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AMD XC6SLX100T-3FG676I
- Part No.:
- XC6SLX100T-3FG676I
- Manufacturer:
- AMD
- Category:
- FPGAs (Field Programmable Gate Array)
- Package:
- 676-BGA
- Datasheet:
-
XC6SLX100T-3FG676I.pdf
- Description:
- IC FPGA 376 I/O 676FCBGA
- Quantity:
- Payment:
- Shipping:
Inventory:3,629
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Product details
Overview
XC6SLX100T-3FG676I from AMD (formerly Xilinx) is a Spartan-6 FPGA featuring 101,280 logic cells, 4,729 Kbits of block RAM, and support for DDR2/DDR3 memory interfaces. It operates at -3 speed grade (1.2 V core, industrial temperature range -40°C to +100°C) in a 676-pin Fine-Pitch BGA (FG676) package. Used in industrial motor control systems requiring deterministic I/O timing and embedded processing.
For engineers reviewing the XC6SLX100T-3FG676I datasheet, pinout, applications, or equivalent options, key selection criteria include logic density, I/O count (480 user I/Os), LVDS/PCIe Gen1 compatibility, and industrial-grade thermal performance.
Technical Context
The XC6SLX100T-3FG676I implements a configurable logic fabric with six-input LUTs, distributed RAM, and integrated DSP48A1 slices supporting 18×18-bit multiply-accumulate operations. It includes dedicated clock management tiles with DCMs and PLLs for jitter reduction and multi-phase clock synthesis.
It supports SelectIO standards including LVCMOS, LVDS, SSTL, and HSTL across 480 user-configurable I/O pins, with programmable slew rate and drive strength per bank. Configuration is performed via SPIx4 or JTAG, with dual-boot capability using internal configuration memory.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Logic Cells | 101,280 - provides sufficient resources for medium-complexity control + data-path logic in industrial gateways |
| Block RAM | 4,729 Kbits - enables local buffering of sensor streams or protocol packet assembly without external memory |
| User I/O Pins | 480 - supports high-channel-count analog/digital interface consolidation in PLC backplanes |
| Speed Grade | -3 - guarantees timing closure up to 500 MHz system clock in worst-case industrial conditions |
| Operating Temp | -40°C to +100°C - qualified for under-hood automotive ECUs and factory-floor motion controllers |
| Core Voltage | 1.2 V ±3% - requires tight-tolerance DC-DC regulation; compatible with standard 1.2 V PMIC rails |
Pinout & Package
Package: 676-ball Fine-Pitch BGA (FG676), 27 × 27 mm, 1.0 mm ball pitch, RoHS-compliant, thermal pad exposed on underside.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G1 | VCCO_0 | I/O bank 0 power supply - must be decoupled locally; supports 3.3/2.5/1.8/1.5 V standards |
| P2 | CLKIN_1 | Dedicated single-ended clock input - connects to crystal or oscillator for primary clock domain |
| AB3 | M0 | Configuration mode select - sets boot source (SPI/JTAG); pulled low for master SPI mode |
| U18 | INIT_B | Open-drain status output - asserts low during configuration failure or CRC error |
| Y17 | PROGRAM_B | Active-low asynchronous reset - forces reconfiguration and clears configuration memory |
Key Features
| Feature | Design Value |
|---|---|
| DSP48A1 Slices | 180 units - enable real-time FIR filtering and motor current loop computation without CPU intervention |
| Embedded PCIe Endpoint | Gen1 x1 hard IP - reduces latency and resource usage for host communication in test equipment |
| Multi-Voltage I/O Banks | 12 independent banks - allow concurrent interfacing to 3.3 V sensors, 1.8 V ADCs, and 2.5 V FPGAs |
| DCM & PLL Clock Management | 4 DCMs + 2 PLLs - generate synchronized clocks for ADC sampling, PWM generation, and Ethernet MAC timing |
Applications
| Industrial PLC Backplane Controller | Automotive ADAS Sensor Fusion Unit |
|---|---|
