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AMD XC6SLX100T-2FG900C
- Part No.:
- XC6SLX100T-2FG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-2FG900C.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,190
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Product details
Overview
XC6SLX100T-2FG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 480 I/O pins, and a -2 speed grade operating at up to 500 MHz system clock frequency. It integrates block RAM, DSP48A1 slices, and SelectIO technology for high-speed interface support in industrial control and communications infrastructure.
For engineers reviewing the XC6SLX100T-2FG900C datasheet, pinout, applications, or equivalent options, key selection criteria include I/O voltage flexibility (1.2 V to 3.3 V), embedded memory depth (4,718,592 bits), and support for DDR2/DDR3 SDRAM interfaces with dedicated memory controllers.
Technical Context
The XC6SLX100T-2FG900C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high fan-out signals and clock networks. It includes 208 DSP48A1 slices for arithmetic-intensive tasks and supports multi-gigabit transceivers only in higher-density LX150T/LX160T variants-not in this LX100T device.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled loading. The device supports partial reconfiguration and uses 1.2 V core voltage with independent bank-level I/O voltage assignment (VCCO) per SelectIO bank.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total programmable resources for combinatorial and sequential logic implementation |
| I/O Pins | 480 - user-configurable bidirectional pins supporting multiple standards and voltage levels |
| Block RAM | 4,718,592 bits - distributed across 236 x 18-kbit blocks for data buffering and FIFOs |
| DSP Slices | 208 × DSP48A1 - fixed-point multiply-accumulate units with 25 × 18-bit inputs |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Core Voltage | 1.2 V ±3% - required supply for internal logic and interconnect, with tight regulation tolerance |
| Config Interface | Master SPI / Slave Serial / JTAG - determines boot source and programming method flexibility |
Pinout & Package
XC6SLX100T-2FG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Pin assignments are defined per bank for voltage and standard compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| CCLK | Configuration Clock | Input clock driving serial configuration data load from external PROM or processor |
| DIN | Configuration Data In | Serial input for Master SPI mode; connects to external configuration memory output |
| PROGRAM_B | Global Reset | Active-low asynchronous reset that clears configuration memory and initiates reload sequence |
| INIT_B | Configuration Status | Open-drain output indicating successful bitstream load completion or error condition |
| Done | Configuration Completion | Output signal asserted high when configuration is complete and device is operational |
| VCCO_0 | I/O Bank Supply | Provides selectable I/O voltage (1.2–3.3 V) for Bank 0 pins, enabling mixed-voltage interfacing |
Key Features
| Feature | Design Value |
|---|---|
| SelectIO Technology | Supports LVCMOS, LVTTL, SSTL, HSTL, and differential standards (LVDS, TMDS) within same bank |
| Embedded Memory | 236 × 18-kbit block RAMs enable dual-port RAM, ROM, and FIFO implementations without external memory |
| DSP48A1 Slices | 208 dedicated arithmetic units deliver 25 × 18-bit multiplication with pipeline registers for high-throughput filtering |
| Partial Reconfiguration | Enables dynamic logic module swapping during operation-critical for adaptive communication protocols |
| Multi-Bank I/O | 12 independent I/O banks allow simultaneous operation at different voltage levels and signaling standards |
Applications
| Industrial Motion Control | Communications Baseband Processing |
|---|---|
Use Scenario: Real-time servo loop execution and encoder interface aggregation in CNC machines and robotic arms. IC Role / Device Role / Timing Role: FPGA acts as deterministic real-time controller with sub-microsecond I/O response and synchronized PWM generation. Use Value: 480 I/O pins enable direct connection to multiple encoders, analog inputs, and isolated digital outputs without glue logic. | Use Scenario: Protocol stack offload and packet classification in LTE small-cell baseband units. IC Role / Device Role / Timing Role: Configurable logic handles layer-2 MAC processing, CRC computation, and time-sensitive scheduling arbitration. Use Value: 208 DSP48A1 slices accelerate convolutional encoding and channel estimation algorithms at 100+ Mbps throughput. |
| Video Surveillance Encoder | Test & Measurement Instrumentation |
