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AMD XC6SLX100T-2FGG900I
- Part No.:
- XC6SLX100T-2FGG900I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 900-BBGA
- Datasheet:
-
XC6SLX100T-2FGG900I.pdf
- Description:
- IC FPGA 498 I/O 900FBGA
- Quantity:
- Payment:
- Shipping:
Inventory:4,624
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Product details
Overview
XC6SLX100T-2FGG900I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4.9 Mb of block RAM, 216 DSP48E1 slices, and operates at -2 speed grade with industrial temperature range (–40°C to +100°C). It is packaged in a 900-pin Fine-Pitch Ball Grid Array (FBGA) and used in industrial motor control systems requiring deterministic timing and I/O flexibility.
For engineers reviewing the XC6SLX100T-2FGG900I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (516 user I/Os), embedded memory capacity, DSP resource availability, and industrial-grade thermal performance.
Technical Context
The XC6SLX100T-2FGG900I implements a configurable logic fabric based on 6-input LUTs and flip-flops, supporting synchronous design with global clock networks and regional clock buffers. It integrates SelectIO technology supporting LVCMOS, LVDS, SSTL, and HSTL standards across its 516 user I/O pins.
Configuration is performed via Master SPI, Slave Serial, or JTAG modes using external PROM or processor-controlled interfaces. Built-in Digital Clock Managers (DCMs) provide clock synthesis, phase shifting, and frequency multiplication up to 320 MHz for internal logic and I/O timing.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - determines maximum combinational/sequential logic capacity for custom digital functions |
| User I/O Pins | 516 - supports high-channel-count interface bridging and multi-protocol peripheral connectivity |
| Block RAM | 4.9 Mb - enables local data buffering, FIFO implementation, and small lookup table storage |
| DSP Slices | 216 × DSP48E1 - delivers 18×25-bit multiply-accumulate operations per slice for real-time filtering |
| Speed Grade | -2 - guarantees timing closure up to 500 MHz system clock in critical paths under industrial conditions |
| Operating Temp | –40°C to +100°C - qualified for deployment in enclosed industrial enclosures without forced cooling |
| Package | 900-pin FGG900 (Fine-Pitch BGA, 31×31 mm, 1.0 mm pitch) - requires standard PCB reflow profile and 6-layer routing stackup |
Pinout & Package
The XC6SLX100T-2FGG900I is housed in a 900-ball Fine-Pitch Ball Grid Array (FGG900) package with 31×31 ball array, 1.0 mm pitch, and 3.0 mm body height. Pinout follows Xilinx Spartan-6 FPGA Pinout Guide DS162 (v3.3), with dedicated configuration, clock, JTAG, and I/O banks grouped by voltage and signaling standard.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G18 | CONFIG_DONE | Open-drain status signal indicating successful configuration completion; pulled high externally |
| H17 | INIT_B | Active-low open-drain output signaling configuration initialization or error condition |
| K19 | PROGRAM_B | Active-low input that resets configuration logic and clears internal SRAM upon assertion |
| P16 | CCLK | Configuration clock input for Master SPI mode; drives external PROM data transfer timing |
| T14 | TCK | JTAG test clock input; synchronizes boundary-scan and debug operations |
Key Features
| Feature | Design Value |
|---|---|
| Integrated DCMs | Two Digital Clock Managers per device providing jitter-tolerant clock synthesis and phase alignment for mixed-clock-domain designs |
| SelectIO Technology | Supports 18 I/O standards including LVDS DCI, enabling direct connection to ADCs, sensors, and industrial displays without level-shifting |
| Embedded Memory | 4.9 Mb distributed and block RAM allows dual-port RAM, shift registers, and boot code storage within fabric |
| Configurable Logic | 6-input LUTs with optional register packing deliver high logic utilization efficiency for control and datapath logic |
| Industrial Temp Rating | Qualified across –40°C to +100°C ambient ensures reliability in unventilated factory automation cabinets |
Applications
| Industrial Motor Control | Programmable Logic Controller (PLC) |
|---|---|
Use Scenario: Real-time PWM generation, encoder feedback processing, and safety interlock monitoring in servo drive modules. IC Role / Device Role / Timing Role: Configurable logic fabric executing closed-loop control algorithms with sub-microsecond latency. Use Value: XC6SLX100T-2FGG900I provides deterministic timing, 516 I/Os for multi-axis I/O expansion, and industrial temp rating for cabinet-mounted deployment. | Use Scenario: Modular I/O processing unit handling discrete inputs, analog conditioning, and fieldbus protocol translation (e.g., Modbus RTU to EtherCAT). IC Role / Device Role / Timing Role: FPGA-based protocol engine and I/O aggregator interfacing with microcontroller host over parallel bus or PCIe. Use Value: XC6SLX100T-2FGG900I delivers 216 DSP slices for real-time CRC and checksum offload, plus 4.9 Mb RAM for protocol buffer management. |
| Test & Measurement Equipment | Avionics Data Acquisition |
