
- IC FPGA 376 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:1,426
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Product details
Overview
XC6SLX100T-2FG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,261 logic cells, 180 DSP48A1 slices, 4.9 Mb of total block RAM, and operates at -2 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial video processing and embedded vision systems requiring deterministic latency and multi-channel I/O.
For engineers reviewing the XC6SLX100T-2FG676C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O count (480 user I/Os), LVDS support, configuration interface options (SPI/BPI), and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX100T-2FG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO™ standards including LVCMOS, LVTTL, LVDS, and SSTL, with programmable drive strength and slew rate control per bank.
Configuration is performed via Master SPI, Slave SPI, or BPI parallel modes using on-chip startup circuitry. The device includes internal oscillator, JTAG boundary-scan, and dual-boot capability through external flash memory mapping.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,261 - determines maximum combinational/sequential logic capacity for HDL synthesis |
| User I/O Pins | 480 - supports high-density peripheral interfacing across 16 I/O banks |
| Block RAM | 4.9 Mb - enables large on-chip data buffering for video frame stores or FIFOs |
| DSP Slices | 180 × DSP48A1 - provides fixed-point arithmetic acceleration for filtering and transforms |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths |
| Core Voltage | 1.2 V ±3% - requires tight-regulation DC-DC supply with <50 mV ripple |
| Operating Temp | 0°C to 85°C - validated for commercial temperature range operation |
Pinout & Package
XC6SLX100T-2FG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FBGA) package with 1.0 mm ball pitch, 27 mm × 27 mm body size, and thermal pad for enhanced heat dissipation. Pinout follows Xilinx SP600-676 package definition.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled with 100 nF + 4.7 µF near package |
| K1 | GCLK1 | Global clock input - low-skew routing to all CLBs and I/Os |
| M1 | PROGRAM_B | Active-low configuration reset - initiates reconfiguration from external flash |
| T1 | INIT_B | Open-drain status output - indicates configuration completion or error |
| W1 | CCLK | Configuration clock - driven externally during slave serial mode |
| Y1 | DONE | Open-drain configuration status - pulled high when bitstream load completes |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO™ Technology | Supports 18 I/O standards per bank with independent VCCO - enables mixed-voltage board design without level shifters |
| Dual-Boot Capability | Allows two independent bitstreams stored in external flash - enables field-upgradable firmware with fallback recovery |
| JTAG Boundary-Scan | IEEE 1149.1-compliant test access port - supports PCB interconnect testing and in-system programming |
| Embedded Memory | 4.9 Mb distributed + block RAM - eliminates need for external SRAM in many real-time buffer applications |
| DSP48A1 Slices | 180 dedicated 18×18 multiplier-accumulator units - delivers 90 GMAC/s peak throughput at 500 MHz |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of 4K@60fps camera sensor streams in automated optical inspection equipment. IC Role / Device Role / Timing Role: FPGA fabric performs pixel-level filtering, histogram equalization, and ROI extraction before sending compressed frames to host CPU. Use Value: 480 user I/Os enable direct connection to multiple CMOS sensors and DDR2 memory; -2 speed grade ensures sub-microsecond pipeline latency. | Use Scenario: Interfacing ultrasound transducer arrays with digital beamforming ASICs in portable diagnostic devices. IC Role / Device Role / Timing Role: XC6SLX100T-2FG676C acts as protocol bridge and timing controller between analog front-end and PCIe host interface. Use Value: LVDS I/O support handles high-speed echo data capture at 1.25 Gbps; embedded RAM buffers transient bursts during PCI enumeration. |
| Avionics Data Concentrator | Programmable Logic Controller (PLC) |
Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in flight control subsystems. IC Role / Device Role / Timing Role: Configurable logic implements deterministic time-triggered communication scheduling and fault monitoring logic. Use Value: Dual-boot capability allows safe firmware updates mid-flight; JTAG enables in-field diagnostics without disassembly. | Use Scenario: Replacing fixed-function ASICs in modular I/O modules for factory automation controllers. IC Role / Device Role / Timing Role: XC6SLX100T-2FG676C implements custom motion control algorithms and EtherCAT slave stack in hardware. Use Value: 101,261 logic cells accommodate complex state machines and real-time Ethernet MAC; 16 I/O banks simplify wiring to diverse sensor/actuator types. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic implementation applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FG676C | 147,443 logic cells, 220 DSP48A1 slices, same package and pinout | Higher gate count supports larger designs with more concurrent peripherals | Choose when additional logic resources or DSP slices are required without changing PCB layout |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 240 DSP48E1 slices, smaller 324-pin CSP package | Lacks 480 I/Os and multi-bank LVDS support; targets cost-sensitive, lower-I/O density designs | Prefer for new designs where footprint reduction and lower static power outweigh I/O flexibility needs |
Compared with XC6SLX100T-2FG676C, the XC6SLX150T-2FG676C offers direct scalability within identical thermal and mechanical constraints, while the XC7A100T-2CSG324C trades I/O bandwidth and bank flexibility for reduced board area and dynamic power - making it suitable only where full Spartan-6 I/O capability is unused.
Availability
XC6SLX100T-2FG676C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-term lifecycle support.
Supply support for XC6SLX100T-2FG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous compute acceleration.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding low-power logic implementation, embedded processing, and flexible I/O interfacing - particularly in industrial, automotive, and communications infrastructure.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-2FG676C?
The XC6SLX100T-2FG676C supports I/O voltages from 1.2 V to 3.3 V across its 16 selectable I/O banks. Each bank has independent VCCO supply, enabling simultaneous use of LVCMOS33, LVDS25, and SSTL18 standards. VCCO must be set per bank according to selected I/O standard and cannot exceed device absolute maximum ratings.
Does XC6SLX100T-2FG676C support JTAG boundary-scan testing?
Yes, XC6SLX100T-2FG676C fully complies with IEEE 1149.1 and includes dedicated TDI, TDO, TMS, TCK, and TRST pins. It supports instruction register scan, bypass mode, and IDCODE readback. This enables PCB interconnect verification, in-system programming, and debug access during development and manufacturing test phases.
What configuration modes are supported by XC6SLX100T-2FG676C?
XC6SLX100T-2FG676C supports Master SPI, Slave SPI, Slave SelectMAP (8-/16-bit), and Boundary Scan (JTAG) configuration modes. External flash memory (e.g., Micron N25Q series) is typically used for Master SPI boot. Configuration bitstream can be loaded via PC USB-JTAG cable or embedded processor running Xilinx iMPACT or Vivado Hardware Manager.
Is XC6SLX100T-2FG676C qualified for extended temperature operation?
No, XC6SLX100T-2FG676C is specified for commercial temperature range only (0°C to +85°C ambient). It is not tested or guaranteed for operation beyond this range. For extended temperature applications, consider the XC6SLX100T-2FG676I variant, which is rated from –40°C to +100°C and shares identical pinout and logic resources.
Can XC6SLX100T-2FG676C implement a PCIe endpoint interface?
No, XC6SLX100T-2FG676C does not include native PCI Express hard IP blocks. While soft-core PCIe solutions exist, they consume significant logic resources and do not meet Gen1 x1 timing guarantees without extensive engineering effort. For PCIe integration, AMD recommends Artix-7 or Kintex-7 families with integrated GT transceivers and PCIe hard IP.
XC6SLX100T-2FG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-2FG676C FAQ
1.How can I place an order for XC6SLX100T-2FG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FG676C reliable?
The price and inventory of XC6SLX100T-2FG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FG676C?
XC6SLX100T-2FG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FG676C?
For technical support, including XC6SLX100T-2FG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FG676C requirements.
6.How does Aetrix verify that XC6SLX100T-2FG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FG676C?
All XC6SLX100T-2FG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FG676C part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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