Use Scenario: Multi-channel HD video preprocessing, motion detection, and H.264/H.265 encode pipeline control. IC Role / Device Role / Timing Role: FPGA manages parallel pixel streams, frame buffering, and real-time compression engine handshaking. Use Value: 4.7 Mbits of block RAM provide sufficient line buffer depth for 4K@30fps YUV422 processing without external DRAM. | Use Scenario: High-precision waveform generation and acquisition synchronization in modular PXI chassis systems. IC Role / Device Role / Timing Role: FPGA delivers deterministic trigger distribution, sample clock alignment, and digital pattern generation. Use Value: -2 speed grade ensures <1 ns jitter on 200 MHz sampling clocks, meeting Class A instrument timing accuracy requirements. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FG900C | 147,443 logic cells, 256 DSP slices, identical package and pinout | Higher gate count supports larger protocol stacks and more concurrent channels | Choose when design requires >100k logic cells or additional DSP resources without PCB change |
| XC7S100-2FTG900C | Artix-7 architecture, 101,440 logic cells, 2.5x lower static power, no native DDR3 controller | Lacks integrated DDR3 PHY but adds PCIe Gen1 endpoint capability and improved DSP efficiency | Prefer for new designs needing lower power or PCIe integration; not drop-in due to different configuration and I/O electrical behavior |
Compared with XC6SLX100T-2FG900C, the XC6SLX150T-2FG900C offers scalable logic density in same footprint, while XC7S100-2FTG900C introduces architectural improvements at cost of migration effort-both require functional validation but address distinct roadmap needs.
Availability
XC6SLX100T-2FG900C is available at Aetrix Electronics and suitable for industrial automation, wired communications infrastructure, and video processing systems requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-2FG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, MPSoCs, and ACAPs for data center, AI, and embedded markets.
The Spartan-6 family-including XC6SLX100T-2FG900C-was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and broad I/O flexibility in industrial and communications equipment.
FAQ
What is the maximum supported I/O voltage for XC6SLX100T-2FG900C?
The XC6SLX100T-2FG900C supports I/O voltages from 1.2 V to 3.3 V per bank, with each of its 12 SelectIO banks independently configurable. This allows mixed-voltage operation-for example, interfacing with both 1.8 V sensors and 3.3 V legacy peripherals simultaneously-without level-shifting components. VCCO must be set before configuration and remain stable during operation.
Does XC6SLX100T-2FG900C include built-in memory controllers for DDR3 SDRAM?
Yes, XC6SLX100T-2FG900C includes hard-wired DDR2/DDR3 memory controllers supporting data rates up to 800 Mbps. These controllers manage command scheduling, refresh, and calibration autonomously, reducing FPGA resource usage. However, they require external termination resistors and strict PCB layout rules for signal integrity-details are specified in UG388 and DS162.
Can XC6SLX100T-2FG900C be configured via JTAG only, or are other methods supported?
XC6SLX100T-2FG900C supports three primary configuration modes: JTAG (for debugging and programming), Master SPI (for autonomous boot from serial flash), and Slave Serial (for processor-controlled loading). JTAG alone cannot sustain full configuration in production-Master SPI is typical for field-deployed systems, while JTAG remains essential for development and boundary-scan testing.
Is partial reconfiguration supported on XC6SLX100T-2FG900C, and what tools are required?
Yes, partial reconfiguration is fully supported on XC6SLX100T-2FG900C using Xilinx ISE Design Suite 14.7 with PlanAhead tools. It enables dynamic replacement of logic modules without resetting the entire device-ideal for protocol adaptation or feature-on-demand. Implementation requires careful floorplanning, encrypted bitstreams, and runtime host control via ICAP interface.
What thermal considerations apply to XC6SLX100T-2FG900C in continuous operation?
XC6SLX100T-2FG900C has a maximum junction temperature of 100°C and requires thermal management based on actual power dissipation-typically 1.8–3.2 W depending on utilization and I/O activity. The 900-pin FBGA package demands 6-layer PCB with thermal vias under the die and copper pour on inner layers. Thermal data is provided in Xilinx AR# 50217 and DS162 Table 32.
XC6SLX100T-2FG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-2FG900C FAQ
1.How can I place an order for XC6SLX100T-2FG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FG900C reliable?
The price and inventory of XC6SLX100T-2FG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FG900C?
XC6SLX100T-2FG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FG900C?
For technical support, including XC6SLX100T-2FG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FG900C requirements.
6.How does Aetrix verify that XC6SLX100T-2FG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FG900C?
All XC6SLX100T-2FG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FG900C part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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