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AMD XC6SLX100T-2FGG900C
- Part No.:
- XC6SLX100T-2FGG900C
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-2FGG900C.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:2,737
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Product details
Overview
XC6SLX100T-2FGG900C from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 18 Kbit block RAM, 220 DSP48A1 slices, and operates at -2 speed grade with 1.2 V core voltage. It is used in industrial video processing systems requiring deterministic latency and multi-channel I/O interfacing.
For engineers reviewing the XC6SLX100T-2FGG900C datasheet, pinout, applications, or equivalent options, key selection factors include I/O count (516 user I/O), thermal performance in FGG900 package, LVDS/PCIe Gen1 interface support, and configuration via SPI/BPI.
Technical Context
The XC6SLX100T-2FGG900C implements a configurable logic fabric based on 6-input LUTs and flip-flops, with dedicated routing for high-speed I/O standards including LVDS, SSTL, HSTL, and PCI Express Gen1. It integrates dual 10-bit ADCs and supports JTAG, Master SPI, and Slave SelectMAP configuration modes.
Its clocking architecture includes four DCMs (Digital Clock Managers) and one PLL for internal clock synthesis and jitter reduction, enabling synchronous operation across multiple I/O banks operating at different voltage levels (1.2 V, 1.8 V, 2.5 V, or 3.3 V).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational and sequential logic capacity for HDL implementation |
| Block RAM | 1,824 Kbits - provides on-chip memory for FIFOs, buffers, or lookup tables without external memory |
| DSP Slices | 220 × DSP48A1 - enables fixed-point arithmetic, filtering, and FFT operations at up to 250 MHz |
| User I/O Pins | 516 - supports high-density parallel interfaces such as DDR2/3, camera sensors, and display controllers |
| Speed Grade | -2 - guarantees timing closure at 500 MHz system clock with worst-case junction temperature of 85°C |
| Core Voltage | 1.2 V ±3% - defines power delivery requirements and impacts dynamic power consumption |
| I/O Standards | LVDS, SSTL, HSTL, PCI Express Gen1 - enables direct connection to high-speed serial and parallel peripherals |
Pinout & Package
The XC6SLX100T-2FGG900C is housed in a 900-pin Fine-Pitch Ball Grid Array (FBGA) package with 35 × 35 mm body size, 1.0 mm ball pitch, and RoHS-compliant lead-free finish. Thermal pad on underside improves heat dissipation under sustained logic utilization.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 output voltage supply - must match connected peripheral voltage (e.g., 3.3 V or 1.8 V) |
| P4 | IO_L1P_T0_0 | Differential input pair for bank 0 - supports LVDS, TMDS, or single-ended signaling |
| W19 | M0–M2 | Configuration mode select - sets boot source (SPI, BPI, or JTAG) at power-up |
| R17 | CCLK | Configuration clock input - driven externally during master SPI programming or internally by FPGA |
| Y16 | INIT_B | Open-drain status signal - low during configuration, high when configuration complete or error occurs |
| T18 | DONE | Open-drain configuration completion indicator - pulled high after successful bitstream loading |
Key Features
| Feature | Design Value |
|---|---|
| Dual 10-bit ADCs | On-die analog-to-digital conversion for monitoring supply voltages or board temperature without external ADC |
| Four DCMs + One PLL | Multi-domain clock management supporting phase alignment, frequency synthesis, and duty-cycle correction |
| ISE Design Suite Support | Full toolchain compatibility including synthesis, place-and-route, and bitstream generation for legacy designs |
| Multi-Voltage I/O Banks | Independent VCCO per bank allows simultaneous interfacing to 1.2 V, 1.8 V, 2.5 V, and 3.3 V peripherals |
| Configurable I/O Standards | Per-pin programmable drive strength, slew rate, and termination for signal integrity optimization |
Applications
| Industrial Machine Vision | Medical Imaging Interface |
|---|---|
Use Scenario: Real-time preprocessing of multi-sensor camera feeds in automated optical inspection equipment. IC Role / Device Role / Timing Role: FPGA acts as pixel-level pipeline processor and MIPI CSI-2 to parallel bridge with precise frame synchronization. Use Value: 516 user I/O enables concurrent connection to four 12-bit image sensors; DSP48A1 slices accelerate Sobel edge detection within 2 µs latency. | Use Scenario: High-reliability data aggregation from ultrasound transducer arrays and analog front-end modules. IC Role / Device Role / Timing Role: Configurable logic handles time-of-flight calculation, beamforming control, and PCIe Gen1 host interface. Use Value: On-chip ADC monitors bias voltages; DCM-based clock domain crossing ensures deterministic timing between analog sampling and digital processing blocks. |
| Avionics Data Concentrator | Test & Measurement Equipment |
