My Inquiry
My Account
AMD XC6SLX100T-2FG900I
- Part No.:
- XC6SLX100T-2FG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-2FG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,906
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
XC6SLX100T-2FG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 240 DSP48A1 slices, and operates at -2 speed grade with industrial temperature range (-40°C to +100°C). It is packaged in a 900-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control, embedded vision preprocessing, and reconfigurable I/O bridging.
For engineers reviewing the XC6SLX100T-2FG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (544 user I/Os), differential signaling support (LVDS, SSTL), embedded memory depth, and industrial-grade thermal performance.
Technical Context
The XC6SLX100T-2FG900I implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed clock networks and global reset distribution. It integrates SelectIO technology supporting single-ended and differential standards including LVCMOS, LVDS, and SSTL across 544 user-configurable I/O pins.
It includes 180 total block RAMs (each 18 Kbits), 240 DSP48A1 slices for arithmetic-intensive tasks, and supports configuration via SPIx4, BPI, or JTAG. The -2 speed grade guarantees timing closure up to 500 MHz for critical paths under industrial temperature conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 544 - supports high-channel-count interfaces such as parallel camera sensors or multi-lane ADC/DAC buses |
| Block RAM | 180 × 18 Kbit - provides 3.24 Mbit on-chip memory for frame buffers, FIFOs, or lookup tables |
| DSP Slices | 240 × DSP48A1 - enables real-time filtering, FFT, or motor control algorithms without external processors |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock in industrial temperature range (-40°C to +100°C) |
| Package | 900-pin FBGA (FG900) - 31×31 mm body, 1.0 mm ball pitch, RoHS-compliant, requires controlled-impedance PCB stackup |
| Configuration Mode | Master SPIx4, Slave SPI, BPI, JTAG - enables flexible boot sources and field updates |
Pinout & Package
The XC6SLX100T-2FG900I is housed in a 900-ball Fine-Pitch Ball Grid Array (FG900) package with 31×31 array, 1.0 mm ball pitch, and thermal pad. Pin functions are organized into I/O banks (0–4), configuration banks (CONFIG), and dedicated clock/dedicated pins (e.g., GCLK, MGTCLK).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| GCLK[0–7] | Global Clock Input | Dedicated low-skew routing to all clock regions; supports differential LVDS or single-ended LVCMOS |
| IO_L[xx]_P/N | Configurable I/O Pair | Differential pair supporting LVDS, TMDS, or RSDS; each bank has independent VCCO and VREF |
| M0–M2 | Mode Configuration | Defines boot source (SPI/BPI/JTAG) at power-up; pulled via external resistors |
| PROGRAM_B | Active-Low Reset | Asynchronous global reset initiating configuration reload; driven low to reinitialize FPGA |
| CCLK | Configuration Clock | Output during master SPI mode; drives external PROM or flash memory clock input |
Key Features
| Feature | Design Value |
|---|---|
| Integrated PCI Express Endpoint | Supports x1 Gen1 PCIe interface with hard IP block-enables direct host CPU communication without soft-core overhead |
| SelectIO Technology | Per-bank voltage support (1.2V–3.3V) and programmable slew rate-allows mixed-voltage I/O interfacing on single device |
| Dedicated Digital Clock Manager (DCM) | Provides jitter-reduced clock synthesis, phase shifting, and frequency multiplication-eliminates need for external clock ICs |
| Embedded Block RAM | 18 Kbit dual-port RAM per block-supports simultaneous read/write for buffering and data coalescing |
| MultiBoot Configuration | Supports up to 4 independent bitstreams stored in external flash-enables field-upgradable firmware and fail-safe recovery |
Applications
| Industrial Motor Control | Embedded Vision Preprocessing |
|---|---|
Use Scenario: Real-time field-oriented control (FOC) of 3-phase PMSM motors with current sensing and PWM generation. IC Role / Device Role / Timing Role: FPGA acts as deterministic servo controller with sub-microsecond loop timing and synchronized ADC capture. Use Value: 240 DSP48A1 slices execute FOC math in hardware; 544 I/Os route encoder feedback, gate drivers, and analog sensor inputs. | Use Scenario: High-speed image acquisition from CMOS sensors followed by Bayer demosaicing and edge detection. IC Role / Device Role / Timing Role: FPGA serves as pixel pipeline accelerator-accepts parallel LVDS video streams and applies real-time spatial filters. Use Value: Block RAM buffers full frames; SelectIO supports 720p@60fps LVDS input; logic cells implement custom convolution kernels. |
| Reconfigurable I/O Bridging | Communications Protocol Translation |
Use Scenario: Interfacing legacy parallel bus peripherals (e.g., ISA, PC/104) to modern microcontrollers via SPI or UART. IC Role / Device Role / Timing Role: FPGA functions as protocol-aware glue logic-translating timing, handshaking, and data width between mismatched buses. Use Value: 101,280 logic cells implement custom state machines; per-bank I/O voltage flexibility accommodates 3.3V and 5V peripherals simultaneously. | Use Scenario: Converting Modbus RTU over RS-485 to MQTT over Ethernet in industrial gateways. IC Role / Device Role / Timing Role: FPGA handles physical-layer framing, CRC calculation, and packet serialization/deserialization. Use Value: Dedicated DCMs generate precise baud clocks; embedded RAM stores protocol state tables; logic cells parse and remap register maps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based reconfigurable logic applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FG900I | 147,443 logic cells, 220 block RAMs, same FG900 package and -2 speed grade | Higher logic density supports larger state machines or additional protocol stacks | Choose when design requires >100K logic cells or >200 block RAMs without changing PCB layout |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 285 block RAMs, 324-pin CSP package | Lower I/O count (210), no native PCIe, but higher DSP density and improved power efficiency | Prefer for new designs prioritizing lower static power and integrated transceivers over legacy Spartan-6 toolchain compatibility |
Compared with XC6SLX100T-2FG900I, the XC6SLX150T-2FG900I offers scalable logic headroom within identical packaging and timing, while the XC7A100T-2CSG324I trades I/O and PCIe support for architectural improvements and reduced power-making it suitable for greenfield designs where migration from Spartan-6 is feasible.
