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AMD XC6SLX100T-2FGG676C
- Part No.:
- XC6SLX100T-2FGG676C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-2FGG676C.pdf
- Description:
- IC FPGA 376 I/O 676FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,947
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Product details
Overview
XC6SLX100T-2FGG676C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,795 Kbits of block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with 1.2 V core voltage. It is packaged in a 676-pin Fine-Pitch Ball Grid Array (FBGA) with 0.8 mm pitch and supports I/O standards including LVCMOS, LVTTL, SSTL, and HSTL. This device is used in industrial control systems requiring deterministic real-time processing and reconfigurable logic.
For engineers reviewing the XC6SLX100T-2FGG676C datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), embedded memory capacity, DSP resource availability, and thermal performance in convection-cooled enclosures.
Technical Context
The XC6SLX100T-2FGG676C implements a hierarchical FPGA architecture with configurable logic blocks (CLBs), distributed RAM, shift registers, and dedicated carry logic. It integrates six clock management tiles (CMTs), each containing a DCM and PLL for clock synthesis, phase alignment, and jitter reduction across multiple domains.
This device supports SelectIO technology with programmable drive strength (2–24 mA), slew rate control, and on-chip termination (10–150 Ω). Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - total available LUT-based combinational + sequential logic resources |
| Block RAM | 4,795 Kbits - distributed across 182 dual-port 18-Kbit RAM blocks for data buffering and FIFO implementation |
| DSP Slices | 220 × DSP48A1 - support 18×18 signed multiplication, 48-bit accumulation, and cascading for FIR filters |
| User I/O Pins | 480 - compatible with LVCMOS/LVTTL (1.2–3.3 V), SSTL/HSTL (1.5–1.8 V), and differential standards |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths under worst-case conditions |
| Core Voltage | 1.2 V ±3% - requires tight regulation; impacts dynamic power and thermal dissipation profile |
| Package | FGG676 - 676-ball fine-pitch BGA, 27×27 mm body, 0.8 mm ball pitch, RoHS-compliant |
Pinout & Package
XC6SLX100T-2FGG676C is housed in a 676-ball Fine-Pitch Ball Grid Array (FGG676) package with 27×27 array, 0.8 mm ball pitch, and thermal pad on underside for enhanced heat transfer. Pinout follows Xilinx Spartan-6 FPGA Pinout Guide (UG386 v1.11), with dedicated configuration, clock, JTAG, and I/O banks grouped by voltage and signaling standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 supply voltage (1.2–3.3 V); must be decoupled locally |
| P2 | PROGRAM_B | Active-low asynchronous configuration reset; pulled high during normal operation |
| T1 | CCLK | Configuration clock input; driven externally during Master SPI mode |
| R1 | DONE | Open-drain status signal indicating successful configuration completion |
| A1 | VCCINT | 1.2 V core supply; requires low-noise, high-current regulation and multi-stage filtering |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Clock Management | 6 CMTs (each with DCM + PLL) enable multi-domain clocking, deskew, and frequency synthesis without external ICs |
| SelectIO Technology | Programmable I/O standards, drive strength, and on-die termination reduce board-level components and routing complexity |
| Partial Reconfiguration Support | Allows dynamic logic module swapping in-system without full device reset-critical for adaptive communication protocols |
| ISE Design Suite Compatibility | Full toolchain support through Xilinx ISE 14.7 for synthesis, place-and-route, and bitstream generation |
| Low Static Power | Typical standby current < 50 µA at 85°C - enables energy-sensitive industrial monitoring nodes |
Applications
| Industrial Motor Control | Automated Test Equipment |
|---|---|
Use Scenario: Real-time PWM generation, encoder interface, and safety logic for servo drives in factory automation lines. IC Role / Device Role / Timing Role: Configurable logic fabric executes closed-loop control algorithms with sub-microsecond latency and deterministic timing. Use Value: Enables integration of motion control, diagnostics, and fieldbus interface (e.g., CANopen, EtherCAT) into single FPGA without ASIC redesign. | Use Scenario: High-speed digital pattern generation and acquisition in semiconductor wafer testers and PCB functional testers. IC Role / Device Role / Timing Role: Serves as protocol-aware digital I/O engine with precise timing control for stimulus/response validation. Use Value: Supports parallel 100+ channel test vectors at 100+ MHz with per-pin programmable voltage and timing margins. |
| Medical Imaging Interface | Avionics Data Concentrator |