Use Scenario: Central logic unit in modular PLC chassis managing I/O expansion modules via parallel bus and serial backplane links. IC Role / Device Role / Timing Role: FPGA fabric implements protocol translation, cyclic redundancy checking, and deterministic scan-cycle arbitration. Use Value: 480 I/Os and -3 speed grade ensure sub-100 µs cycle time consistency across 32-slot chassis with hot-swap support. | Use Scenario: Aggregates radar, camera, and ultrasonic sensor data in Tier-1 ECU for pre-fusion preprocessing. IC Role / Device Role / Timing Role: Configurable logic handles timestamp alignment, ROI cropping, and CAN FD message packing before MCU handoff. Use Value: Industrial temp rating and 101K logic cells support real-time pixel-level filtering while meeting ASIL-B functional safety constraints. |
| Medical Imaging Data Pipeline | Test & Measurement Digital Pattern Generator |
Use Scenario: Real-time pipeline for ultrasound beamforming data - receives 128-channel ADC samples and applies delay-and-sum weighting. IC Role / Device Role / Timing Role: FPGA performs parallel channel compensation, FIR filtering, and DMA-controlled DDR3 buffering. Use Value: 4,729 Kbits block RAM enables full-frame line buffering; DSP48A1 slices deliver 1.2 GOPS for dynamic focusing calculations. | Use Scenario: High-speed digital stimulus generator for ASIC validation, producing multi-gigabit PRBS and custom waveform sequences. IC Role / Device Role / Timing Role: Logic fabric generates precise edge-aligned patterns; embedded PLLs lock to reference clock for <15 ps jitter. Use Value: LVDS-capable I/Os and -3 speed grade sustain 800 Mbps per lane across 480 pins for wide-bus parallel testing. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar FPGA-based control and interface applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| XC6SLX150T-3FG676I | 147,443 logic cells, 5,888 Kbits block RAM - higher density but same package and speed grade | Required for larger state machines or additional protocol stacks (e.g., EtherCAT + PROFINET) | Select when design exceeds XC6SLX100T-3FG676I resource utilization by >15% in post-place-and-route analysis |
| XC7A100T-2CSG324I | Artix-7 architecture, 101,440 logic cells, 4,915 Kbits block RAM, 225 user I/Os, smaller CSG324 package | Limited I/O count and no native PCIe Gen1 - suitable for compact, cost-sensitive designs with lower interface bandwidth | Choose for new designs prioritizing lower power and migration path to 7-series toolchain, accepting I/O and PCIe trade-offs |
Compared with XC6SLX100T-3FG676I, the XC6SLX150T-3FG676I offers headroom for feature expansion without PCB change, while the XC7A100T-2CSG324I trades I/O and hard IP for reduced footprint and static power - both require functional verification but no pinout redesign.
Availability
XC6SLX100T-3FG676I is available at Aetrix Electronics and suitable for industrial automation, medical imaging subsystems, and test equipment requiring stable component supply across extended product lifecycles.
Supply support for XC6SLX100T-3FG676I includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
AMD acquired Xilinx in 2022 and now develops adaptive computing platforms including FPGAs, adaptive SoCs, and AI engines for high-performance embedded and datacenter applications.
The Spartan-6 family was designed for cost-sensitive, high-volume applications demanding reliable I/O flexibility, low-power operation, and industrial temperature support - targeting industrial control, vision, and communications infrastructure.
FAQ
What is the maximum operating frequency of the XC6SLX100T-3FG676I?
The XC6SLX100T-3FG676I is rated at speed grade -3, guaranteeing timing closure up to 500 MHz for internal logic paths under worst-case industrial temperature and voltage conditions. Actual achievable frequency depends on design complexity, routing, and clock domain structure - verified via Vivado implementation tools and static timing analysis reports for the XC6SLX100T-3FG676I.
