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AMD XC6SLX100T-2FG676I
- Part No.:
- XC6SLX100T-2FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-2FG676I.pdf
- Description:
- IC FPGA 376 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,550
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Product details
Overview
XC6SLX100T-2FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control systems requiring deterministic I/O timing and partial reconfiguration support.
For engineers reviewing the XC6SLX100T-2FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), LVDS/PCIe-compatible transceivers, embedded memory depth, and industrial-grade thermal performance.
Technical Context
The XC6SLX100T-2FG676I implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It supports SelectIO standards including LVCMOS, LVTTL, LVDS, and SSTL, with programmable slew rate and drive strength per bank.
This device integrates dual 10-bit ADCs for on-chip monitoring, supports JTAG and SPI configuration modes, and enables partial reconfiguration via ICAP interface - critical for dynamic function swapping in real-time industrial controllers without full system reset.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 480 - supports high-density peripheral interfacing with bank-wise voltage isolation |
| Block RAM | 4,729 Kbits - enables local data buffering, FIFOs, and small lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - delivers 18×25-bit multiply-accumulate operations per slice for motor control algorithms |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz internal clocking with worst-case industrial temperature derating |
| Operating Temp | –40°C to +100°C - validated for deployment in enclosed industrial enclosures without active cooling |
| Configuration Mode | Master SPI / JTAG - allows field firmware updates and boundary-scan testing during production |
Pinout & Package
XC6SLX100T-2FG676I is housed in a 676-ball Fine-Pitch BGA (FG676) package with 1.0 mm ball pitch, 27×27 array, and thermal pad. Package dimensions are 27 mm × 27 mm × 1.55 mm (height).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Drives synchronous loading of bitstream from external SPI flash during power-up |
| DIN | Serial Data Input | Receives configuration data from master SPI device; supports dual/quad SPI modes |
| PROGRAM_B | Global Reset | Active-low signal that clears configuration memory and initiates reconfiguration sequence |
| INIT_B | Configuration Status | Open-drain output indicating successful CRC check or configuration error |
| Done | Configuration Completion | Signals valid operation after bitstream load; must be pulled high externally to release I/Os |
| M0–M2 | Mode Selection | Three-pin encoding selects boot mode: SPI, JTAG, Master BPI, or Slave Parallel |
Key Features
| Feature | Design Value |
|---|---|
| Partial Reconfiguration Support | Enables runtime swap of logic modules (e.g., PID vs. FOC motor control blocks) without system interruption |
| Dual 10-bit ADCs | Monitors on-board temperature and VCCINT voltage for adaptive thermal throttling and supply health reporting |
| SelectIO Technology | Per-bank I/O voltage support (1.2V–3.3V) allows mixed-voltage interfacing with legacy and modern peripherals |
| Embedded DSP Blocks | Hardened 18×25-bit multipliers with pre-adders accelerate real-time current/voltage loop calculations in servo drives |
| ISE Design Suite Compatibility | Full toolchain support through Xilinx ISE 14.7 - no migration required for legacy industrial IP cores |
Applications
| Industrial Motor Drives | Programmable Logic Controllers (PLCs) |
|---|---|
Use Scenario: Closed-loop field-oriented control (FOC) of 3-phase AC induction motors in CNC machines. IC Role / Device Role / Timing Role: Real-time execution of PWM generation, current sampling, and vector math with sub-microsecond latency. Use Value: 220 DSP48A1 slices enable simultaneous dual-axis FOC computation; 480 I/Os route encoder feedback, analog sensor inputs, and isolated gate-driver signals. | Use Scenario: Modular I/O expansion and safety-critical logic sequencing in DIN-rail mounted PLC backplanes. IC Role / Device Role / Timing Role: Deterministic state-machine execution with cycle-accurate I/O update synchronized to 1 ms scan cycles. Use Value: Industrial temperature rating ensures stable operation in uncooled cabinets; partial reconfiguration allows hot-swapping of I/O module firmware. |
| Automated Test Equipment (ATE) | Avionics Data Acquisition Units |