Availability
XC6SLX100T-2FG900I is available at Aetrix Electronics and suitable for industrial motor control, embedded vision preprocessing, and reconfigurable I/O bridging requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-2FG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, ACAPs, and software tools for heterogeneous acceleration.
The Spartan-6 family-including XC6SLX100T-2FG900I-was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and long-term availability in industrial and automotive environments.
FAQ
What is the maximum operating frequency supported by the XC6SLX100T-2FG900I?
The XC6SLX100T-2FG900I is rated at speed grade -2, guaranteeing timing closure for critical paths up to 500 MHz under industrial temperature conditions (-40°C to +100°C). Actual achievable frequency depends on design complexity, routing, and I/O standard selection, but internal clock networks and DCMs support stable operation at this rate with proper PCB layout.
Does the XC6SLX100T-2FG900I support PCI Express Gen1 x1 endpoint functionality?
Yes, the XC6SLX100T-2FG900I includes a hard PCIe Gen1 x1 endpoint block compliant with PCI Express Base Specification v1.1. This enables direct connection to host systems without soft-core implementation, reducing latency and resource usage compared to logic-based PCIe solutions.
What configuration modes are supported by the XC6SLX100T-2FG900I?
The XC6SLX100T-2FG900I supports multiple configuration modes: Master SPIx4, Slave SPI, Slave Parallel (BPI), and JTAG. Mode selection is determined by M0–M2 pin states at power-up. External flash devices (e.g., Micron MT28EW) are commonly used for SPI or BPI boot storage.
How many differential I/O pairs does the XC6SLX100T-2FG900I provide?
The XC6SLX100T-2FG900I provides up to 272 differential I/O pairs (544 total user I/Os), distributed across four I/O banks. Each pair supports LVDS, RSDS, or TMDS signaling with programmable termination and adjustable drive strength, enabling high-speed serial links and camera interfaces.
Is the XC6SLX100T-2FG900I qualified for industrial temperature operation?
Yes, the XC6SLX100T-2FG900I carries the 'I' suffix denoting industrial temperature grade (-40°C to +100°C). It undergoes extended burn-in and characterization across this range, making it suitable for deployment in factory automation, outdoor infrastructure, and motor drive enclosures without derating.
XC6SLX100T-2FG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-2FG900I FAQ
1.How can I place an order for XC6SLX100T-2FG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FG900I reliable?
The price and inventory of XC6SLX100T-2FG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FG900I?
XC6SLX100T-2FG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FG900I?
For technical support, including XC6SLX100T-2FG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FG900I requirements.
6.How does Aetrix verify that XC6SLX100T-2FG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FG900I?
All XC6SLX100T-2FG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
XC6SLX100T-2FG900I Tags
-
ICE40LP384-SG32
Lattice Semiconductor Corporation
-
ICE40UL640-CM36AI
Lattice Semiconductor Corporation
-
ICE40UL1K-CM36AI
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG32C
Lattice Semiconductor Corporation
-
10M02DCV36C8G
Intel
-
LCMXO2-256HC-4SG32I
Lattice Semiconductor Corporation
-
ICE5LP1K-SG48ITR
Lattice Semiconductor Corporation
-
ICE40LP1K-CM36
Lattice Semiconductor Corporation
-
LCMXO2-256ZE-1SG32I
Lattice Semiconductor Corporation
-
LCMXO2-256HC-4SG48I
Lattice Semiconductor Corporation
-
ICE40LP1K-CM81
Lattice Semiconductor Corporation
-
T20W80I4
Efinix, Inc.
Tech Hub
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