Use Scenario: Interfacing ultrasound transducer arrays and ADC/DAC subsystems in portable imaging devices. IC Role / Device Role / Timing Role: Bridges high-speed serial sensor data (LVDS/SLVS) to ARM-based processing subsystems with frame-synchronized buffering. Use Value: Provides 4,795 Kbits of on-chip RAM for real-time image line buffering and pixel-level preprocessing before host transfer. | Use Scenario: Aggregating ARINC 429, MIL-STD-1553, and discrete I/O signals in regional aircraft flight control computers. IC Role / Device Role / Timing Role: Implements deterministic time-triggered communication stacks and hardware-level fault isolation between bus domains. Use Value: Meets DO-254 Level A design assurance requirements with traceable RTL and verified timing constraints. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based logic and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG676C | 147,443 logic cells, 5,888 Kbits BRAM, 328 DSP48A1 slices - higher density and resources | Supports larger algorithm implementations (e.g., multi-channel radar beamforming) but consumes ~25% more static power | Choose when XC6SLX100T-2FGG676C logic utilization exceeds 85% in final place-and-route |
| XC7A100T-2CSG324C | Artix-7 architecture, 101,440 logic cells, 4,860 Kbits BRAM, 240 DSP48E1 slices, 1.0 V core voltage | Offers higher DSP throughput and lower power, but requires migration to Vivado toolflow and new pinout | Consider for new designs prioritizing power efficiency and long-term roadmap continuity beyond Spartan-6 end-of-life |
Compared with XC6SLX100T-2FGG676C, the XC6SLX150T-2FGG676C delivers headroom for logic expansion without changing package or cooling, while the XC7A100T-2CSG324C provides architectural modernization at the cost of toolchain and layout revision.
Availability
XC6SLX100T-2FGG676C is available at Aetrix Electronics and suitable for industrial motor control, automated test equipment, and medical imaging interface applications requiring stable component supply and long-term manufacturing continuity.
Supply support for XC6SLX100T-2FGG676C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for data center, edge, and embedded markets.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable performance, low power, and seamless integration with microprocessors and analog subsystems.
FAQ
What is the maximum operating junction temperature for XC6SLX100T-2FGG676C?
The XC6SLX100T-2FGG676C has a maximum operating junction temperature of 100°C, validated per Xilinx DS162 (v1.7) specifications. Thermal design must ensure that under worst-case ambient and power dissipation conditions, the silicon junction does not exceed this limit. The FGG676 package includes an exposed thermal pad to facilitate heatsink attachment or PCB copper pour for thermal conduction.
Does XC6SLX100T-2FGG676C support JTAG boundary-scan testing?
Yes, XC6SLX100T-2FGG676C fully supports IEEE 1149.1 JTAG boundary-scan testing via dedicated TCK, TMS, TDI, TDO, and TRET pins. The device implements a 4-bit instruction register and supports INTEST, EXTEST, SAMPLE/PRELOAD, and BYPASS instructions. Boundary-scan capability is enabled after configuration and remains active during normal operation for in-system verification.
Can XC6SLX100T-2FGG676C be configured using a microcontroller over SPI?
Yes, XC6SLX100T-2FGG676C supports Slave Serial and Slave SelectMAP configuration modes, enabling direct programming by an external microcontroller via SPI or parallel bus. In Slave Serial mode, the microcontroller drives the CCLK and MOSI lines while reading MISO to verify configuration status. This method is widely used in field-upgradable embedded systems.
What configuration memory options are compatible with XC6SLX100T-2FGG676C?
XC6SLX100T-2FGG676C supports configuration from industry-standard SPI serial flash devices including Micron MT25QL, Spansion S25FL, and Macronix MX25L families. These flash parts must meet the timing and voltage requirements specified in Xilinx UG380 (v1.12), particularly regarding read latency, hold times, and VCCIO compatibility with bank 0.
Is XC6SLX100T-2FGG676C qualified for automotive applications?
No, XC6SLX100T-2FGG676C is rated for commercial and industrial temperature ranges (0°C to 85°C ambient, case temperature up to 100°C junction) and is not AEC-Q100 qualified. For automotive use, Xilinx offers the Spartan-6Q family (e.g., XC6SLX100T-2FGG676I) with extended temperature range (-40°C to 100°C) and additional reliability screening.
XC6SLX100T-2FGG676C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-2FGG676C FAQ
1.How can I place an order for XC6SLX100T-2FGG676C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FGG676C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FGG676C reliable?
The price and inventory of XC6SLX100T-2FGG676C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FGG676C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FGG676C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FGG676C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FGG676C?
XC6SLX100T-2FGG676C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FGG676C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FGG676C?
For technical support, including XC6SLX100T-2FGG676C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FGG676C requirements.
6.How does Aetrix verify that XC6SLX100T-2FGG676C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FGG676C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FGG676C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FGG676C?
All XC6SLX100T-2FGG676C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FGG676C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FGG676C part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FGG676C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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