Use Scenario: High-speed digital pattern generation and response capture for semiconductor wafer probing. IC Role / Device Role / Timing Role: Precise timing engine for parallel test vectors with jitter < 50 ps RMS across 480 pins. Use Value: -2 speed grade guarantees setup/hold timing margins at 200 MHz DDR I/O; block RAM buffers 128 Mbit test patterns on-chip. | Use Scenario: ARINC 429 and discrete I/O conditioning in airborne flight control sensor interfaces. IC Role / Device Role / Timing Role: Isolated signal translation and protocol framing with DO-254 compliance traceability. Use Value: Dual ADCs monitor power rail integrity; SelectIO banks support 28V discrete input thresholds and 5V ARINC output drivers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XCVU9P-2FLGB2104I | UltraScale architecture, 2,586K logic cells, 48.8 Gbps GTY transceivers, no integrated ADC | Targets high-bandwidth radar processing; lacks on-chip ADC for analog monitoring | Choose when migrating to PCIe Gen4 or 10G Ethernet; not drop-in due to toolchain and pinout incompatibility |
| XC7K160T-2FFG676I | Kintex-7 architecture, 162,240 logic cells, 8.4 Mb block RAM, -2 speed grade, same FG676 package footprint | Higher logic density and memory bandwidth; requires Vivado toolflow and new timing constraints | Consider for designs needing >100K LUTs with identical board layout; requires full re-synthesis and validation |
Compared with XC6SLX100T-2FG676I, the XC7K160T-2FFG676I offers higher resource count and memory but demands toolchain migration, while the XCVU9P-2FLGB2104I delivers extreme throughput at the cost of analog monitoring capability and legacy IP compatibility.
Availability
XC6SLX100T-2FG676I is available at Aetrix Electronics and suitable for industrial motor drives, programmable logic controllers (PLCs), and automated test equipment (ATE) requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-2FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and maintains the Spartan-6 product family for long-lifecycle industrial applications. The company specializes in adaptive computing platforms for embedded, data center, and aerospace markets.
The Spartan-6 family was designed for cost-sensitive, power-efficient, high-reliability control and interface applications - especially where long-term availability, industrial temperature tolerance, and mature toolchain stability are mandatory.
FAQ
What is the maximum supported I/O standard for XC6SLX100T-2FG676I?
XC6SLX100T-2FG676I supports LVDS, LVPECL, RSDS, BLVDS, and differential SSTL-18 I/O standards with programmable termination. Single-ended standards include LVCMOS, LVTTL, and HSTL Class I/II. Each I/O bank operates independently at voltages from 1.2V to 3.3V, enabling mixed-voltage system integration without level shifters.
Does XC6SLX100T-2FG676I support partial reconfiguration?
Yes, XC6SLX100T-2FG676I supports partial reconfiguration via the Internal Configuration Access Port (ICAP). This allows dynamic replacement of logic modules - such as switching between different motor control algorithms - while the rest of the design remains operational, reducing downtime in industrial automation systems using XC6SLX100T-2FG676I.
What configuration modes does XC6SLX100T-2FG676I support?
XC6SLX100T-2FG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for standalone operation with external flash memory, while JTAG is used for debugging and programming during development and field service of systems based on XC6SLX100T-2FG676I.
Is XC6SLX100T-2FG676I qualified for automotive applications?
No, XC6SLX100T-2FG676I is rated for industrial temperature range (–40°C to +100°C) and is not AEC-Q100 qualified. It is intended for industrial automation, test equipment, and avionics where environmental stress exceeds commercial-grade components but does not meet full automotive qualification requirements for XC6SLX100T-2FG676I.
What tools are required to develop for XC6SLX100T-2FG676I?
XC6SLX100T-2FG676I requires Xilinx ISE Design Suite 14.7 - the final and fully supported version for Spartan-6 devices. Vivado does not support this family. Projects must use ISE for synthesis, implementation, and bitstream generation; third-party tools like Sigasi or ModelSim integrate via ISE project flow for verification of XC6SLX100T-2FG676I designs.
XC6SLX100T-2FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-2FG676I FAQ
1.How can I place an order for XC6SLX100T-2FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FG676I reliable?
The price and inventory of XC6SLX100T-2FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FG676I?
XC6SLX100T-2FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FG676I?
For technical support, including XC6SLX100T-2FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FG676I requirements.
6.How does Aetrix verify that XC6SLX100T-2FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FG676I?
All XC6SLX100T-2FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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