Use Scenario: ARINC 429 and MIL-STD-1553 bus bridging in flight control subsystems with DO-254 compliance requirements. IC Role / Device Role / Timing Role: FPGA implements protocol engines, CRC generators, and deterministic arbitration logic with traceable RTL. Use Value: -2 speed grade guarantees timing closure under extended temperature range (-40°C to +100°C); dual configuration images support safe firmware updates. | Use Scenario: Modular signal generator with arbitrary waveform synthesis and real-time pattern triggering. IC Role / Device Role / Timing Role: Logic fabric generates synchronized multi-channel DAC control signals while managing USB 2.0 host communication. Use Value: Block RAM stores 16 Msample waveform buffers; LVDS outputs drive high-speed DACs with sub-nanosecond skew control. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based interface and processing applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-2FGG900C | 147,443 logic cells, 2,184 Kbits BRAM, same package and speed grade | Higher gate count supports larger state machines and more complex IP cores | Select when design requires >120K logic cells or additional DSP slices without changing PCB layout |
| XC7S100-2FTG900C | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, lower static power, no on-chip ADC | Improved power efficiency and newer toolchain (Vivado), but lacks dual ADC and requires migration effort | Choose for new designs prioritizing power/performance ratio and long-term roadmap support over legacy ADC integration |
Compared with XC6SLX100T-2FGG900C, the XC6SLX150T-2FGG900C offers scalable logic density in identical packaging, while the XC7S100-2FTG900C delivers architectural improvements and reduced power at the cost of ADC removal and toolchain transition.
Availability
XC6SLX100T-2FGG900C is available at Aetrix Electronics and suitable for industrial machine vision, medical imaging interface, and avionics data concentrator applications requiring stable component supply and long-lifecycle support.
Supply support for XC6SLX100T-2FGG900C includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues to support the Spartan-6 family for industrial and aerospace applications requiring proven reliability and long-term availability.
The Spartan-6 FPGA product line was designed for cost-sensitive, high-volume applications demanding balanced logic density, I/O flexibility, and low-power operation in extended temperature environments.
FAQ
What is the maximum supported I/O standard voltage for XC6SLX100T-2FGG900C?
The XC6SLX100T-2FGG900C supports I/O standards up to 3.3 V across its 12 configurable I/O banks. Each bank has independent VCCO supply, allowing mixed-voltage operation - for example, bank 0 at 3.3 V for legacy peripherals and bank 4 at 1.8 V for modern sensors. This capability is documented in the Spartan-6 FPGA SelectIO Resources User Guide (UG381 v1.12).
Does XC6SLX100T-2FGG900C include on-chip analog-to-digital converters?
Yes, the XC6SLX100T-2FGG900C integrates two 10-bit, 1 MSPS ADCs accessible via dedicated analog input pins (VP0/VN0 and VP1/VN1). These ADCs are intended for system monitoring tasks such as supply rail voltage measurement and die temperature estimation, not for high-fidelity signal acquisition.
What configuration modes does XC6SLX100T-2FGG900C support?
The XC6SLX100T-2FGG900C supports three primary configuration modes: Master SPI (internal clock drives external flash), Slave SelectMAP (external controller loads bitstream), and JTAG (boundary scan and debug). Mode selection is controlled by M0–M2 pins at power-up, and all modes are fully supported in Xilinx ISE 14.7.
Is XC6SLX100T-2FGG900C qualified for extended temperature operation?
Yes, the 'C' suffix in XC6SLX100T-2FGG900C denotes commercial temperature range (0°C to +85°C), while the 'I' variant (XC6SLX100T-2FGG900I) is rated for industrial range (−40°C to +100°C). Both share identical logic resources and pinout, differing only in screening and thermal specifications.
Can XC6SLX100T-2FGG900C interface directly with DDR2 SDRAM?
Yes, the XC6SLX100T-2FGG900C supports DDR2 SDRAM interfaces through its SelectIO resources and dedicated IDELAY/ODELAY primitives. Xilinx provides verified DDR2 PHY IP cores for ISE targeting this device, supporting data rates up to 400 Mbps per pin with calibrated read/write timing.
XC6SLX100T-2FGG900C Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- 0°C ~ 85°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-2FGG900C FAQ
1.How can I place an order for XC6SLX100T-2FGG900C through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FGG900C on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FGG900C reliable?
The price and inventory of XC6SLX100T-2FGG900C are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FGG900C is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FGG900C?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FGG900C transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FGG900C?
XC6SLX100T-2FGG900C orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FGG900C order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FGG900C?
For technical support, including XC6SLX100T-2FGG900C datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FGG900C requirements.
6.How does Aetrix verify that XC6SLX100T-2FGG900C is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FGG900C products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FGG900C meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FGG900C?
All XC6SLX100T-2FGG900C units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FGG900C, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FGG900C part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FGG900C:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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