Use Scenario: High-speed digital pattern generator and acquisition subsystem in automated test equipment (ATE) for semiconductor validation. IC Role / Device Role / Timing Role: Timing-critical state machine coordinating multi-channel digital I/O with precise edge placement (±100 ps). Use Value: XC6SLX100T-2FGG900I supports 500 MHz internal clocks and LVDS I/O for 800 Mbps data capture, meeting ATE timing fidelity requirements. | Use Scenario: Ruggedized flight data recorder interface managing ARINC 429, MIL-STD-1553, and discrete sensor inputs in compact airborne units. IC Role / Device Role / Timing Role: Protocol bridge and fault-tolerant data concentrator with dual-redundant configuration support. Use Value: XC6SLX100T-2FGG900I offers industrial temperature operation, JTAG debug access, and radiation-tolerant configuration SRAM for avionics-grade reliability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FGG900I | Higher logic density (147,443 LCs), faster speed grade (-3), same package and I/O count | Better suited for complex motion control algorithms requiring additional pipeline stages or larger state machines | Select when design requires >100k LCs or tighter timing margins; higher power consumption and cost |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4.9 Mb BRAM, but 324-pin CSP package (fewer I/Os: 210) | Limited I/O count restricts use in high-channel-count industrial I/O modules | Choose for space-constrained designs where lower pin count and smaller footprint are prioritized over I/O scalability |
Compared with XC6SLX100T-2FGG900I, the XC6SLX150T-3FGG900I offers headroom for future feature expansion, while the XC7A100T-2CSG324I trades I/O count for reduced board area-making the XC6SLX100T-2FGG900I optimal for balanced I/O density, logic capacity, and industrial thermal robustness.
Availability
XC6SLX100T-2FGG900I is available at Aetrix Electronics and suitable for industrial motor control, programmable logic controller (PLC) modules, and test & measurement equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-2FGG900I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and continues development and support of the Spartan-6 FPGA family. Xilinx pioneered FPGA architecture for cost-sensitive, high-volume industrial applications.
The Spartan-6 family was designed for embedded vision, industrial automation, and communications infrastructure where low power, predictable timing, and long-term availability are essential.
FAQ
What is the maximum operating frequency supported by XC6SLX100T-2FGG900I?
The XC6SLX100T-2FGG900I is rated for a -2 speed grade, guaranteeing timing closure up to 500 MHz for internal logic paths under industrial temperature conditions. Actual achievable frequency depends on design complexity, routing, and clock domain structure. The integrated DCMs support output frequencies up to 320 MHz with jitter suppression, and I/O timing meets LVDS specifications up to 800 Mbps.
Does XC6SLX100T-2FGG900I support JTAG programming and debugging?
Yes, XC6SLX100T-2FGG900I fully supports IEEE 1149.1 JTAG boundary-scan and in-circuit configuration via TCK, TMS, TDI, and TDO pins. It enables device programming, SRAM content verification, and real-time debug access using Xilinx iMPACT or Vivado Hardware Manager. JTAG is active immediately after power-up and remains functional throughout operation.
What configuration modes are available for XC6SLX100T-2FGG900I?
XC6SLX100T-2FGG900I supports Master SPI, Slave Serial, and JTAG configuration modes. Master SPI uses an external serial PROM (e.g., XCFxx series) with CCLK-driven data transfer. Slave Serial allows host processor control via dedicated configuration pins. JTAG mode enables direct programming and debugging without external memory, ideal for prototyping and field updates.
Is XC6SLX100T-2FGG900I qualified for industrial temperature operation?
Yes, XC6SLX100T-2FGG900I carries the 'I' suffix denoting industrial temperature qualification (–40°C to +100°C). It undergoes extended burn-in and characterization across this range, ensuring reliable operation in unventilated control cabinets, factory-floor PLCs, and outdoor-rated test equipment without derating.
How many differential I/O pairs does XC6SLX100T-2FGG900I support?
XC6SLX100T-2FGG900I supports up to 258 differential I/O pairs (516 total user I/Os), subject to bank voltage and I/O standard constraints. LVDS, TMDS, and RSDS standards are supported with on-chip termination and differential swing control. Each pair must reside within the same I/O bank and share common VCCO and VREF settings per bank.
XC6SLX100T-2FGG900I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 900-BBGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 498
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 900-FBGA (31x31)
XC6SLX100T-2FGG900I FAQ
1.How can I place an order for XC6SLX100T-2FGG900I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-2FGG900I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-2FGG900I reliable?
The price and inventory of XC6SLX100T-2FGG900I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-2FGG900I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-2FGG900I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-2FGG900I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-2FGG900I?
XC6SLX100T-2FGG900I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-2FGG900I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-2FGG900I?
For technical support, including XC6SLX100T-2FGG900I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-2FGG900I requirements.
6.How does Aetrix verify that XC6SLX100T-2FGG900I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-2FGG900I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-2FGG900I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-2FGG900I?
All XC6SLX100T-2FGG900I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-2FGG900I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-2FGG900I part is unused and in its original packaging.
Return procedure for XC6SLX100T-2FGG900I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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