Does the XC6SLX100T-3FG676I support DDR3 memory interfaces?
Yes, the XC6SLX100T-3FG676I supports DDR3 SDRAM interfaces through its SelectIO technology and dedicated memory controller logic. It meets JEDEC DDR3 specifications up to 800 Mbps data rates per pin when used with appropriate board layout, termination, and PHY calibration - confirmed in Xilinx UG388 and DS162 documentation for the XC6SLX100T-3FG676I.
What configuration modes are supported by the XC6SLX100T-3FG676I?
The XC6SLX100T-3FG676I supports Master SPI, Slave Serial, Slave Parallel, and JTAG configuration modes. Mode selection is controlled by M0–M2 pins at power-up. Master SPI is most common for standalone operation using on-board flash; JTAG is used for debugging and programming during development - all modes are fully documented for the XC6SLX100T-3FG676I in Xilinx UG380.
Is the XC6SLX100T-3FG676I qualified for automotive applications?
The XC6SLX100T-3FG676I carries an industrial temperature rating (-40°C to +100°C) and is used in automotive ADAS sensor fusion units, though it is not AEC-Q100 qualified. For production automotive ECUs requiring qualification, designers must perform system-level validation per ISO 26262 ASIL-B requirements - this applies specifically to the XC6SLX100T-3FG676I in thermal and EMC stress testing.
How many DSP slices does the XC6SLX100T-3FG676I contain?
The XC6SLX100T-3FG676I contains 180 DSP48A1 slices, each capable of 18×18-bit signed multiplication with optional accumulator and pipeline stages. These are used for filtering, motor control algorithms, and real-time signal processing - a fixed architectural feature of the XC6SLX100T-3FG676I as defined in DS162.
XC6SLX100T-3FG676I Specifications
- Product attributes
- Attribute value
- Manufacturer:
- AMD
- Series:
- Spartan®-6 LXT
- Package/Case:
- 676-BGA
- Packaging:
- Tray
- Product Status:
- Active
- Programmable:
- Not Verified
- Number of LABs/CLBs:
- 7911
- Number of Logic Elements/Cells:
- 101261
- Total RAM Bits:
- 4939776
- Number of I/O:
- 376
- Number of Gates:
- -
- Voltage - Supply:
- 1.14V ~ 1.26V
- Mounting Type:
- Surface Mount
- Operating Temperature:
- -40°C ~ 100°C (TJ)
- Grade:
- -
- Qualification:
- -
- Supplier Device Package:
- 676-FBGA (27x27)
XC6SLX100T-3FG676I FAQ
1.How can I place an order for XC6SLX100T-3FG676I through Aetrix?
Please submit a Request for Quotation (RFQ) for XC6SLX100T-3FG676I on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for XC6SLX100T-3FG676I reliable?
The price and inventory of XC6SLX100T-3FG676I are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for XC6SLX100T-3FG676I is usually 5 days.
3.What payment methods are accepted for XC6SLX100T-3FG676I?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for XC6SLX100T-3FG676I transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for XC6SLX100T-3FG676I?
XC6SLX100T-3FG676I orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your XC6SLX100T-3FG676I order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for XC6SLX100T-3FG676I?
For technical support, including XC6SLX100T-3FG676I datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your XC6SLX100T-3FG676I requirements.
6.How does Aetrix verify that XC6SLX100T-3FG676I is sourced from the original manufacturer or authorized distributors?
All XC6SLX100T-3FG676I products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that XC6SLX100T-3FG676I meets industry standards.
7.What is the process for return or replacement of XC6SLX100T-3FG676I?
All XC6SLX100T-3FG676I units undergo pre-shipment inspection (PSI). If there is an issue with XC6SLX100T-3FG676I, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The XC6SLX100T-3FG676I part is unused and in its original packaging.
Return procedure for XC6SLX100T-3FG676I:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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